共查询到20条相似文献,搜索用时 15 毫秒
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《Components and Packaging Technologies, IEEE Transactions on》2006,29(3):502-507
With the progress of printed circuit technology, the reliability of bulk insulation has become important, as well as that of surface insulation, particularly in multilayer boards and embedded boards. We observed the space charge behavior of various insulating materials used in printed circuit boards, and found that internal charges move in aramid/epoxy specimens under dc electric fields. The electric field near the surface of the specimen, therefore, was increased to have more than twice the strength of the average applied field. The space charge profile was influenced by the internal structure, and its formation was accelerated by the increase of temperature. Since the space charge profile affects the internal electric field distribution, the internal charge behavior should be examined with respect to the design of the insulation of a printed circuit board. 相似文献
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采用周期性边界条件的二维准静电PIC粒子模拟程序对空间电荷波的产生及传播过程进行了数值模拟,给出了静止和一维定向漂移空间电荷波的产生及传播特性随等离子体参数变化的关系,通过单电子跟踪的方法,得到了波动过程带电粒子的空间状态的变化规律。其结果,将作为进一步实现空间电荷波与电磁波产生波一波相互作用过程模拟的基础。 相似文献
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Dao-Hong Yang Chen J.F. Jian-Hsing Lee Kuo-Ming Wu 《Electron Device Letters, IEEE》2008,29(8):895-897
In this letter, the dynamic turn-on mechanism of the n-MOSFET under high-current-stress event is investigated by using a real-time current and voltage measurement. Results reveal the existence of ldquoself-consistent effect,rdquo i.e., the turn-on region of the parasitic n-p-n bipolar can change from one region to another region and increases with the stress current (ID). Furthermore, experimental data show that the minimum substrate potential to sustain a stable snapback phenomenon is 0.9 V and increases with ID instead of 0.6-0.8 V and independent of ID as reported in early literatures. 相似文献
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The enhanced stability of Pd/Ti contacts to p-type SiC under high-current-density continuous direct-current (DC) stressing is investigated and compared with previous work
on Ti/Al contacts. Additionally, differing failure modes were observed for the Pd/Ti contacts under continuous DC and pulsed
DC stress. The improved stability of the Pd/Ti contacts is demonstrated through a 29% increase in the applied continuous DC
current required to cause electrical failure during a 1 h test compared with the Ti/Al contacts. The metallization scheme
includes a TiW barrier and a thick electroplated Au overlayer. While severe intermixing and voiding in the ohmic contact layer
caused the Pd/Ti contacts to fail under continuous DC stress, electromigration of the Au overlayer degraded the contacts under
pulsed DC stress. The temperature of the surface of the contacts was reduced from over 649°C for contacts that failed under
continuous DC current to between 316°C and 371°C for pulsed DC current. The difference in temperature and failure modes of
the continuous and pulsed DC stressed contacts indicates different failure mechanisms. 相似文献
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提高射频功率器件的鲁棒性有利于增强器件的抗静电放电能力和抗失配能力.为了直观地了解器件内部发生的电学过程,本文研究了高鲁棒性N型沟道RF-LDMOS(Radio Frequency Lateral Diffusion MOS)在TLP(Transmission Line Pulse)应力下的电学机理.利用0.18μm BCD(Bipolar/CMOS/DMOS)先进制程,实现了特定尺寸器件的设计与流片.通过实测与仿真的对比,发现静电放电失效的随机性、芯片内部的热效应是导致仿真和实测差异的非理想因素.通过对TLP仿真的各阶段重要节点的分析,证明了源极下方的P型埋层有利于提高空穴电流的泄放能力,从而提高RF-LDMOS的鲁棒性. 相似文献
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The dynamic characteristics of the push-pull dc to dc converter are analyzed both theoretically and experimentally for the modes of operation which are caused by the interaction between magnetizing current of the transformer and that of the reactor. Among all six modes of operation, four modes are of the first-order system. In two out of the four modes, the instantaneous reactor current does not fall to zero at any point in the switching cycle. 相似文献
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Hatzopoulos A.T. Arpatzanis N.. Tassis D.H. Dimitriadis C.A. Templier F.. Oudwan M.. Kamarinos G.. 《Electron Device Letters, IEEE》2007,28(9):803-805
Bottom-gated n-channel thin-film transistors (TFTs) were fabricated using hydrogenated amorphous-silicon (a-Si:H)/ nanocrystalline silicon (nc-Si:H) bilayers as channel materials, which are deposited by plasma-enhanced chemical vapor deposition at low temperatures. The stability of these devices is investigated under static and dynamic bias stress conditions. For comparison, the stability of a-Si:H and nc-Si:H single-layer TFTs is investigated under similar bias stress conditions. The overall results demonstrate that the a-Si:H/nc-Si:H bilayer TFTs are superior compared with their counterparts of a-Si:H and nc-Si:H TFTs regarding device performance and stability. 相似文献
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Chia‐Chin Chen Edvinas Navickas Jürgen Fleig Joachim Maier 《Advanced functional materials》2018,28(15)
Composites of ion and electron conducting phases allow for interfacial storage of a neutral component via space charge effects. The present contribution considers the rate of transport‐controlled incorporation and excorporation in such artificial mixed conductors. The upper limit of the relaxation time is determined by interfacial job‐sharing diffusion which is analyzed in greater detail. In general cases bulk phases assist by migration processes (dual phase transport). For more complex morphological situations, the considerations are complemented by numerical calculations. Thus the treatment also offers a pertinent approach with respect to the kinetics of solid state supercapacitors. Selected experimental results are included in the discussion. 相似文献
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对TLP(传输线脉冲)应力下深亚微米GGNMOS器件的特性和失效机理进行了仿真研究. 分析表明,在TLP应力下,栅串接电阻减小了保护结构漏端的峰值电压;栅漏交迭区电容的存在使得脉冲上升沿加强了栅漏交叠区的电场,栅氧化层电场随着TLP应力的上升沿减小而不断增大,这会导致栅氧化层的提前击穿. 仿真显示,栅漏交迭区的电容和栅串接电阻对GGNMOS保护器件的开启特性和ESD耐压的影响是巨大的. 该工作为以后的TLP测试和标准化提供了依据和参考. 相似文献
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对TLP(传输线脉冲)应力下深亚微米GGNMOS器件的特性和失效机理进行了仿真研究.分析表明,在TLP应力下,栅串接电阻减小了保护结构漏端的峰值电压;栅漏交迭区电容的存在使得脉冲上升沿加强了栅漏交叠区的电场,栅氧化层电场随着TLP应力的上升沿减小而不断增大,这会导致栅氧化层的提前击穿.仿真显示,栅漏交迭区的电容和栅串接电阻对GGNMOS保护器件的开启特性和ESD耐压的影响是巨大的.该工作为以后的TLP测试和标准化提供了依据和参考. 相似文献
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为使空间相机获得清晰准确的地面目标图像,相机需要依据结构变化对焦面位置进行调整。如果空间相机可以在轨快速对目标景物连续调焦,通过地面下传图像准确判断出最优焦面位置,将会极大提高空间相机的工作质量和效率。为验证连续调焦方法的可行性,提出了一种地面仿真测试方法。采用动态目标发生器和平行光管模拟相机在轨对地面目标成像。应用计算机系统作为目标发生器远程控制、数据处理、信息发送和接收设备,空间相机实时接收飞行器模拟设备发送的命令和工程参数,完成模拟在轨连续调焦。试验结果表明,所设计的系统能够依据图像判断最优焦面位置,满足设计和测试要求。 相似文献