δ掺杂对Si衬底GaN蓝光LED外延膜性能的影响研究

用X射线衍射方法通过不同晶面的ω扫描测试,分析了Si衬底GaN蓝光LED外延膜中n-型层δ掺杂Si处理对外延膜结晶性能的影响。报道了Si衬底GaN外延膜系列晶面的半峰全宽(FWHM)值。通过使用晶格旋转(Lattice-rotation)模型拟合,计算出样品的螺位错密度和刃位错密度。结果表明,δ掺杂Si处理后生长出的样品螺位错密度增大、刃位错密度减小,总位错密度有所减小。通过对未经δ掺杂处理和δ掺杂处理的GaN外延膜相应ω-2θ扫描半峰全宽值的比较,发现δ掺杂Si处理后生长出的样品非均匀应变较大;相应样品的LED电致发光光谱I、-V特性曲线显示δ掺杂后样品性能变好。     

基于MOCVD三步生长的GaAs/Si外延技术EI北大核心CSCD

在硅(Si)上外延生长高质量的砷化镓(GaAs)薄膜是实现硅基光源单片集成的关键因素。但是,Si材料与GaAs材料之间较大的晶格失配、热失配等问题对获得高质量的GaAs薄膜造成了严重影响。本文利用金属有机化学气相沉积(MOCVD)技术开展Si基GaAs生长研究。通过采用三步生长法,运用低温成核层、高温GaAs层与循环热退火等结合的方式,进一步降低Si基GaAs材料的表面粗糙度和穿透位错密度。并利用X射线衍射(XRD)ω-2θ扫描追踪采用不同方法生长的样品中残余应力的变化。最终,在GaAs低温成核层生长时间62 min(生长厚度约25 nm)时,采用三步生长、循环热退火等结合的方式获得GaAs(004)XRD摇摆曲线峰值半高宽(FWHM)为401″、缺陷密度为6.8×10^(7) cm^(-2)、5μm×5μm区域表面粗糙度为6.71 nm的GaAs外延材料,在材料中表现出张应力。     

Si(001)衬底上闪锌矿ZnO的制备与分析

采用分子束外延方法在室温下于Si(001)表面上生长ZnO材料。实验发现:样品为闪锌矿和六角结构的ZnO混合多晶薄膜,其表面分布着一系列具一定取向的近似长方形的纳米台柱结构。在不同参数的高温退火后,这些梯形台柱将变小,形成梯形纳米环,或分解为较小的纳米柱及其团簇结构等。分析表明:ZnO混合多晶薄膜的形成,以及表面纳米台柱的演变,与Si(001)衬底、较低温的生长温度及热效应等因素相关联。     

The influence of AlN/GaN superlattice intermediate layer on the properties of GaN grown on Si（111） substrates

AlN/GaN superlattice buffer is inserted between GaN epitaxial layer and Si substrate before epitaxial growth of GaN layer. High-quality and crack-free GaN epitaxial layers can be obtained by inserting AlN/GaN superlattice buffer layer. The influence of AlN/GaN superlattice buffer layer on the properties of GaN films are investigated in this paper. One of the important roles of the superlattice is to release tensile strain between Si substrate and epilayer. Raman spectra show a substantial decrease of in-plane tensile strain in GaN layers by using AlN/GaN superlattice buffer layer. Moreover, TEM cross-sectional images show that the densities of both screw and edge dislocations are significantly reduced. The GaN films grown on Si with the superlattice buffer also have better surface morphology and optical properties.     

Si(001)面上外延生长的Ru2 Si3电子结构及光学性质研究

基于第一性原理的赝势平面波方法,对异质外延关系为Ru2Si3(100)//Si(001),取向关系为Ru2Si3[010]//Si[110]正交相的Ru2Si3平衡体系下能带结构、态密度和光学性质等进行了理论计算.计算结果表明:当1.087 nm≤a≤1.099 nm时,正交相Ru2Si3的带隙值随着晶格常数a取值的增大而增大.当a取值为1.093 nm时,体系处于稳定状态,此时Ru2Si3是具有带隙值为0.773 eV的直接带隙半导体.Ru2Si3价带主要是由Si的3p,3s态电子及Ru 4d态电子构成;导带主要由Ru的4d及Si的3p态电子构成.外延稳定态及其附近各点处Ru2Si3介电函数的实部和虚部变化趋势基本一致,但外延稳定态Ru2Si3介电函数的曲线相对往低能区漂移,出现的介电峰减少且峰的强度明显增强.     

Influence of silicon cluster on epitaxial growth of silicon carbide

Precursor concentration dependences of growth rate, doping concentration and surface morphology have been investigated in the epitaxial growth of 4H-SiC(0001) epilayers with horizontal hot-wall CVD system using various precursor concentrations under constant C/Si ratio. Form the experimental data it is found that silicon cluster which is formed through gas phase nucleation plays an important role in controlling the doping concentration and epitaxial growth rate of the silicon carbide. It was observed that t...     

Self-assembled growth of nanostructural Ge islands on bromine-passivated Si(111) surfaces at room temperature

We have deposited relatively thick (∼60 nm) Ge layers on Br-passivated Si(111) substrates by thermal evaporation under high vacuum conditions at room temperature. Ge has grown in a layer-plus-island mode although it is different from the Stranski-Krastanov growth mode observed in epitaxial growth. Both the islands and the layer are nanocrystalline. This appears to be a consequence of reduction of surface free energy of the Si(111) substrate by Br-passivation. The size distribution of the Ge nanoislands has been determined. The Br-Si(111) substrates were prepared by a liquid treatment, which may not produce exactly reproducible surfaces. Nevertheless, some basic features of the nanostructural island growth are reasonably reproducible, while there are variations in the details of the island size distribution.     

New tetramer structures in the initial process of Si homoepitaxial growth on Si (0 0 1)

We have studied the interaction between Si ad-dimers in the initial process of Si homoepitaxial growth on Si (0 0 1) surface by molecular dynamics simulations using the Stillinger-Weber potential. The interactions determine the formation of larger clusters from diffusing dimers. We show different pathways for the formation of multiple-dimer clusters and propose two new tetramer structures (T_BB and T_CC) formation by two diffusing dimers interacting. These tetramer structures have been found to be energetically stable with respect to isolated ad-dimers. Moreover, their local bonding configuration is very similar to the B-type step edge which is known to be the favored adsorption site for epitaxial growth. The proposed tetramers may play a crucial role as the nucleus of the new epitaxial layer on Si (0 0 1).     

SiC based Si/SiC heterojunction and its rectifying characteristics

The Si on SiC heterojunction is still poorly understood, although it has a number of potential applications in electronic and optoelectronic devices, for example, light-activated SiC power switches where Si may play the role of an light absorbing layer. This paper reports on Si films heteroepitaxially grown on the Si face of (0001) n-type 6H-SiC substrates and the use of B₂H_6 as a dopant for p-Si grown at temperatures in a range of 700--950~\du. X-ray diffraction (XRD) analysis and transmission electron microscopy (TEM) tests have demonstrated that the samples prepared at the temperatures ranged from 850~℃ to 900~℃ are characterized as monocrystalline silicon. The rocking XRD curves show a well symmetry with FWHM of 0.4339° Omega. Twin crystals and stacking faults observed in the epitaxial layers might be responsible for widening of the rocking curves. Dependence of the crystal structure and surface topography on growth temperature is discussed based on the experimental results. The energy band structure and rectifying characteristics of the Si/SiC heterojunctions are also preliminarily tested.     

Molecular beam epitaxy and reconstructed surfaces

In the last years molecular beam epitaxy (MBE) has become a very important method to create new materials. Scattering and channeling of high-energy ions is a mass-dispersive, surface-sensitive crystallographic technique, particularly suited for the investigation of epitaxial systems. The combination of both techniques allows new insight into some of the fundamental processes at interfaces and surfaces. As an example we discuss the influence of substrate reconstruction on epitaxial growth. We show for the Si/Ge and Si/Si systems that the reordering of the reconstruction-induced displacements at the substrate surface, a necessary condition for epitaxial growth, is critically dependent on the type of reconstruction: Deposition of Ge or Si on Si(100)2×1 at room-temperature relieves the reconstruction, whereas Si(111)7×7 appears unaffected. This difference is discussed in terms of structural models for these surfaces. We shall also discuss the implications of these results with respect to MBE and, in particular, to Si homoepitaxial temperatures.     

GaN grown on Si(1 1 1) with step-graded AlGaN intermediate layers

The authors report the growth of crack-free GaN on Si(1 1 1) substrate with step-graded AlGaN intermediate layers all grown at 1120 °C. By preparing all these layers at high-temperature, we can simplify the growth proceduce and minimize the growth time. Using X-ray diffraction and transmission electron microscopy, it was found that the high-temperature step-graded AlGaN intermediate layers can effectively reduce the tensile stress on GaN epitaxial layers. Photoluminescence and Raman measurements also indicate that we can improve the crystal quality of GaN by inserting the step-graded AlGaN intermediate layers.     

SiGe/Si异质结缺陷的光致发光研究

本文用光致发光(PL)光谱对Si0.87Ge0.13/Si异质结的缺陷进行了研究。对PL光谱中与SiGe外延层应变驰豫产生的失配位错相关的D-Band进行了分析,发现应变驰豫同时在SiGe层和Si衬底中诱生了位错。由于在PL光谱中观察到了D1而没有观察到D2,因此D1,D2很可能并不对应于相同的位错。通过进一步的分析,我们推测引起SiGe/Si异质结的PL光谱中D-Band的位错的微观结构很可能和Si-Si相关。     

Structure and optoelectronic properties of Si/O superlattice

We have carried out structural study of the Si/O semiconductor atomic superlattices (SAS) with up to 18 Si/O layers fabricated by molecular beam epitaxy and in situ oxygen exposure on both Sb-doped and undoped Si buffer layers, and correlated the results with our photoluminescence, electroluminescence (EL) and I–V data. The Si/O SAS is a new type of superlattice, where monolayers of oxygen are sandwiched between the Si layers. High-resolution cross-sectional transmission electron microscopy (TEM) study has confirmed the presence of the superlattice and shown epitaxy in the Si/O superlattices. The high structural quality of the layers grown on the undoped Si buffer layers with low density of stacking faults—less than 10⁷/cm²—was established by TEM. Although structure perfection is very important allowing this new class of superlattices to be extended to other systems, it is important to point out that a 9-period SAS-based EL device with emission of light in green has been life-tested with stable output for over 1 year of continuous operation. The Si/O superlattice also serves as an epitaxially grown insulating layer as possible replacement of silicon-on-insulator. Together with the tailor-made effective band gap, this epitaxially grown superlattice may serve as future silicon-based three-dimensional integrated circuits.     

离子注入的铝在Si(100)表面的偏析及其引起的纳米团簇和合金晶粒形成现象的实验研究

通过高温退火注入了铝的Si(100)样品,探讨偏析出来的铝在硅表面的热力学行为.由900℃的退火实验发现,偏析出来的铝原子一方面形成Si(100)基底的外延铝膜和铝岛,另一方面与硅原子结合形成尺度约为2—3nm的铝硅团簇.而1200℃的退火实验显示,铝和硅的快速冷凝形成了立方晶系的Al₄Si合金晶粒、尺度约为20—30nm.细小的铝硅团簇在结构上独立于样品基底并且趋于聚集成团,很可能是在高温退火和快速降温过程中形成铝硅合金晶粒的前驱. 关键词： 硅表面 铝掺杂 团簇 4Si')" href="#">Al₄Si     

GaAs衬底上生长的GaInP_2外延单晶薄膜的杂质污染研究

各种外延技术已被用来在ＧａＡｓ衬底上生长ＧａｘＩｎ１－ｘＰ外延单晶薄膜（ＧａＩｎＰ２／ＧａＡｓ）．很多文献认为,在ＧａＩｎＰ２／ＧａＡｓ生长过程中会被Ｃ杂质污染．我们用高灵敏的ＣＡＭＥＣＡＩＭＳ４Ｆ型二次离子质谱仪直接测量的结果表明,污染ＧａＩｎＰ２／ＧａＡｓ的微量杂质是Ｓｉ,而不是Ｃ．由ＧａＩｎＰ２／ＧａＡｓ在１．１７ｅＶ附近的光致发光峰的峰值随激发强度的变化形状表明了它应属于施主－受主对复合发光．进一步分析表明,施主为处在Ｇａ格位上的Ｓｉ杂质（ＳｉＧａ）,受主为Ｇａ空位（ＶＧａ）．     

温度对Si衬底上低压MOCVD外延生长ZnS薄膜质量的影响

用低压MOCVD系统在(111)Si衬底上,用两步生长方法(改变/流量比)在300～400℃时外延生长了ZnS单晶薄膜。随着衬底温度的降低,ZnS薄膜结晶质量提高,并在300℃生长时获得结晶完整性较好的(111)ZnS单晶薄膜。文中讨论了衬底温度对薄膜质量的影响。     

Structural and morphological characterisation of hybrid Cu/Si(0 0 1) structures

The structural and morphological properties of epitaxial Cu/Si(0 0 1) type of structures have been investigated by a combination of electron, X-ray and scanning probe imaging techniques. Auger electron spectroscopy measurements indicate the presence of Si in the Cu layer for Cu thicknesses up to 10 nm. In addition, X-ray scattering results show that there is a mosaic spread in the Cu(0 0 1) crystal which decreases as the Cu thickness increases, from 8° at 15 nm to 4.5° at 100 nm. This behaviour is corroborated by reflection high energy electron diffraction patterns of the Cu surface measured during growth, which exhibit a twinning in the diffraction spots for the 15 and 30 nm Cu films. Atomic force and scanning electron microscopy imaging of Cu(4 nm)/Co(7,17 nm)/Cu(100 nm)/Si(0 0 1) structures allow one to visualise and characterise the sample surface in real space; from these measurements, an average roughness amplitude of ∼0.5 nm and a correlation length of ∼50 nm are obtained. Our results provide a better understanding of an important system which has been widely used as a template for the growth of epitaxial ultrathin magnetic films.     

Semiconductor solar cells: Recent progress in terrestrial applications

In the last decade, the photovoltaic industry grew at a rate exceeding 30% per year. Currently, solar-cell modules based on single-crystal and large-grain polycrystalline silicon wafers comprise more than 80% of the market. Bulk Si photovoltaics, which benefit from the highly advanced growth and fabrication processes developed for microelectronics industry, is a mature technology. The light-to-electric power conversion efficiency of the best modules offered on the market is over 20%. While there is still room for improvement, the device performance is approaching the thermodynamic limit of ∼28% for single-junction Si solar cells. The major challenge that the bulk Si solar cells face is, however, the cost reduction. The potential for price reduction of electrical power generated by wafer-based Si modules is limited by the cost of bulk Si wafers, making the electrical power cost substantially higher than that generated by combustion of fossil fuels. One major strategy to bring down the cost of electricity generated by photovoltaic modules is thin-film solar cells, whose production does not require expensive semiconductor substrates and very high temperatures and thus allows decreasing the cost per unit area while retaining a reasonable efficiency. Thin-film solar cells based on amorphous, microcrystalline, and polycrystalline Si as well as cadmium telluride and copper indium diselenide compound semiconductors have already proved their commercial viability and their market share is increasing rapidly. Another avenue to reduce the cost of photovoltaic electricity is to increase the cell efficiency beyond the Shockley–Queisser limit. A variety of concepts proposed along this avenue forms the basis of the so-called third generation photovoltaics technologies. Among these approaches, high-efficiency multi-junction solar cells based on III–V compound semiconductors, which initially found uses in space applications, are now being developed for terrestrial applications. In this article, we discuss the progress, outstanding problems, and environmental issues associated with bulk Si, thin-film, and high-efficiency multi-junction solar cells.     

First-principles study of the segregation of boron dopants near the interface between crystalline Si and amorphous SiO2

We investigate the stability of boron dopants near the interface between crystalline Si and amorphous SiO₂ through first-principles density functional calculations. An interstitial B is found to be more stable in amorphous SiO₂ than in Si, so that B dopants tend to segregate to the interface. When defects exist in amorphous SiO₂, the stability of B is greatly enhanced, especially around Si floating bond defects, while it is not significantly affected near Si–Si dimers, which are formed by O-vacancy defects.     

Theoretical analysis of thermal rectification in a bulk Si/nanoporous Si device

We present a theoretical analysis of thermal rectification in a porous Si/bulk Si device, taking into account ballistic effects in phonon-pore collisions when phonon mean free path is much longer than the radius of the pores. Starting from an approximate analytical expression for the effective thermal conductivity of porous Si, we obtain the thermal rectifying coefficient of the device as a function of porosity, pore size, temperature interval, and relative lengths of porous and bulk samples.