DISTURBANCE DUE TO MECHANICAL SOURCES IN MICROPOLAR ELASTIC MEDIUM WITH VOIDS

The dynamic response of a homogeneous isotropic micropolar half-space with voids subjected to a set of normal point sources is investigated. The integral transforms have been inverted by using a numerical technique to obtain the normal force stress, normal displacement, tangential force stress, tangential couple stress and volume fraction field in the physical domain for the two different sources. The results of these quantities for a magnesium crystal-like material are given and illustrated.     

Cu互连应力迁移温度特性研究

提出了一种基于扩散-蠕变机制的空洞生长模型, 结合应力模拟计算和聚焦离子束分析技术研究了Cu互连应力诱生空洞失效现象, 探讨了应力诱生空洞的形成机制并分析了空洞生长速率与温度、应力梯度和扩散路径的关系. 研究结果表明, 在Cu M1互连顶端通孔拐角底部处应力和应力梯度达到极大值并观察到空洞出现. 应力梯度是决定空洞成核位置及空洞生长速率的关键因素. 应力迁移是空位在应力梯度作用下沿主导扩散路径进行的空位积聚与成核现象, 应力梯度的作用与扩散作用随温度变化方向相反, 并存在一个中值温度使得应力诱生空洞速率达到极大值. 关键词： Cu互连 应力迁移 应力诱生空洞 失效     

Atomic collision cascades on void evolution in vanadium

Molecular dynamics simulations were performed to study void evolution subject to unidirectional self-bombardment and radiation-induced variation of mechanical properties in single crystalline vanadium. 3D simulation cells of perfect body-centered cubic (BCC) vanadium, as well as those with one, two, four, and six voids, were investigated. For the no void case, the maximum number of defects, maximum volumetric swelling, and the number of defects left in bulk after a sufficiently long recovery period increased with higher primary recoil energy. For the cases containing voids, a primary recoil energy was carefully assigned to an atom so as to initiate a dense collision spike in the voids center, where some self-interstitial atoms gained kinetic energy by secondary replacement collision sequence traveling along the ? 111? direction. It is found that the larger or the greater the number of voids contained initially in the box, the larger the normalized void volume, and the smaller the volumetric swelling after sufficient recovery of systems. In the single void case, the void became elongated along the bombarding direction; in the multiple void cases, the voids coalesced only when the intervoid ligament distance was short. After sufficient relaxation of the irradiated specimen, a hydrostatic tension was exerted on the box, where the voids were treated as dislocation sources. It is shown that with higher primary recoil energy, the yield stress dropped in cases with smaller or fewer voids but rose in those with larger or greater number of voids. This radiation-induced softening to hardening transition with increasing dislocation density can be attributed to the combined effects of the defect-induced dislocation nucleation and the resistance of defects to dislocation motion. Moreover, as the primary recoil energy increased, the ductility of vanadium in the no void case decreased, but was only slightly changed in the cases containing void.     

冲击加载下铝中氦泡和孔洞的塑性变形特征研究

通过分子动力学模拟研究了在相同冲击加载强度下单晶铝中氦泡和孔洞的塑性变形特征,结果发现氦泡和孔洞的塌缩是由发射剪切型位错环引起的,而没有观测到棱锥型位错环发射. 氦泡和孔洞周围的位错优先成核位置基本一致,但是氦泡周围发射的位错环数目比孔洞多,位错环发射速度明显比孔洞快. 且氦泡和孔洞被冲击波先扫过部分比后扫过部分发射位错困难. 通过滑移面上的分解应力分析发现,氦泡和孔洞周围塑性特征的差别是由于氦泡内压引起最大分解应力分布改变造成的. 氦泡和孔洞被冲击波先后扫过部分塑性不对称是因为冲击波扫过时引起形状变化, 关键词： 分子动力学 冲击波 氦泡 孔洞     

冲击加载下孔洞贯通的微观机理研究

利用分子动力学方法计算模拟了沿〈100〉晶向冲击加载下单晶铜中双孔洞的贯通过程.发现孔洞周围发射剪切型位错环是孔洞塌缩和增长的原因.在拉伸阶段,孔洞首先分别独立增长,随后其周围塑性变形区开始交叠和相互作用,最后两个孔洞开始直接贯通.这种贯通模式和实验对延性材料中孔洞贯通过程的显微观察结果一致.对四种不同θ值（θ为两个孔洞中心连线与冲击加载方向之间的夹角）的模型分别进行了计算模拟,发现在相同的冲击加载强度下,θ＝0°和θ＝30°的孔洞之间没有相互贯通; 关键词： 纳米孔洞 分子动力学 冲击加载 贯通     

设计脆性材料的冲击塑性

通过微结构设计提升脆性功能材料的冲击塑性, 将有助于避免或延缓失效的发生. 提出在脆性材料中植入特定的微小孔洞以改善其冲击塑性的设计方法. 采用一种能够定量表现脆性材料力学性质的格点-弹簧模型, 研究了孔洞排布方式对脆性材料冲击响应的影响. 孔洞随机排布的多孔脆性材料具有明显高于致密脆性材料的冲击塑性, 而设计规则的孔洞排布方式将有助于进一步提升脆性材料的冲击塑性. 对150 m/s活塞冲击下气孔率5%的多孔样品的介观变形特征分析表明, 孔洞规则排布的样品中孔洞贯通和体积收缩变形占主导, 而孔洞随机排布的样品中剪切裂纹长距离扩展和滑移与转动变形占主导. 尽管在宏观的Hugoniot应力-应变曲线上, 两种孔洞排布方式的样品都表现出三段式响应特征(线弹性阶段、塌缩变形阶段和滑移与转动变形阶段), 但孔洞规则排布时孔洞塌缩变形阶段对整体冲击塑性的贡献更大. 研究揭示的规则排布孔洞增强脆性材料冲击塑性的原理, 将有助于脆性材料冲击诱导功能失效的预防.     

Nd：YAG板条激光增益介质封装技术研究进展北大核心CSCD

为实现大尺寸、高储能的Nd:YAG板条激光增益介质模块的高可靠性工作,必须找到合适的封装工艺解决大尺寸无空洞、低热阻界面连接问题和界面低应力、低透射波前畸变问题。在充分了解板条激光增益介质和冷却单元的特性后,选择了延展性好的铟作为焊料,实验得到最佳焊料层厚度,通过改进封装工艺的钎焊技术将这两部分可靠地连接在一起。改进的封装工艺实现了钎焊面积大于40cm2,空洞率小于0.5%,最大空洞面积小于1mm2的技术指标,工艺重复性大于90%。通过对焊料层的优化实现了尺寸为150.2mm×30mm×2.5mm板条激光增益介质静态透射波前畸变小于1μm,成品率优于80%,静态透射波前畸变小于1.5μm的模块成品率接近100%的技术指标。采用改进封装工艺焊接的单模块Nd:YAG板条激光器稳定输出功率达到4000 W。     

Nd:YAG板条激光增益介质封装技术研究进展

为实现大尺寸、高储能的Nd:YAG板条激光增益介质模块的高可靠性工作,必须找到合适的封装工艺解决大尺寸无空洞、低热阻界面连接问题和界面低应力、低透射波前畸变问题。在充分了解板条激光增益介质和冷却单元的特性后,选择了延展性好的铟作为焊料,实验得到最佳焊料层厚度,通过改进封装工艺的钎焊技术将这两部分可靠地连接在一起。改进的封装工艺实现了钎焊面积大于40 cm2,空洞率小于0.5%,最大空洞面积小于1 mm2的技术指标,工艺重复性大于90%。通过对焊料层的优化实现了尺寸为150.2 mm30 mm2.5 mm板条激光增益介质静态透射波前畸变小于1 m,成品率优于80%,静态透射波前畸变小于1.5 m的模块成品率接近100%的技术指标。采用改进封装工艺焊接的单模块Nd:YAG板条激光器稳定输出功率达到4000 W。     

Void effect on mechanical properties of copper nanosheets under biaxial tension by molecular dynamics method

The relationship between void size/location and mechanical behavior under biaxial loading of copper nanosheets containing voids are investigated by molecular dynamics method. The void location and the void radius on the model are discussed in the paper. The main reason of break is discovered by the congruent relationship between the shear stress and its dislocations. Dislocations are nucleated at the corner of system and approached to the center of void with increased deformation. Here, a higher stress is required to fail the voided sheets when smaller voids are utilized. The void radius influences the time of destruction. The larger the void radius is, the lower the shear stress and the earlier the model breaks. The void location impacts the dislocation distribution.     

面心立方铜晶体中空洞生长与贯通的尺寸效应

利用分子动力学方法模拟沿拉伸方向排布的两个空洞在单轴拉伸作用下的动力学行为.着重研究不同尺寸空洞对其拉伸贯通过程的影响.结果表明,不同尺度的空洞都是通过空洞表面发射位错环长大与贯通的.空洞在弹性阶段沿加载方向缓慢长大,在塑性阶段沿垂直方向生长后形成类八面体形状.随空洞尺寸的减小,临界屈服应力逐渐增大.当半径较大时,位错对称成核、迁移,空洞沿加载方向被拉长,演化过程相似;当半径较小时,位错不对称成核,空洞沿垂直方向被拉长.空洞生长分为弹性变形、独立长大、融合贯通和平稳生长四个阶段.独立生长阶段随尺寸的减小逐渐缩短甚至消失.     

Thermoelastic vibrations in micro-/nano-scale beam resonators with voids

In this paper the closed form expressions for the transverse vibrations of a homogenous isotropic, thermoelastic thin beam with voids, based on Euler-Bernoulli theory have been derived. The effects of voids, relaxation times, thermomechanical coupling, surface conditions and beam dimensions on energy dissipation induced by thermoelastic damping in (micro-electromechanical systems) MEMS/(nano-electromechanical systems) NEMS resonators are investigated for beams under clamped and simply supported conditions. Analytical expressions for deflection, temperature change, frequency shifts and thermoelastic damping in the beam have been derived. Some numerical results with the help of MATLAB programming software in case of magnesium like material have also been presented. The computer simulated results in respect of damping factor and frequency shift have been presented graphically.     

Flow pattern defects in germanium-doped Czochralski silicon crystals

The distribution and etching rate of flow pattern defects (FPDs) in germanium- doped Czochralski (GCZ) silicon (Si) wafers with light and heavy dopants—either boron (B) or phosphorus (P)—have been investigated. In the lightly doped (both B and P) Czochralski (CZ) Si crystals, the FPD densities in GCZ Si decrease with the increase of Ge concentration. In the heavily B-doped GCZ Si crystals, the FPDs are denser compared with the heavily B-doped CZ Si, whereas the reverse is true in the heavily P-doped GCZ Si and CZ Si crystals. It is also shown that the etching rates in the lightly doped CZ Si crystals can be slightly enlarged by the Ge doping. It is proposed that, in lightly doped GCZ Si, Ge doping could consume free vacancies and thus form high-density but small-sized voids, while the stress compensation induced by B and Ge atoms could increase the vacancy concentration in heavily B-doped GCZ Si, leading to sparse and large-sized voids.     

强冲击载荷下含杂质的纯铝中微孔洞长大的动力学行为

采用LS-DYNA瞬态动力学有限元程序,对平板撞击加载下含初始杂质的纯铝样品中微孔洞的成核与长大进行了数值模拟。结果表明:微孔洞首先在杂质与基体的边界处成核,随后在局部严重塑性变形驱动下快速线性增长;微孔洞半径的增长速率与冲击加载强度两者之间近似成线性关系;材料屈服强度和初始杂质的大小对微孔洞相对的增长速率有明显的影响;当微孔洞长大阈值取屈服强度的3.5倍时,数值仿真结果与理论分析结果基本一致,这有助于进一步认识孔洞长大的动力学行为。     

Elastic constants of Ultrasonic Additive Manufactured Al 3003-H18

Ultrasonic Additive Manufacturing (UAM), also known as Ultrasonic Consolidation (UC), is a layered manufacturing process in which thin metal foils are ultrasonically bonded to a previously bonded foil substrate to create a net part. Optimization of process variables (amplitude, normal load and velocity) is done to minimize voids along the bonded interfaces. This work pertains to the evaluation of bonds in UAM builds through ultrasonic testing of a build’s elastic constants. Results from ultrasonic testing on UAM parts indicate orthotropic material symmetry and a reduction of up to 48% in elastic constant values compared to a control sample. The reduction in elastic constant values is attributed to interfacial voids. In addition, the elastic constants in the plane of the Al foils have nearly the same value, while the constants normal to the foil direction have much different values. In contrast, measurements from builds made with Very High Power Ultrasonic Additive Manufacturing (VHP UAM) show a drastic improvement in elastic properties, approaching values similar to that of bulk aluminum.     

Surface morphological response of crystalline solids to mechanical stresses and electric fields

Surface morphological evolution under the action of external fields is a fascinating topic that has attracted considerable attention within the surface science community over the past two decades. In addition to the interest in a fundamental understanding of field-induced nonlinear response and stability of surface morphology, the problem has been technologically significant in various engineering applications such as microelectronics and nanofabrication. In this report, we review theoretical progress in modeling the surface morphological response of stressed elastic solids under conditions that promote surface diffusion and of electrically conducting solids under surface electromigration conditions. A self-consistent model of surface transport and morphological evolution is presented that has provided the basis for the theoretical and computational work that is reviewed. According to this model, the surface morphological response of electrically conducting elastic solids to the simultaneous action of mechanical stresses and electric fields is analyzed. Emphasis is placed on metallic surfaces, including surfaces of voids in metallic thin films.Surfaces of stressed elastic solids are known to undergo morphological instabilities, such as the Asaro–Tiller or Grinfeld (ATG) instability that leads to emanation of crack-like features from the surface and their fast propagation into the bulk of the solid material. This instability is analyzed theoretically, simulated numerically, and compared with experimental measurements. The surface morphological evolution of electrically conducting, single-crystalline, stressed elastic solids under surface electromigration conditions is also examined. We demonstrate that, through surface electromigration, a properly applied and sufficiently strong electric field can stabilize the surface morphology of the stressed solid against both crack-like ATG instabilities and newly discovered secondary rippling instabilities; the effects of important parameters, such as surface crystallographic orientation, on the surface morphological response to the simultaneous action of an electric field and mechanical stress also are reviewed. In addition, electromigration-driven surface morphological response is analyzed systematically, focusing on the current-driven surface morphological evolution of voids in metallic thin films; this analysis has been motivated largely by the crucial role of void dynamics in determining the reliability of metallic interconnects in integrated circuits and has led to the interpretation of a large body of experimental observations and measurements. The electromigration-driven translational motion of morphologically stable voids, effects of current-driven void dynamics on the evolution of the electrical resistance of metallic thin films, and current-driven void–void interactions also are reviewed. Furthermore, theoretical studies are reviewed that demonstrated very interesting current-driven nonlinear void dynamics in stressed metallic thin films, including the inhibition of electromigration-induced instabilities due to the action of biaxial tensile stress, and stress effects on the electromigration-driven translational motion of morphologically stable voids.Complex, oscillatory surface states under surface electromigration conditions have been observed in numerical studies. In this report, emphasis is placed on void surfaces in metallic thin films, for which stable time-periodic states have been demonstrated. It is shown that increasing parameters such as the electric-field strength or the void size past certain critical values leads to morphological transitions from steady to time-periodic states; the latter states are characterized by wave propagation on the surface of a void that migrates along the metallic film at constant speed. The transition onset corresponds to a Hopf bifurcation that may be either supercritical or subcritical, depending on the symmetry of the surface diffusional anisotropy as determined by the crystallographic orientation of the film plane. It is also shown that, in the case where the Hopf bifurcation is subcritical, the simultaneous action of mechanical stress leads the current-driven void morphological response to the stabilization of chaotic attractors; in such cases, as the applied stress level increases, the void dynamics is set on a route to chaos through a sequence of period-doubling bifurcations. The observation of current-driven chaotic dynamics in homoepitaxial islands also is discussed.     

Three-dimensional phase field microelasticity theory of a multivoid multicrack system in an elastically anisotropic body: Model and computer simulations

The phase field microelasticity theory of a three-dimensional, elastically anisotropic system of voids and cracks is proposed. The theory is based on the equation for the strain energy of the continuous elastically homogeneous body presented as a functional of the phase field, which is the effective stress-free strain. It is proved that the stress-free strain minimizing the strain energy of this homogeneous modulus body fully determines the elastic strain and displacement of the body with voids and/or cracks. The proposed phase field integral equation describing the elasticity of an arbitrary system of voids and cracks is exact. The geometry and evolution of multiple voids and/or cracks are described by the phase field, which is the solution of the time-dependent Ginzburg-Landau equation. Other defects, such as dislocations and precipitates, are trivially integrated into this theory. The proposed model does not impose a priori constraints on possible void and crack configurations or their evolution paths. Examples of computations of elastic equilibrium of systems with voids and/or cracks and the evolution of cracks under applied stress are considered.     

高应变率压缩下纳米孔洞对金属铝塑性变形的影响研究

本文利用分子动力学模拟方法研究了含纳米孔洞金属铝在[110]晶向高应变率单轴压缩下弹塑性变形的微观过程. 对比单孔洞和完整单晶的模型, 讨论了多孔金属的应力应变关系及其位错发展规律. 研究结果表明, 对于多孔模型的位错积累过程, 位错密度随应变的增加可大致分为两个线性阶段. 由同一个孔洞生成的位错在相互靠近过程中, 其滑移速度越来越小; 随着位错继续滑移, 源自不同孔洞的位错之间开始交叉相互作用导致应变硬化. 达到流变峰应力之后又由于位错密度增殖速率升高发生软化. 当应变增加到11.8%时, 所有孔洞几乎完全坍缩, 并观察到在此过程中有棱位错生成.     

Influence of Defects and Crystallographic Orientation on Mechanical Behavior of Nanocrystalline Aluminium

Simulation of molecular dynamics using Embedded Atom Method (EAM) potentials is performed to investigate the mechanical properties of single crystal Al along various crystallographic orientations under tensile loading. The specimens are provided with one or two embedded circular voids to analyze the damage evolution by void growth and coalescence. The simulation result shows that the Young's modulus, yielding stress and ultimate stress decrease with the emergence of the voids. Besides, the simulations show that the single-crystal Al in different crystallographic orientations behaves differently in elongation deformations. The single-crystal Al with <100> crystallographic orientations has greater ductility than other orientated specimens. The incipient plastic deformation and the stress-strain curves are presented and discussed for further understanding of the mechanical properties of single-crystal Al.     

加载应力幅值对高纯铜动态损伤演化特性研究

研究了加载应力幅值对延性金属高纯无氧铜动态损伤演化特性的影响. 层裂实验在一级轻气炮上开展, 利用不同的飞片击靶速度实现不同加载应力幅值(2.5 GPa, 2.75 GPa和3.75 GPa), 采用DISAR位移干涉诊断技术测量样品自由面的速度剖面, 利用基于白光轴向色差的表面轮廓测试技术测试软回收的样品截面. 结果显示: 随着加载应力幅值的升高, 层裂强度几乎没有变化, 但自由面速度剖面上Pull back信号后的回跳速率和幅值显著增大, 损伤演化速率显著升高.进一步分析表明: 延性金属动态损伤演化过程中微孔洞成核对加载应力幅值单一因素不敏感, 但加载应力幅值是微孔洞长大和聚集的主导因素之一.     

Void ordering in hexagonal close-packed metals

Voids occur in solids exposed to high-temperature particle irradiation. In hexagonal metals with lattice-parameter ratiosc/a which are smaller than for ideal close-packing, voids arranged in layers parallel to the basal plane have been observed after high-dose irradiation, whereas more perfect void ordering, e.g. the formation of void lattices like in cubic metals, has not been found. In this paper it is shown that it is the two-dimensional diffusion of self-interstitial atoms in the basal plane which gives rise to the layer-type arrangement of voids. The possibility of other void-ordering phenomena in hexagonal metals is investigated. It is demonstrated that, under certain circumstances, one-dimensional diffusion of a metastable self-interstitial configuration may lead to the arrangement of voids in columns perpendicular to the basal plane.