Time-resolved photoluminescence of implanted SiO2:Si+ films

In this paper we present results of a low-temperature time-resolved photoluminescence (PL) investigation of thin SiO₂ films implanted with silicon ions. In addition to the luminescence of well-known ODCs, some other bands are present in the low-energy region of PL spectra that are attributed to silicon nanoclusters (quantum dots – SiQDs), excitons and hydrogen-related species (HRS). Specific features of SiQD and HRS bands are the nanosecond kinetics and unusual “stepped” PL excitation spectrum in the 3.5–7.5 eV range. The possible origin of discovered phenomena is discussed. The obtained results are interpreted taking into account the interference of exciting radiation and dimensional quantization effects.     

Cathodoluminescence of Ge, Si, and O implanted SiO2 layers and the role of mobile oxygen in defect transformations

Thermally grown SiO₂ layers of thickness d=500 nm have been implanted by Ge⁺, Si⁺, and O⁺ ions of energy 350, 150, and 100 keV, respectively, and a uniform implantation dose of D_i=5×10¹⁶ ions/cm². Thus the implantation profiles are expected with a concentration maximum of nearly 4 at.% at the half-depth d_m≅250 nm of the SiO₂ layers. After thermal annealing to 900 °C for 1 h in dry nitrogen or vacuum the typical violet luminescence band (λ=400 nm) of the Ge⁺ implanted centers is increased more than 200-fold and the Ge luminescent center depth profile is shifted from about 250 to 170 nm towards the surface as determined by cathodoluminescence (CL) depth profiling. Implanting oxygen increases the red band (λ=650 nm) but does not affect the blue band (λ=460 nm). Silicon surplus increases the amplitude of the blue (B) luminescence, but reduces the amplitude of the red (R) one. Studying the irradiation dose dependence of these blue and red bands we have established defect kinetics in SiO₂ including six main defects and precursors, including the non-bridging oxygen hole center for the red luminescence, the twofold-coordinated silicon as the oxygen deficient center ODC(2) for the blue luminescence and the mobile oxygen as the main transmitter between precursors and the radiation induced defects. The kinetics are described by a set of eight differential equations which predict the dose dependence of the CL.     

Nb redeposition on Si during plasma etching of Nb/SiO2/Si layers investigated by RBS

The redeposition of electrode material (Ni, Cr, Al) and material of a Nb layer on silicon surface during plasma etching of Nb, SiO₂ and Si by a CF₄ plasma has been investigated by Rutherford Back Scattering spectrometry. It is shown that a steady state exists, what causes a Nb contamination of etched Si surfaces. Obviously this steady state concentration (Nb)_ads is influenced by additional redeposition of non-etchable electrode material as Ni, Cr and Al.     

Formation of Ge-diffusion-suppressed GaAs layers and InAs quantum dots on Ge/Si substrates

Crystal growth of GaAs layers and InAs quantum dots (QDs) on the GaAs layers was investigated on Ge/Si substrates using ultrahigh vacuum chemical vapor deposition. Ga-rich GaAs with anti-site Ga atoms grown at a low V/III ratio was found to suppress the diffusion of Ge into GaAs. S-K mode QD formation was observed on GaAs layers grown on Ge/Si substrates with Ga-rich GaAs initial layers, and improved photoluminescence from 1.3 μm-emitting InAs QDs was demonstrated.     

Aluminum induced formation of SiGe alloy in Ge/Si/Al thin film structure

In this work, a study of aluminum induced crystallization (AIC) of thin film germanium/silicon/aluminum (Ge/Si/Al) structure on oxidized silicon is presented. The Ge/Si/Al trilayer structure was prepared in three consecutive thin film deposition processes. The AIC was performed in nitrogen at 500 °C within time duration between 1 and 9 h. The progress of crystallization was monitored by optical microscopy, Raman spectroscopy, X-ray diffraction (XRD) and scanning electron microscopy (SEM) combined with energy dispersive X-ray spectroscopy (EDS). It was found that in Ge/Si/Al structure the AIC can lead to formation of SiGe alloy at temperature of 500 °C. This presents an alternative low-temperature formation method of SiGe which is suitable for integration with the conventional Si technology in electronic device fabrication.     

Growth and characterization of GaAs layers on polished Ge/Si by selective aspect ratio trapping

Epitaxial GaAs layers have been deposited on polished Ge film grown on exactly (0 0 1) oriented Si substrate by metal-organic chemical vapor deposition (MOCVD) via aspect ratio trapping (ART) method. Double-crystal X-ray diffraction shows that the full-width at half-maximum (FWHM) of the (4 0 0) reflection obtained from 1 μm GaAs is 140 arcsec. Scanning electron microscopy (SEM) of the GaAs layer surface shows that the amount of antiphase domain defects (APD) raised from GaAs/Ge interface using Ge ART on Si is dramatically reduced compared to GaAs layers grown on exact (0 0 1) Ge substrate. Defect reduction and Ge diffusion at vicinal GaAs/Ge interface were investigated via cross-section transmission electron microscopy (X-TEM) and secondary ion mass spectrometry (SIMS). Film morphology and optical properties were evaluated via SEM and room temperature photoluminescence (PL).     

Structure and photoelectrical properties of SiO2/Si/SiO2 single quantum wells prepared under ultrahigh vacuum conditions

SiO₂/Si/SiO₂ single quantum wells (QWs) were prepared under ultrahigh vacuum conditions in order to study their structural, chemical and photoelectrical properties with respect to a possible application in photovoltaic devices. Amorphous silicon (a-Si) layers (thickness <10 nm) were deposited onto quartz glass (SiO₂) substrates and subsequently oxidized with neutral atomic oxygen at moderate temperatures of 600 °C. Under these conditions, the formation of suboxides is mostly suppressed and abrupt Si/SiO₂ interfaces are obtained. Crystallization of a-Si QWs requires temperatures as high as 1000 °C resulting in a nanocrystalline structure with a small amorphous fraction. The spectral dependence of the internal quantum efficiency of photoconductivity correlates well with the nanocrystalline structure and yields mobility lifetime products of <10^?7 cm² V^?1. This rather low value points towards a strong influence of Si/SiO₂ interface states on the carrier mobility and the carrier lifetime in Si QWs. Electronic passivation of interface states by subsequent hydrogen treatment in forming gas enhances the internal quantum efficiency by nearly one order of magnitude.     

Effect of the sign of misfit strain on the formation of a dislocation structure in SiGe epitaxial layers grown on Si and Ge substrates

Comparative analysis of the specific features of the formation of a dislocation structure in the single-layer epitaxial heterostructures Si_1?xGe_x/Si and Ge_1?ySi_y/Ge is performed. It is ascertained that, at a relatively low lattice mismatch between an epitaxial layer and a substrate, the sign of misfit strain at the interface significantly affects the processes of defect formation. The most probable reasons for the observed phenomena are analyzed with allowance for the specific features of the state of the ensemble of intrinsic point defects in epitaxial layers subjected to elastic strains of a different sign.     

MEMS用Si台面及SiO2/Si衬底上3C-SiC的LPCVD生长

本文报道用在Si台面及热氧化SiO2衬底上3C-SiC薄膜的LPCVD生长,反应生长使用的气体为SiH4和C2H4,载气为H2,采用光学显微镜、X射线衍射（XRD）、X射线光电子能谱（XPS）、扫描电镜（SEM）、以及室温Hall测试对所生长的3C—SiC材料进行了测试与分析,结果表明在3C-SiC和SiO2之间没有明显的坑洞形成。     

Transport properties near the magneto/structural transition of Tb5Si2Ge2

We report high resolution measurements of the electrical resistivity (ρ, dρ/dT) and thermopower (S, dS/dT) measurements near the magnetic and structural transition of the layered Tb₅Si₂Ge₂ compound, which are fairly close but not fully coupled. The analysis of the transport properties confirms a split magneto/structural transition, with T_S ～ 97 K and T_S ～ 107 K for the structural transition (on cooling and heating respectively; 1st-order transition). The magnetic transition occurs only at T_C ～ 112 K and without hysteresis (2nd-order transition). The magnetic critical behavior of resistivity is analyzed, obtaining an almost classical mean field exponent (α ～ 0.59) for T > T_C. For the structural phase, and below T_S, we obtain a rather different exponent (α ～ 1.06).     

Reflectivity measurements of thin SiO2 layers in the soft-X-ray region

Energy and angular dependent reflectivity measurements of differently prepared SiO₂ layers were made in the soft X-ray region in order to study differences in their optical and electronic behaviour caused by the technological process. The optical constants of the layers were determined by fitting the angular dependent reflectivity data with a multilayer model which takes into account the roughness of all interfaces. Detailed knowledge of the polarization level of the primary beam from the synchrotron radiation source is needed for reliable results. The energy dependent reflectivity measurements indicate that high-pressure dry-oxidized layers have a more perfect structure than normal dry-oxidized layers. Independent on the deposition process the Si SiO₂ interface roughness amounts to ± 1 nm. The Si_2p-XANES of Si and SiO₂ were detected.     

SiO_2中包埋纳米晶Si光电性质的计算

采用第一性原理平面波赝势方法计算了SiO_2基质包埋不同尺寸纳米晶粒Si_3和Si_5的电子结构及光学性质.结果表明,随着包埋纳米晶粒尺寸的减小,包埋Si_3结构的带隙比包埋Si_5结构宽,但包埋Si_5结构对可见光区的吸收优于包埋Si_3结构.Si_3结构的第一个吸收峰在约3.9 eV处,Si_5结构的第一个吸收峰在约4.6 eV处.计算表明,Si纳米颗粒中Si原子数与包埋基质的分子数之比为45.46;是一种较好的结构参数,对可见光区吸收效果好.     

Electronic and vibrational states of oxygen and sulfur molecular ions inside implanted SiO2 films

The paper presents the results of a low-temperature time-resolved photoluminescence (PL) investigation of thin SiO₂ films implanted with either oxygen or sulfur ions. Both PL and PLE spectra of the samples demonstrate vibronic oscillations which were attributed to the ground and excited states of sulfur- and oxygen-related molecular species. Vibrational frequencies and anharmonicity parameters calculated from the experimental data agree well with known literature. The most intensive excitation is observed in the spectral region of silica matrix excitons. It is established that such high-energy irradiation leads to non-bridging oxygen hole center creation as well as to the luminescence of molecular species. The results obtained on silica film modification could be of interest for future planar waveguides and thin oxide structure design.     

About the fluorine chemistry in MCVD: The mechanism of fluorine incorporation into SiO2 layers

Fluorine incorporation during the deposition of silica layers is studied under MCVD conditions using C₂F₃Cl₃ as fluorine source. The experimental results are compared with known models of the incorporation mechanism. It is found that a gas/solid equilibrium during the consolidation step determines the final fluorine content of the layers.     

Influence of sputtering conditions and electron energy on XPS depth profiling of Ge in SiO2

Ge nanocluster formation in SiO₂ is of growing interest for new electronic applications. Ion beam synthesis using high‐energy Ge implantation connected with thermal annealing is one possible preparation method of such clusters. In addition to investigations of electrical and structural changes during the cluster formation process we also studied chemical changes in the samples using x‐ray photoelectron spectroscopy (XPS). This was done with low‐energy noble gas ion sputtering for depth profiling. Binding state information one can get from the XPS data by means of factor analysis (FA) in combination with other structural investigations. However, mixed bonding states probably created by ion beam damage during sputter erosion are dominating the results. It is shown, that by changing the experimental conditions (ion beam impact depth during sputtering, electron information depth during XPS measurement) these mixed states are influenced in an appropriate manner. It is concluded that useful chemical information on the behavior of the implanted Ge can be derived despite of the ion beam damage. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Si modified Ge10 cluster: the preparation and characterization of single crystal Na4(Ge,Si)9O20

A Si modified Ge₁₀ cluster with structure Na₄(Ge,Si)₉O₂₀ (denoted as HUT‐1) was synthesized by hydrothermal synthesis at 160 °C with a sodium silicate source. The compound was characterized by single crystal, powder X‐ray diffraction and TGA‐DSC analysis. HUT‐1 crystallizes in space group I4₁ (80) with calculated unit cell (a=14.966(5) Å, c=7.343(2) Å, V=1644.8(9) ų), which has the same structure as Na₄Ge₉O₂₀. HUT‐1 has a high Si/Ge ratio with an approximate formula of Na₄Ge_7.68Si_1.32O₂₀. Single crystal X‐ray structure refinements together with results from X‐ray powder diffraction (XRPD) confirm the occupancy of Si at two tetrahedral sites. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Comparison of growth methods for Si/SiO2 nanostructures as nanodot hetero-emitters for photovoltaic applications

Two different growth mechanisms are compared for the fabrication of Si/SiO₂ nanostructures on crystalline silicon (c-Si) to be used as hetero-emitter in high-efficiency solar cells: (1) The decomposition of substoichiometric amorphous SiO_x (a-SiO_x) films with 0 < x < 1.3 and (2) the dewetting of thin amorphous silicon (a-Si) layers.The grown layers are investigated with regard to their structural properties, their passivation quality for c-Si wafer substrates and their electrical properties in order to evaluate their suitability as a nanodot hetero-emitter. While by layer decomposition, no passivating nanodots could be formed, the dewetting process allows fabricating nanodot passivation layers at temperatures as low as 600 °C. The series resistance through Ag/[Si-nanodots in SiO₂]/c-Si/Al structures for dewetting is similar to nanostructured silicon rich SiO_x films. Still, a nanodot hetero-emitter which exhibits both a satisfying passivation of the substrate and induces a high band bending by doping at the same time could not be fabricated yet.     

Low-K factor of SiO2 layer on Si irradiated by YAG:Nd laser

The change of optical and electrical properties of SiO₂ layer on Si single crystal exposed to YAG:Nd laser radiation has been found experimentally. The second harmonic of YAG:Nd laser was used as a source of light. Before irradiation the SiO₂ layer with thickness 0.75 μm had red color in reflecting light due to the interference. After irradiation with the laser with intensity of more than 3.5 MW/cm² red color changed to yellow. However, samples with thickness 0.21 μm did not change color after irradiation. We explain such peculiarities of optical properties by change of optical path. Capacity (C) measurements of SiO₂ layer with thickness 0.21 μm by the method of capacity–voltage characteristics have shown a decrease of C to more than 40%. It is possible if real part of dielectric permittivity (K) decreases or thickness of the SiO₂ layer increases. Atomic force microscope and profilemeter measurements did not show any change of surface roughness for the SiO₂ layer with thickness 0.21 μm. We suppose that after irradiation of the SiO₂ layer decrease of K takes place due to the formation of nanopores in SiO₂ or/and generation of the charged point defect at the interface of Si–SiO₂. Particularly the first is in agreement with measurements of micro hardness and capillary effect.