Self-formation of dielectric layer containing CoSi2 nanocrystals by plasma-enhanced atomic layer deposition

Dielectric layer containing CoSi₂ nanocrystals was directly fabricated by plasma-enhanced atomic layer deposition using CoCp₂ and NH₃ plasma mixed with SiH₄ without annealing process. Synchrotron radiation X-ray diffraction and X-ray photoelectron spectroscopy results confirmed the formation of CoSi₂ nanocrystal. The gate stack composed of dielectric layer containing CoSi₂ nanocrystals with ALD HfO₂ capping layer together with Ru metal gate was analyzed by capacitance–voltage (C–V) measurement. Large hysteresis of C–V curves indicated charge trap effects of CoSi₂ nanocrystals. The current process provides simple route for the fabrication of nanocrystal memory compatible with the current Si device unit processes.     

Influence of solution conditions on deposition of calcium phosphate on titanium by NaOH-treatment

The present paper demonstrated a biomimetic method to coat calcium phosphate (Ca-P) on the surface of titanium induced by NaOH-treatment from a simple supersaturated hydroxyapatite solution (SHS). The influence of pH value and calcium ions concentration on the precipitation process was investigated. It is necessary for the solution to be supersaturated than the critical concentration of octacalcium phosphate (OCP) to get Ca-P coatings on titanium surface. In the precipitating process, it seems that amorphous calcium phosphate (ACP) precipitated first, then OCP, and finally hydroxyapatite (HA). The system was in continuous evolution and the phase transitions occurred in sequence.     

Synthesis of nanosized TiO2 powder by sol gel method at low temperature

ABSTRACT

Nanotechnology is all about making products from very small constituents, components or subsystems to gain greatly enhanced material properties and functionality. Nanocrystalline anatase TiO₂ was prepared by a facile sol–gel route at a temperature of 50°C under mild conditions. Titanium tetraisopropoxide (TTIP) was used as a titanium precursor, and 2-propanol was used as a solvent. XRD, TEM, SEM, FT-IR and BET were applied to characterize the crystal phase. The Crystalline size of TiO₂ powder has been obtained with diameter < 30 nm for anatase at 500°C using an acid.     

XPS and electroluminescence studies on SrS1−xSex and ZnS1−xSex thin films deposited by atomic layer deposition technique

SrS_1−xSe_x and ZnS_1−xSe_x thin films were deposited by the atomic layer deposition (ALD) technique using elemental selenium as the Se source, thus avoiding use of H₂Se or organometallic selenium compounds. X-ray diffraction (XRD) analysis showed that the films were solid solutions and X-ray photoelectron spectroscopy (XPS) data showed that the surface of both ZnS_1−xSe_x and SrS_1−xSe_x were covered with an oxide and carbon-containing contaminants from exposure to air. The oxidation of SrS_1−xSe_x extended into the film and peak shifts from sulfate were found on the surface. Luminance measurements showed that emission intensity of the ZnS_1−xSe_x:Mn alternating current thin film electroluminescent (ACTFEL) devices at fixed voltage was almost the same as that of the ZnS:Mn device, while emission intensity of the SrS_1−xSe_x:Ce devices decreased markedly as compared to the SrS:Ce device. Emission colors of the devices were altered only slightly due to selenium addition.     

Photoelectrical properties of crystalline titanium dioxide thin films after thermo‐annealing

This paper reports the photoelectrical properties of sol gel derived titanium dioxide (TiO₂) thin films annealed at different temperatures (425‐900°C). The structure of the as‐grown film was found to be amorphous and it transforms to crystalline upon annealing. The trap levels are studied by thermally stimulated current (TSC) measurements. A single trap level with activation energy of 1.5 eV was identified. The steady state and transient photocurrent was measured and the results are discussed on the basis of structural transformation. The photocurrent was found to be maximum for the films annealed at 425°C and further it decreases with annealing at higher temperatures. The photoconduction parameters such as carrier lifetime, lifetime decay constant and photosensitivity were calculated and the results are discussed as a function of annealing temperature. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Cracking assisted nucleation in chemical vapor deposition of silicon nanoparticles on silicon dioxide

Deposition of sub-monolayer silicon on SiO₂/Si(1 0 0) greatly facilitates nucleation in subsequent thermal chemical vapor deposition (CVD) of silicon nanoparticles. Sub-monolayer seeding is accomplished using silicon atoms generated via disilane decomposition over a hot tungsten filament. The hot-wire process is nonselective towards deposition on silicon and SiO₂, is insensitive to surface temperature below 825 K, and gives controlled coverages well below 1 ML. Thermal CVD of nanoparticles at 1×10⁻⁴ Torr disilane and temperatures ranging from 825 to 925 K was studied over SiO₂/Si(1 0 0) surfaces that had been subjected to predeposition of Si or were bare. Seeding of the SiO₂ surface with as little as 0.01 ML is shown to double the nanoparticle density at 825 K, and densities are increased twenty fold at 875 K after seeding the surface with 30% of a monolayer.     

Effect of NH3 on the growth characterization of TiN films at low temperature

Titanium nitride (TiN) films were obtained by the atmospheric pressure chemical vapor deposition method of the TiCl₄–N₂–H₂ system with various flow rates of NH₃ at 600°C. The growth characteristics, morphology and microstructure of the TiN films deposited were analyzed by X-ray diffraction, scanning electron microscopy and transmission electron microscopy. Without NH₃ addition, no TiN was deposited at 600°C as shown in the X-ray diffraction curve. However, by adding NH₃ into the TiCl₄–N₂–H₂ system, the crystalline TiN was obtained. The growth rate of TiN films increased with the increase of the NH₃ flow rate. The lattice constant of TiN films decreased with the increase of the NH₃ flow rate. At a low NH₃ flow rate, the TiN (2 2 0) with the highest texture coefficient was found. At a high NH₃ flow rate, the texture coefficient of TiN (2 0 0) increased with the increase of the NH₃ flow rate. In morphology observation, thicker plate-like TiN was obtained when the NH₃ flow rate was increased. When the flow rate of NH₃ was 15 sccm, Moiré fringes were observed in the TiN film as determined by TEM analysis. The intrinsic strain was found in the TiN film as deposited with 60 sccm NH₃.     

MOVPE growth of GaAs on Ge substrates by inserting a thin low temperature buffer layer

High quality GaAs layers have been grown by low pressure MOVPE on Ge(001) and Ge(001) 9° off oriented in [110] direction by using a thin low temperature (LT) GaAs layer. Investigations of the initial growth step were performed at different V/III ratios and temperatures. To show the good buffer layer quality solar cell structures were grown on off oriented n‐Ge(001) and n‐GaAs(001) substrates. The surface morphology was studied by atomic force microscopy which showed the step‐flow growth mode on 1.2 µm thick GaAs/Ge structures. The crystalline qualities of this structures and the smooth surface morphology were investigated by double crystal X‐ray diffraction (XRD) and atomic force microscopy (AFM). (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Dependence of chemical composition and bonding of amorphous SiC on deposition temperature and the choice of substrate

Amorphous SiC has superior mechanical, chemical, electrical, and optical properties which are process dependent. In this study, the impact of deposition temperature and substrate choice on the chemical composition and bonding of deposited amorphous SiC is investigated, both 6 in. single-crystalline Si and oxide covered Si wafers were used as substrates. The deposition was performed in a standard low-pressure chemical vapour deposition reactor, methylsilane was used as the single precursor, and deposition temperature was set at 600 and 650 °C. XPS analyses were employed to investigate the chemical composition, Si/C ratio, and chemical bonding of deposited amorphous SiC. The results demonstrate that these properties varied with deposition temperature, and the impact of substrate on them became minor when deposition temperature was raised up from 600 °C to 650 °C. Nearly stoichiometric amorphous SiC with higher impurity concentration was deposited on crystalline Si substrate at 600 °C. Slightly carbon rich amorphous SiC films with much lower impurity concentration were prepared at 650 °C on both kinds of substrates. Tetrahedral Si-C bonds were found to be the dominant bonds in all deposited amorphous SiC. No contribution from Si-H/Si-Si but from sp² and sp³ C-C/C-H bonds was identified.     

Fractal slice model analysis for effective thermal conductivity and temperature distribution of porous crystal layer via layer crystallization

A fractal slice model was established based on the reported model to predict the effective thermal conductivity of a porous crystal layer via layer crystallization. The temperature distribution of the crystal layer was obtained by the fractal slice method. The simulation results agreed with the experimental data better than the other theoretical models. The results were helpful to enhance the thermal transport by mitigating the thermal resistance effectively.     

The effect of ZnO buffer layer on structural and optical properties of ZnO nanorods

A low‐temperature synthetic route was used to prepare oriented arrays of ZnO nanorods on ITO conducting glass substrate coated with buffer layer of ZnO seeds in an aqueous solution. The corresponding growth behavior and optical properties of ZnO nanorod arrays were studied. It was found that the nature of the buffer layer had effect on the microstructures and optical properties of the resultant ZnO nanorod arrays. X‐ray diffraction (XRD) results showed the nanorods were preferentially grown along (002) direction, but the diameter of the nanorods prepared with the buffer layer was much smaller than the without one, which can be clearly seen from the scanning electron microscopy (SEM) results. And it also found that the buffer layer was not only enhanced the density of overall coverage but also beneficial to grown the oriented arrays. Photoluminescence spectroscopy (PL) results indicated that the all the samples had the better optical behaviors. By computation, the relative PL intensity ratio of ultraviolet emission (I_UV) to deep level emission (I_DLE) of ZnO nanorods grown with the pure substrate was much higher than that of the sample with the buffer layer. The defects on the surface increased with the size reduction of nanorods caused by the buffer layer may be the main reason for it. And the small shift in the UV emission was caused by the rapid reduction in crystal size and compressive stress from Raman spectra results. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Fabrication of nano-crystalline silicon thin film at low temperature by using a neutral beam deposition method

Low temperature (<80 °C) neutral beam deposition (LTNBD) was investigated as a new approach to the fabrication and development of nano-crystalline silicon (nc-Si), which has better properties than that of amorphous silicon (α-Si). The difference between LTNBD and conventional PECVD is that the film formation energy of the nc-Si in LTNBD is supplied by controlled neutral beam energies at a low temperature rather than by heating. Especially, in this study, the characteristics of the nc-Si thin film were investigated by adding 10% of an inert gas such as Ne, Ar or Xe to SiH₄/H₂. Increasing the beam energy resulted in an increase in the deposition rate, but the crystallinity was decreased, due to the increased damage to the substrate. However, the addition of a higher mass inert gas to the gas mixture at a fixed beam energy resulted not only in a higher deposition rate but also in a higher crystallization volume fraction. The high resolution transmission electron microscopy image showed that the grown film is composed of about 10 nm-size grains.     

Hybrid observation of crystal growth using laser confocal microscope with atomic force microscope

We built up a hybrid microscope system that consists of an atomic force microscope (AFM) and a laser confocal microscope with differential interference contrast microscope (LCM-DIM) and investigated the combined imaging of a potassium dihydrogen phosphate (KDP) crystal surface and its growth. Using this integrated setup, we were able to approach a AFM cantilever tip to several-ten μm$\mathrm{\mu }\mathrm{m}$ crystals using an optical microscope with AFM and to observe steps with measuring the height using LCM-DIM/AFM. Evaluation of the accuracy of the setup was studied and resulted in less than 100 nm of the AFM tip accuracy using LCM-DIM/AFM. We also demonstrated an in-situ observation of a KDP crystal growth using LCM-DIM/AFM. The interference fringes at the cantilever and the movements of steps were simultaneously observed.     

MOCVD of titanium dioxide on the basis of new precursors

Thin films with a considerably higher dielectric constant than silicon dioxide, for example titanium dioxide or titanium containing barium strontium titanate, can be used for dielectrics in ultralarge scale integration devices. TiO₂ shows, besides its high dielectric constant, a sufficiently low leakage current and high breakdown field strength. MOCVD is the most promising method for depositing those dielectrics because of its obvious advantages like homogeneity of films, good step coverage and ultrathin film deposition. In this work, three new precursor chemicals have been developed and tested in a low pressure horizontal cold wall-type furnace. For the synthesis of the novel precursors, commercial titaniumisopropylate is brought to an reaction with an alcoholic compound at 150 °C and distilled under vacuum. The motivation for the development of new Ti precursors lies in an improvement of the handling and deposition characteristics as for example the hydrolytic stability. For the three precursors the deposition parameters temperature, pressure, gas flow and activation energy is presented. The electrical properties dielectric constant and leakage current were compared to commercially available titaniumisopropylate.     

Effects of growth temperature on the properties of ZnO/GaAs prepared by metalorganic chemical vapor deposition

A series of ZnO films were grown on GaAs(0 0 1) substrates at different growth temperatures in the range 250–720°C by metalorganic chemical vapor depostion. Field emission scanning electron microscopy was utilized to investigate the surface morphology of ZnO films. The crystallinity of ZnO films was investigated by the double-crystal X-ray diffractometry. The optical and electrical properties of ZnO films were also investigated using room-temperature photoluminescence and Hall measurements. Arrhenius plots of the growth rate versus reciprocal temperature revealed the kinetically limited growth behavior depending on the growth temperature. It was found that the surface morphology, structural, optical and electrical properties of the films were improved with increasing growth temperature to 650°C. All the properties of the film grown at 720°C were degraded due to the decomposition of ZnO film.     

The influence of the Al pre-deposition on the properties of AlN buffer layer and GaN layer grown on Si (1 1 1) substrate

The influence of Al pre-deposition on the properties of AlN buffer layer and GaN layer grown on Si (1 1 1) substrate by metalorganic chemical vapor deposition (MOCVD) has been systematically studied. Compared with the sample without Al pre-deposition, optimum Al pre-deposition time could improve the AlN buffer layer crystal quality and reduce the root mean square (RMS) roughness. Whereas, overlong Al-deposition time deteriorated the AlN crystal quality and Al-deposition patterns could be found. Cracks and melt-back etching patterns appeared in the GaN layer grown without Al pre-deposition. With suitable Al-deposition time, crack-free 2.0 μm GaN was obtained and the full-width at half-maximum (FWHM) of (0 0 2) plane measured by double crystal X-ray diffraction (DCXRD) was as low as 482 arcsec. However, overlong Al-deposition time would result in a great deal of cracks, and the crystal quality of GaN layer deteriorated. The surface of GaN layer became rough in the region where the Al-deposition patterns were formed due to overlong Al-deposition time.     

Influence of hydrogen on SiO2 thick film deposited by PECVD and FHD for silica optical waveguide

Silicon dioxide (SiO₂) thick films have been deposited by plasma enhanced chemical vapor deposition (PECVD) and flame hydrolysis deposition (FHD). PECVD SiO₂ films were obtained at low temperatures (<350 °C) by the decomposition of the appropriate mixture of (SiH₄+N₂O) gases under suitable rf power and N₂O/SiH₄ ratio. For low N₂O/SiH₄ ratio, a refractive index(n) value close to 1.50 is obtained. The deposition rate increased with the increase of rf power. FHD SiO₂ films were produced by the flame hydrolysis reaction of halide materials such as SiCl₄, POCl₃ and BCl₃ in an oxy‐hydrogen torch. The porous SiO₂ layer, under the POCl₃/BCl₃ ratio deposition condition, has to be consolidated by annealing at around 1300 °C.     

Three‐dimensional flow in a thin annular layer of silicon melt with bidirectional temperature gradients

Bidirectional temperature gradients coexist virtually in surface tension driven flows. However, the simulations have been performed to the flow with only one temperature gradient. A series of 3 D numerical simulations are conducted to investigate the Marangoni‐thermocapillary flow of silicon melt in a thin annular layer with bidirectional temperature gradients. The temperature gradients are produced by the temperature difference ΔT between walls and the constant heat flux q on the bottom, respectively. When changing q, the melt presents different state evolutions at different ΔT. Furthermore, two critical q are found, one makes the minimum melt temperature higher than the crystallization temperature and the other makes the flow unsteady. Both of the critical heat fluxes decrease with increasing ΔT. q contributes more to the elevation of the melt temperature, while ΔT contributes more to the enhancement of the melt instability. In addition, the melt on the free surface flows mainly along the radial direction.