GaN/AlN quantum dot photodetectors at 1.3–1.5 μm

We have demonstrated GaN/AlN quantum dots (QD) photodetectors, relying on intraband absorption and in-plane carrier transport in the wetting layer. The devices operate at room temperature in the wavelength range 1.3–1.5 μm. Samples with 20 periods of Si-doped GaN QD layers, separated by 3 nm-thick AlN barriers, have been grown by plasma-assisted molecular-beam epitaxy on an AlN buffer on a c-sapphire substrate. Self-organized dots are formed by the deposition of 5 monolayers of GaN under nitrogen-rich conditions. The dot height is 1.2±0.6 to 1.3±0.6 nm and the dot density is in the range 10¹¹–10¹² cm⁻². Two ohmic contacts were deposited on the sample surface and annealed in order to contact the buried QD layers. The dots exhibit TM polarized absorption linked to the s–p_z transition. The photocurrent at 300 K is slightly blue-shifted with respect to the s–p_z intraband absorption. The responsivity increases exponentially with temperature and reaches a record value of 10 mA/W at 300 K for detectors with interdigitated contacts.     

Properties of Si-doped GaN and AlGaN/GaN heterostructures grown by RF-MBE on high resistivity Fe-doped GaN

Silicon-doped GaN epilayers and AlGaN/GaN heterostructures were developed by nitrogen plasma-assisted molecular beam epitaxy on high resistivity iron-doped GaN (0001) templates and their properties were investigated by atomic force microscopy, x-ray diffraction and Hall effect measurements. In the case of high electron mobility transistors heterostructures, the AlN mole fraction and the thickness of the AlGaN barrier employed were in the range of from 0.17 to 0.36 and from 7.5 to 30 nm, respectively. All structures were capped with a 2 nm GaN layer.Despite the absence of Ga droplets formation on the surface, growth of both GaN and AlGaN by RF-MBE on the GaN (0001) surfaces followed a step-flow growth mode resulting in low surface roughness and very abrupt heterointerfaces, as revealed by XRD. Reciprocal space maps around the reciprocal space point reveal that the AlGaN barriers are fully coherent with the GaN layer.GaN layers, n-doped with silicon in the range from 10¹⁵ to 10¹⁹ cm⁻³ exhibited state of the art electrical properties, consistent with a low unintentional background doping level and low compensation ratio. The carrier concentration versus silicon cell temperatures followed an Arhenius behaviour in the whole investigated doping range. The degenerate 2DEG, at the AlGaN/GaN heteroiterfaces, exhibited high Hall mobilities reaching 1860 cm²/V s at 300 K and 10 220 cm²/V s at 77 K for a sheet carrier density of 9.6E12 cm⁻².The two dimensional degenerate electron gas concentration in the GaN capped AlGaN/GaN structures was also calculated by self-consistent solving the Schrödinger–Poisson equations. Comparison with the experimental measured values reveals a Fermi level pinning of the GaN (0001) surface at about 0.8 eV below the GaN conduction band.     

Characterisation of defects in rare earth implanted GaN by deep level transient spectroscopy

Deep level transient spectroscopy (DLTS) was used to investigate the electrical properties of GaN implanted with the rare earth (RE) ions erbium and thulium. The GaN layers have been grown by metal-organic chemical vapor deposition (MOCVD) onto (0001) sapphire substrates. We used the channeled implantation geometry to implant a dose of 5×10¹⁴ RE cm⁻² with an energy of 150 keV. For each species, two different annealing procedures were used in a nitrogen atmosphere for 120 s. Indeed, the annealing temperature plays an important role in the lattice recovery, even if RE-related defects remain present. After annealing at 1000 C, the appearance of two new peaks, for both studied RE ions, is associated with the lattice damage induced by the implantation, such as the presence of nitrogen vacancies. After annealing at 1100 C, the recovery of the lattice is observed while a hole trap appears for both implanted RE ions with corresponding energy values E_v+0.61 eV and E_v+1.59 eV, in the case of Er and Tm, respectively.     

Photoreflectance investigations of AlGaN/GaN heterostructures with a two dimensional electron gas

Undoped AlGaN/GaN heterostructures with different content and thickness of AlGaN layer are investigated by photoreflectance (PR) spectroscopy. We have observed PR resonances related to an absorption in both GaN and AlGaN layers. The character of these resonances has been analyzed, and PR lines associated with excitonic and band-to-band absorption in the GaN layer and band-to-band absorption in the AlGaN layer have been identified. The transition related to band-to-band absorption possesses characteristic Franz–Keldysh oscillations (FKOs) associated with a built-in electric field. The electric field in the AlGaN layer obtained on the basis of the analysis of FKOs has been found to be in the range of 244–341 kV/cm. The value of the field has been found to decrease with the increase in AlGaN thickness and to increase with the increase in Al concentration. The surface potential for AlGaN layers has been found to increase with the increase in Al mole fraction and has been estimated to be in the range of 1.0–1.7 eV.     

Correlation between morphological, electrical and optical properties of GaN at all stages of MOVPE Si/N treatment growth

GaN has been grown using Si/N treatment growth by MOVPE on sapphire (0001) in a home-made vertical reactor. The growth was monitored by in situ laser reflectometry. The morphological, electrical and optical properties of GaN are investigated at all the growth stages. To this aim, the growth was interrupted at different stages. The obtained samples are ex situ characterized by scanning electron microscopy (SEM), room temperature Van der Pauw–Hall electrical transport and low temperature (13 K) photoluminescence (PL) measurements. The SEM images show clearly the coalescence process. A smooth surface is obtained for a fully coalesced layer. During the coalescence process, the electron concentration (n) and mobility (μ) vary from 2×10¹⁹ cm⁻³ to 2×10¹⁷ cm⁻³ and 12 cm²/V s–440 cm²/V s, respectively. The PL maxima shift to higher energy and the FWHM decreases to about 4 meV. A correlation between PL spectra and Hall effect measurements is made. We show that the FWHM follows a n^2/3 power law for n above 10¹⁸ cm⁻³.     

Low temperature homoepitaxy of GaN by LP-MOVPE using Dimethylhydrazine and nitrogen

Thin films of GaN with the V/III≈10 ratio were grown by low-pressure metal organic vapour phase epitaxy (LP-MOVPE) using N₂ and Dimethylhydrazine (DMHy) as a carrier gas and nitrogen precursor, respectively. For the growth temperatures in the range from 550 to 690 C the GaN layers exhibited good surface morphology. In the temperature range from approximately 550 to 610 C, the growth rate increases with increasing temperature, characteristic of the process limited by surface kinetics with the activation energy of approximately 36 kcal/mol. For the temperatures between 620 and 690 C, the growth rate was nearly independent of temperature, which is indicative of a mass transport limited growth. The activation energy was about 4.6 kcal/mol. Micro Raman spectroscopy revealed a significant relaxation of the selection rules for the scattering by the optical phonons in the films grown at lower temperatures. Variation of the intensity ratio for and E₁ phonon modes has been attributed to the changes in the structural quality of the films grown at different temperatures.     

AlGaN/GaN HEMTs grown on silicon (001) substrates by molecular beam epitaxy

We report the realization of an AlGaN/GaN HEMT on silicon (001) substrate with noticeably better transport and electrical characteristics than previously reported. The heterostructure has been grown by molecular beam epitaxy. The 2D electron gas formed at the AlGaN/GaN interface exhibits a sheet carrier density of 8×10¹² cm⁻² and a Hall mobility of 1800 cm²/V s at room temperature. High electron mobility transistors with a gate length of 4 μm have been processed and DC characteristics have been achieved. A maximum drain current of more than 500 mA/mm and a transconductance g_m of 120 mS/mm have been obtained. These results are promising and open the way for making efficient AlGaN/GaN HEMT devices on Si(001).     

High-quality InAlN/GaN heterostructures grown by metal–organic vapor phase epitaxy

We fabricated high-quality InAlN/GaN heterostructures by metal–organic vapor phase epitaxy (MOVPE). X-ray diffraction measurements revealed that InAlN/GaN heterostructures grown under optimal conditions have flat surfaces and abrupt heterointerfaces. Electron mobility from 1200 to 2000 cm²/V s was obtained at room temperature. To our knowledge, this mobility is the highest ever reported for InAlN/GaN heterostructures. We also investigated the relationship between the Al composition and sheet electron density (N_s) for the first time. N_s increased from 1.0×10¹² to 2.7×10¹³ cm⁻² when the Al composition increased from 0.78 to 0.89.     

Photoluminescence and excitation spectroscopy of the 1.5 μm Er-related band in MBE-grown GaN layers

The infrared photoluminescence at 1.5 m due to the ⁴I_13/2→⁴I_15/2 transition of Er³⁺ ions has been investigated for GaN:Er³⁺ layers grown by MBE. Low temperature high resolution measurements performed under continuous illumination at the wavelength  nm, resonant to one of the intra-4f-shell transitions, revealed that the 1.5 μm band consists of up to eight individual spectral components. In excitation spectroscopy, a temperature dependence splitting of resonant bands was observed. On the basis of these experimental results, a possible multiplicity of optically active centers formed by Er doping in GaN layers is discussed.     

Microstructural assessment of InN-on-GaN films grown by plasma-assisted MBE

The structural properties of InN thin films, grown by rf plasma-assisted molecular beam epitaxy on Ga-face GaN/Al₂O₃(0001) substrates, were investigated by means of conventional and high resolution electron microscopy. Our observations showed that a uniform InN film of total thickness up to 1 μm could be readily grown on GaN without any indication of columnar growth. A clear epitaxial orientation relationship of , was determined. The quality of the InN film was rather good, having threading dislocations as the dominant structural defect with a density in the range of 10⁹–10¹⁰ cm⁻². The crystal lattice parameters of wurtzite InN were estimated by electron diffraction analysis to be a=0.354 nm and c=0.569 nm, using Al₂O₃ as the reference crystal. Heteroepitaxial growth of InN on GaN was accomplished by the introduction of a network of three regularly spaced misfit dislocation arrays at the atomically flat interface plane. The experimentally measured distance of misfit dislocations was 2.72 nm. This is in good agreement with the theoretical value derived from the in-plane lattice mismatch of InN and GaN, which indicated that nearly full relaxation of the interfacial strain between the two crystal lattices was achieved.     

Time- and frequency-domain measurements of carrier lifetimes in GaN epilayers

Results on time-resolved study of GaN photoluminescence (PL) in a power density range from 0.5 mW/cm² under CW excitation by ultraviolet light emitting diode (UV LED) to 1 GW/cm² under pulsed excitation by YAG:Nd laser in the temperature range from 8 to 300 K are presented. Measurements of PL response in the frequency domain by using amplitude-modulated emission of a UV LED as well as time-resolved PL measurements using a streak camera and light-induced transient grating technique have been used in the study. Yellow luminescence (YL) intensity increases with increasing temperature up to 120 K and faster components in YL decay switch to slower components with increasing temperature under UV LED excitation. At low carrier densities, the trapping decreases the carrier lifetime below 250 ps, while the carrier lifetime in the same GaN sample under excitation ensuring saturation of the traps equals 2 ns.     

Amorphisation of GaN during processing with rare earth ion beams

GaN epilayers grown by metal organic chemical vapor deposition (MOCVD) were implanted with Tm and Eu ions with different energies and fluences and at different temperatures in order to optimize the implantation conditions. The recovery of the implantation damage was studied using both rapid thermal annealing and furnace annealing with nitrogen overpressure of 4×10⁵ Pa. Rutherford backscattering spectrometry in the channeling mode (RBS/C) was used to monitor the evolution of damage introduction and recovery in the Ga-sublattice and transmission electron microscopy (TEM) was carried out for further structural analysis. The RBS/C spectra as well as TEM images show two different damage regions, one at the surface arising from an amorphous surface layer and another one deeper in the crystal coinciding with the end of range of the implanted ions. For implantation with 150 keV at room temperature, even for fluences as low as 3×10¹⁴ at/cm², a thin amorphous surface layer, which becomes thicker with increasing implantation fluence, was observed by TEM. High temperature annealing of these highly damaged layers often results in loss of the amorphous layer and accumulation of the implanted species at the surface rather than a regrowth of the crystal. It was possible to prevent the formation of an amorphous layer by implanting at 500 C. In those samples a large part of the lattice damage was removed during annealing at 1000 C and the recovery of the lattice is similar for both applied annealing methods.     

MBE growth of nitride-based photovoltaic intersubband detectors

In this work, we present the plasma-assisted molecular-beam epitaxial growth of quantum well infrared photodetector (QWIP) structures, including the Si-doped GaN/AlN short-period superlattice of the active region, conductive AlGaN claddings and integration of the final device. The growth of Si-doped GaN/AlN multiple quantum well (QW) structures is optimized by controlling substrate temperature, metal excess and growth interruptions. Structural characterization confirms a reduction of the interface roughness to the monolayer scale. P-polarized intersubband absorption peaks covering the 1.33–1.91 μm wavelength range are measured on samples with QW thickness varying from 1 to 2.5 nm. The absorption exhibits Lorentzian shape with a line width around 100 meV in QWs doped 5×10¹⁹ cm⁻³. To prevent partial depletion of the QWs owing to the internal electric field, we have developed highly-conductive Si-doped AlGaN cladding layers using In as a surfactant during growth. Complete ISB photodetectors with 40 periods of 1 nm-thick Si-doped GaN QWs with 2 nm-thick AlN barriers have been grown on conductive AlGaN claddings, the Al mole fraction of the cladding matching the average Al content of the active region. Temperature-dependent photovoltage measurements reveal a narrow (90 meV) detection peak at 1.39 μm.     

Growth and characterisation of GaN with reduced dislocation density

Two GaN MOVPE growth methods to reduce the threading dislocation (TD) density have been explored. The combined effects of (1) in situ SiN_x masking of the sapphire substrate and (2) starting the epitaxial growth at low V-to-III ratio on the GaN film quality were studied by atomic force microscopy, transmission electron microscopy and high-resolution X-ray diffraction. It was found that the annealing condition of the low-temperature nucleation layer after in situ SiN_x masking is critical in order to decrease the density of nucleation sites and hence increase the average grain size to about 5 μm. However, the coalescence of large grains with vertical side facets results in the formation of dense bundles of TDs at the grain boundaries combined with large numbers of basal-plane dislocation loops throughout the film. The formation of these dislocations can be prevented by starting the epilayer growth at low V-to-III ratio, resulting in the formation of grains with inclined side facets. The interaction of the TDs with the inclined side facets causes the dislocations to bend 90 as the grains grow in size and coalesce. GaN films with dislocation densities as low as 1×10⁸ cm⁻², giving full-width at half-maximum values of 180 and 220 arcsec for respectively (002) and (302) omega scans, were achieved by the combination of in situ masking and low V–III ratio epilayer growth. Hall carrier mobility values in excess of 900 cm² V ⁻¹ s⁻¹ were deduced for Si-doped layers.     

Ni/Au Schottky gate oxidation and BCB passivation for high-breakdown-voltage AlGaN/GaN HEMT

A new AlGaN/GaN high electron mobility transistor (HEMT) employing Ni/Au Schottky gate oxidation and benzocyclobutene (BCB) passivation is fabricated in order to increase a breakdown voltage and forward drain current. The Ni/Au Schottky gate metal with a thickness of 50/300 nm is oxidized under oxygen ambient at 500 C and the highly resistive NiO is formed at the gate edge. The leakage current of AlGaN/GaN HEMTs is decreased from 4.94 μA to 3.34 nA due to the formation of NiO. The BCB, which has a low dielectric constant, successfully passivates AlGaN/GaN HEMTs by suppressing electron injection into surface states. The BCB passivation layer has a low capacitance, so BCB passivation increases the switching speed of AlGaN/GaN HEMTs compared with silicon nitride passivation, which has a high dielectric constant. The forward drain current of a BCB-passivated device is 199 mA /mm, while that of an unpassivated device is 172 mA /mm due to the increase in two-dimensional electron gas (2DEG) charge.     

The structure of crystallographic damage in GaN formed during rare earth ion implantation with and without an ultrathin AlN capping layer

The crystallographic nature of the damage created in GaN implanted by rare earth ions at 300 keV and room temperature has been investigated by transmission electron microscopy versus the fluence, from 7×10¹³ to 2×10¹⁶ at/cm², using Er, Eu or Tm ions. The density of point defect clusters was seen to increase with the fluence. From about 3×10¹⁵ at/cm², a highly disordered ‘nanocrystalline layer’ (NL) appears on the GaN surface. Its structure exhibits a mixture of voids and misoriented nanocrystallites. Basal stacking faults (BSFs) of I₁, E and I₂ types have been noticed from the lowest fluence, they are I₁ in the majority. Their density increases and saturates when the NL is observed. Many prismatic stacking faults (PSFs) with Drum atomic configuration have been identified. The I₁ BSFs are shown to propagate easily through GaN by folding from basal to prismatic planes thanks to the PSFs.When implanting through a 10 nm AlN cap, the NL threshold goes up to about 3×10¹⁶ at/cm². The AlN cap plays a protective role against the dissociation of the GaN up to the highest fluences. The flat surface after implantation and the absence of SFs in the AlN cap indicate its high resistance to the damage formation.     

Ultrafast dynamics and temperature effects on the quantum efficiency of the ring-opening reaction of a photochromic indolylfulgide

The ultrafast ring-opening reaction of the molecular switch 1,2-Dimethyl-3-indolylfulgide dissolved in acetonitrile is investigated by temperature dependent quantum efficiency measurements and time-resolved transient absorption spectroscopy in the ultraviolet and visible spectral range. The photoreaction is found to be thermally activated with an activation energy of about 1640 cm^− 1. The transient absorption signal is bi-exponential with the time constants τ₁ = 0.7 ps and τ₂ = 12 ps. The fast time constant is due to solvation dynamics, while the main component τ₂ is attributed to the excited state lifetime and product formation. A long-lived intermediate state in the photoreaction can be excluded.     

Stretched exponential relaxation and dispersive conductivity behavior in lithium bismuth silicate glasses

Glasses having compositions xLi₂O∙(85 − x)Bi₂O₃∙15SiO₂ (x = 35, 40, and 45 mol%) were prepared by normal melt quenching technique. Electrical relaxation and conductivity in these glasses were studied using impedance spectroscopy in the frequency range from 20 Hz to 1 MHz and in the temperature range from 453 to 603 K. The ac and dc conductivities, activation energy of the dc conductivity and relaxation frequency were extracted from the impedance spectra. The dc conductivity increases with increase in Li₂O content providing modified glass structure and large number of mobile lithium ions. Similar values of activation energy for dc conduction and for conductivity relaxation time indicate that the ions overcome the same energy barrier while conducting and relaxing. The non-exponential character of relaxation processes increases with decrease in stretched exponential parameter ‘β’ as the composition parameter ‘x’ increases. The observed conductivity spectra follow a power law with exponent ‘s’ which increases regularly with frequency and approaches unity at higher frequencies. Nearly constant losses (NCL) characterize this linearly dependent region of the conductivity spectra. A deviation from the ‘master curve’ for various isotherms of conductivity spectra was also observed in the high-frequency region and at low temperatures, which supports the existence of different dynamic processes like NCL in addition to the ion hopping processes in the investigated glass system.     

Epitaxial growth of ZnSiN2 single-crystalline films on sapphire substrates

A new family of wide band gap nitride semiconductors expressed as II–IV-N₂ have recently attracted attention due to their expected properties such as optical non-linearity. In addition, among these compounds, ZnGeN₂ and ZnSiN₂ have lattice parameters close to GaN and SiC respectively. Up to now, there is very little work reported on this class of materials and no systematic thin film growth study has been reported to date. In this paper we present the first study on the growth of ZnSiN₂ on c-sapphire and (100) silicon substrates using low pressure MOVPE technique. Triethylamine:dimethylzinc adduct, silane diluted in H₂ and ammonia were used as source materials. Single crystalline epitaxial ZnSiN₂ layers were obtained on nitridated c-sapphire substrates in the temperature range 873–973 K by using an adapted II/IV molar ratio ranging from 1.2 to 12. Assuming an orthorhombic unit cell, the lattice parameters calculated from the X-ray diffraction data are a=0.534 nm, b=0.617 nm and c=0.504 nm.     

Anisotropy of the dielectric function for wurtzite InN

A -plane InN film grown by molecular beam epitaxy on -plane sapphire substrate with an AlN nucleation layer and a GaN buffer was studied by spectroscopic ellipsometry. The data analysis yields both the ordinary and the extraordinary dielectric tensor components perpendicular and parallel to the optical axis, respectively. Strong optical anisotropy is demonstrated over the whole energy range from 0.72 up to 9.5 eV. The line shapes of the tensor components and the polarisation behaviour are in very good agreement with the results of recently published band structure and dielectric function calculations. Above the band gap, five van Hove singularities are evidenced from the ordinary component, while three are resolved from the extraordinary part. The polarisation dependence below 1 eV can be interpreted in terms of optical selection rules for three energetically split valence bands around the Γ-point of the Brillouin zone, similar to the well known behaviour of wurtzite GaN. This emphasises a band gap of hexagonal InN of about 0.7 eV.