Toward the fast deposition of highly crystallized microcrystalline silicon films with low defect density for Si thin-film solar cells

In this study, employing a high-density, low-temperature SiH₄–H₂ mixture microwave plasma, we investigate the influence of source gas supply configuration on deposition rate and structural properties of microcrystalline silicon (μc-Si) films, and demonstrate the plasma parameters for fast deposition of highly crystallized μc-Si films with low defect density. A fast deposition rate of 65 Å/s has been achieved for a SiH₄ concentration of 67% diluted in H₂ with a high Raman crystallinity of X_c > 65% and a low defect density of (1–2) × 10¹⁶ cm⁻³ by adjusting source gas supply configuration and plasma conditions. A sufficient supply of deposition precursors, such as SiH₃, as well as atomic hydrogen H on film growing surface is effective for the high-rate synthesis of highly crystallized μc-Si films, for the reduction in defect density, and for the improvement in film homogeneity and compactability. A preliminary result of p–i–n structure μc-Si thin-film solar cells using the resulting μc-Si films as an intrinsic absorption layer is presented.     

Large grain μc-Si:H films deposited at low temperature: Growth process and electronic properties

We have studied structural and electronic properties of μc-Si:H films deposited from SiH₄ + H₂ and SiH₄ + H₂ + Ar gas mixtures. The use of Ar containing gas mixtures for depositions allows us to increase deposition rate by a factor of two and to obtain films with an important fraction of large grains in comparison with SiH₄ + H₂ gas mixtures. Electronic properties of fully crystallized films become more intrinsic with the increase of large grain fraction. Deposition of highly p- and n-doped μc-Si:H layers from the dopant/SiH₄ + H₂ gas mixture at a temperature of 175 °C is possible without any remarkable changes in crystallinity in comparison with undoped films deposited with the same discharge conditions.     

The application of very high frequency inductively coupled plasma to high-rate growth of microcrystalline silicon films

High-rate growth of microcrystalline silicon films (μc-Si:H) from inductively coupled plasma (ICP) of H₂ diluted SiH₄ generated with a very high frequency (VHF: 60 MHz) power source has been studied from the viewpoint of efficient gas dissociation. From the VHF power and gas pressure dependences of the film growth rate and optical emission intensities, we have found that the Si and SiH emission intensities and the intensity ratio of H_α to SiH are good indicators for the film growth rate and crystallinity, respectively. The generation rate of film precursors is reflected by the Si and SiH emission intensities while the flux ratio of atomic hydrogen to film precursors, which plays an important role on the structural relaxation for the crystalline network formation, is characterized by the intensity ratio of H_α to SiH. An increase in SiH emission while keeping the intensity ratio of H_α to SiH at a certain level enables us to enhance the film growth rate without significant deterioration in the crystallinity. In this study, a growth rate as high as 10 nm/s was obtained for highly crystallized films.     

Nanocrystalline silicon TFT process using silane diluted in argon–hydrogen mixtures

We have investigated the effect of Ar dilution on the deposition process of intrinsic nc-Si:H (hydrogenated nanocrystalline silicon) thin films used as active layers of top-gate TFTs, in order to improve the TFTs performances. The nc-Si:H films were deposited by plasma enhanced chemical vapor deposition (PECVD) at low temperature (165 °C) and the related TFTs were fabricated with a maximum process temperature of 200 °C. During the nc-Si:H films deposition, the SiH₄ fraction and the total flow of the diluting gases Ar + H₂ mixture was kept constant, H₂ being substituted by Ar. We have pointed out the active role played by the metastable states of excited Ar atoms in both the dissociation of SiH₄ and H₂ by quenching reactions in the plasma. The role of the atomic hydrogen during the film deposition seems to be promoted by the addition of argon into the discharge, leading to an increase of the deposition rate by a factor of about three and an enhancement of the crystalline quality of the nc-Si:H films. This effect is maximized when the Ar fraction in the Ar + H₂ gases mixture reaches 50%. The evolution with Ar addition of the carriers mobility of the related TFTs is closely connected to the evolution of the crystalline fraction of the intrinsic nc-Si:H film. Mobilities values as high as 8 cm² V^?1 s^?1 are obtained at the Ar fraction of 50%. For higher Ar fractions, the fall of the mobility comes with a degradation of the I_D–V_G transfer characteristics of the processed TFTs due to a degradation of the nc-Si:H films quality. OES measurements show that the evolution of the H_α intensity is closely connected to the evolution of the deposition rate, intrinsic films crystalline fraction and TFTs mobility, providing an interesting tool to monitor the TFTs performances.     

Thin film membrane based on a-SiGe: B and MEMS technology for application in cochlear implants

In this work is presented the fabrication of a thin film membrane as a bio-transducer for aural assistance detection, therefore it will operate at low pressure. The resonant membrane was deposited by PECVD technique at low temperature of deposition T = 270 °C, using SiH₄, GeH₄, and Boron gases. The membrane was suspended on a micromachined crystalline silicon frame obtained by wet chemical etching. The a-SiGe:B film presented a resistivity of 2.46 × 10³ (Ω-cm), resistance of 20.8 kΩ. Using these experimental data we succeeded in designing a simple structure for sensing low pressure variations. The output voltage of the sensor was measured for a range of pressure from 0 to 3000 Pa and at bias voltage of 10 V.     

Dynamics of low temperature PECVD growth of microcrystalline silicon thin films: Impact of substrate surface treatments

Microcrystalline silicon (μc-Si) films have been deposited on polyimide, Corning glass and c-Si(0 0 1) by rf plasma-enhanced chemical vapour deposition (PECVD) using both SiF₄–H₂ and SiH₄–H₂ plasmas. The effect of substrate pre-treatment using SiF₄–He and H₂ plasmas on the nucleation of crystallites is investigated. Real-time laser reflectance interferometry monitoring (LRI) revealed the existence of a ‘crystalline seeding time’ that strongly impacts on the crystallite nucleation, on the structural quality of the substrate/μc-Si interface and on film microstructure. It is found that SiF₄–He pre-treatment of substrates is effective in suppressing porous and amorphous interface layer at the early nucleation stage of crystallites, resulting in direct deposition of μc-Si films also on polyimide at the temperature of 120 °C.     

A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

Thermodynamic analysis of gas phase chemistry in hot wire chemical vapor deposition of a-Si:H and μc-Si:H

Gas phase reactions amongst filament-generated radicals play a crucial role in growth and properties of films deposited by hot wire chemical vapor deposition (HWCVD) technology. Gas phase species of interest are SiH₄, H₂, Si, H, SiH₃, SiH₂ and SiH. Partial pressures of these species for different sets of deposition conditions have been determined from the standard Gibbs free energy data. Equilibrium concentrations of the film forming precursors have been determined. The effect of the various process parameters on the equilibrium concentration of the precursors has been studied. H, Si and SiH are found to be the dominant species in gas phase above a filament temperature of 2300 K. However SiH₃ and SiH₂ concentration peaks are between 1900 and 2300 K, of the filament temperature.     

Substrate holder biasing for improvement of microcrystalline silicon deposition process

Application of a dual frequency plasma source for the deposition of microcrystalline silicon thin films from highly diluted SiH₄/H₂ was investigated in this paper. A positively or negatively biased low frequency voltage was applied on the substrate holder while the conventional frequency of 13.56 MHz was used for the powered electrode. The results show a significant increase of the deposition rate and an improvement of the film crystallinity in the case of the positive biasing. Plasma diagnostics and modeling were used to understand the beneficial effect of positive biasing on the deposition process. The results revealed that the observed changes are not only due to the variation of ion flux and ion bombardment but also depend on the changes in the production and distribution of neutral species in the discharge space.     

Effect of deposition pressure on microstructure and properties of hydrogenated carbon nitride films prepared by DC-RF-PECVD

Hydrogenated carbon nitride (a-CN:H films) were deposited on n-type (1 0 0) silicon substrates making use of dual direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), at working pressure of 2–20 Pa, using a mixed gas of CH₄ and N₂ as the source gas. The growth rate, composition, bonding structure of the deposited films were characterized by means of XPS and FTIR, and the mechanical properties of the deposited films were investigated by nano-indentation test. It was found that the parameters for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The growth rate of the deposited films increased at first with increasing deposition pressure, then saturated with further increase of the deposition pressure. The N/C ratio inside the deposited films increased with increasing working pressure except that it was as much as 0.50 at a working pressure of 5.0 Pa. The nano-hardness of the films decreased with increasing deposition pressure. CN radicals were remarkably formed in the deposited films at higher pressures, and their contents are related to the nitrogen concentrations in the deposited films.     

Preparation and properties of titanium silicide coating glass by CVD

Titanium silicide thin films were prepared on glass substrates by chemical vapor deposition using SiH₄ and TiCl₄ as the precursors. The phase structure of the thin films was identified by XRD. The surface morphology of the thin films was observed by FESEM. The sheet resistance and optical behaviors of the thin films were measured by the four point resistivity test system and FTIR spectrometer, respectively. Titanium disilicide (TiSi₂) thin films with the face-centered orthorhombic structure are formed. The suitable formation temperature of the TiSi₂ crystalline phase is about 710 °C. The formation of TiSi₂ crystalline phase is dependent on the thickness of thin films and a quantity of the crystalline phase of TiSi₂ in the thin film is directly related to mole ratio of SiH₄/TiCl₄. The sheet resistance of the TiSi₂ thin films is dependent on the formation of the TiSi₂ crystalline phase. With the mole ratio of SiH₄/TiCl₄ of 3, the lowest sheet resistance (0.7 Ω/□) of titanium silicide thin film is formed at 710 °C. The maximum reflectance of the TiSi₂ thin films is about 0.95 on the broad IR heat radiation. A related reaction mechanism was proposed.     

Deposition of phosphorus doped a-Si:H and μc-Si:H using a novel linear RF source

A roll-to-roll PECVD system for thin film silicon solar cells on steel foil has been developed by ECN in collaboration with Roth and Rau AG. It combines MW–PECVD for fast deposition of intrinsic Si and novel linear RF sources, which apply very mild deposition conditions, for the growth of doped Si layers. The RF and MW sources can be easily scaled up to deposition widths of up to 150 cm. Here, we report on n-type doping, achieved by RF–PECVD from a H₂/SiH₄/PH₃ mixture in the reaction chamber. The best n-type a-Si:H layers showed E_act = 0.27 eV and σ_d = 2.7 × 10^?3 S/cm. Also thin layers down to 20 nm were of device quality and were deposited at a rate of 0.4 Å/s. Furthermore, n-type μc-Si:H layers with thicknesses of 150 nm, with E_act = 0.034 eV and σ_d = 2 S/cm were grown. Good quality n-type μc-Si:H layers can be made for layer thicknesses down to 50 nm at a rate of 0.15 Å/s. To conclude, the novel RF source is well-suited for the growth of n-doped a-Si:H and μc-Si:H layers for roll-to-roll solar cell production.     

Optical and structural proprieties of nc-Si:H prepared by argon diluted silane PECVD

Using argon as a diluent of Silane, hydrogenated amorphous and nanorocrystalline silicon films Si:H were prepared by radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD). The deposition rate and crystallinity varying with the deposition pressure and rf power, were systematically studied. Structural analysis (Raman scattering spectroscopy and X-ray diffraction), combined with optical measurements spectroscopy were used to characterize the films. The argon dilution of silane for all samples studied was 95% by volume, and the substrate temperature was 200 °C. The deposition pressure was varied from 400 mTorr to 1400 mTorr and varying rf power from 50 to 250 W. The structural evolution studies, shows that beyond 200 W of rf power, an amorphous-nanocrystalline transition was observed, with an increase in crystalline fraction by increasing rf power and working pressure. The films were grown at high deposition rates. The deposition rates of the films near the amorphous-nanocrystalline phase transition region were found in the range 6–10 Å/s. A correlation between structural and optical properties has been found and discussed.     

Material utilisation when depositing CdTe layers by inline AP-MOCVD

A study was undertaken to assess the efficiency of precursors' usage during deposition of cadmium telluride (CdTe) layers via atmospheric pressure metal organic chemical vapour deposition (AP-MOCVD) for thin film photovoltaic solar cells. Precursors were released from a showerhead assembly normal to the glass substrate 0.7 mm thick (5×7.5 cm²) being deposited which was kept stationary or moved under the showerhead assembly, with speed of upto 2.25 cm/min. In order to estimate the effective precursor utilisation, the weight deposit (layer) was compared against the theoretical values calculated for ideal molar supply. The layer thickness, composition, morphology, and crystallinity were also measured using profilometry, energy dispersive X-ray (EDX), scanning electron microscopy (SEM), and X-ray diffraction (XRD), respectively. It is shown that over 40% material utilisation can be achieved depending on the deposition parameters of substrate temperature and speed, partial pressure of precursors and total gas flow. The activation energy derived from an Arrhenius plot of deposition rate equals 49 kJ mol^?1 and is consistent with previous reports of MOCVD CdTe using a horizontal reactor. This confirms that, despite the very different reactor geometry, the alkyl radical homolysis and reaction mechanism applies in the case of the inline injector geometry in the work presented here. These results demonstrate an alternative path to high throughput processing of CdTe thin film solar cells by inline AP-MOCVD.     

Self-aggregated Si quantum dots in amorphous Si-rich SiC

Amorphous silicon quantum dots (Si-QDs) self-aggregated in silicon-rich silicon carbide are synthesized by growing with plasma-enhanced chemical vapor deposition on (100)-oriented Si substrate. Under the environment of Argon (Ar)-diluted Silane (SiH₄) and pure methane (CH₄), the substrate temperature and RF power are set as 350 °C and 120 W, respectively, to provide the Si-rich SiC with changing fluence ratio (R = [CH₄ ]/[SiH₄] + [CH₄]). By tuning the fluence ratio from 50% to 70%, the composition ratio x of Si-rich Si_1 ? xC_x film is varied from 0.27 to 0.34 as characterized by X-ray photoelectron spectroscopy (XPS), which reveals the component of Si_2p decreasing from 66.3 to 59.5%, and the component of C_1s increasing from 23.9% to 31% to confirm the formation of Si-rich SiC matrix. Annealing of the SiC sample from 650 °C to 1050 °C at 200 °C increment for 30 min induces the very tiny shift on the wavenumber of the crystalline Si (c-Si) related peak due to the precipitation of Si-QDs within the SiC matrix, and the Raman scattering spectra indicate a broadened Raman peak ranging from 410 to 520 cm^? 1 related to the amorphous Si accompanied with the significant enhancement for SiC bond related peak at 980 cm^? 1. From the high resolution transmission electron microscopy images, the critical temperature for Si-QD precipitation is found to be 850 °C. The self-assembly of the crystallized Si-QDs with the size of 3 ± 0.5 nm and the volume density of (3 ± 1) × 10¹⁸ (#/cm³) in Si-rich SiC film with R = 70% are observed after annealing at higher temperature.     

Influence of the nitrogen flow rate on the order and structure of PECVD boron nitride thin films

Three sets of boron nitride (BN) thin films are deposited with different N₂/B₂H₆ flow ratios (r = 4, 10 and 25) by plasma enhanced chemical vapor deposition (PECVD). The variations of physical properties in different deposition sets are analyzed by optical (XPS, FTIR, UV–visible spectroscopies), mechanical and electrical measurements. The films are considered to be deposited in a turbostratic phase (t-BN). Evolution of bonding configurations with increasing r is discussed. Relatively higher nitrogen flow rate in the source gas mixture results in lower deposition rates, whereas more ordered films, which tend to reach a unique virtual crystal of band gap 5.93 eV, are formed. Anisotropy in the film structure and film inhomogeneity along the PECVD electrode radial direction are investigated.     

Effect of illumination on hydrogenated amorphous silicon thin films doped with chalcogens

Hydrogenated amorphous silicon thin films doped with chalcogens (Se or S) were prepared by the decomposition of silane (SiH₄) and H₂Se/H₂S gas mixtures in an RF plasma glow discharge on 7059 corning glass at a substrate temperature 230 °C. The illumination measurements were performed on these samples as a function of doping concentration, temperature and optical density. The activation energy varied with doping concentration and is higher in Se-doped than S-doped a-Si:H thin films due to a low defect density. From intensity versus photoconductivity data, it is observed that the addition of Se and S changes the recombination mechanism from monomolecular at low doping concentration films to bimolecular at higher doping levels. The photosensitivity (σ_ph/σ_d) of a-Si, Se:H thin films decreases as the gas ratio H₂Se/SiH₄ increased from 10^?4 to 10^?1, while the photosensitivity of a-Si, S:H thin films increases as the gas ratio H₂S/SiH₄ increased from 6.8 × 10^?7 to 1.0×10^?4.     

Reaction mechanism of silicon Cat-CVD

Reaction kinetics for the silicon catalytic chemical vapor deposition (Cat-CVD) has been investigated. SiH₃ and Si₂H₂ are expected to be important precursors in the Si film growth. However, the reactivity of Si₂H₂ to the film surface was not well understood. Quantum chemical calculations have been performed for the adsorption of Si₂H₂ and H₂SiSiH₂ on the Si(1 0 0)-2 × 1 surface with and without the hydrogen termination. It was found that there was no activation barrier for the Si₂H₂ adsorption on the bare Si(1 0 0) surface. The chemical kinetic model for the Si Cat-CVD process was modified according to these quantum chemical calculations. Results of kinetic simulations were compared to the experimental results. It is suggested that there is a correlation between the film quality and the concentration of Si₂H₂.     

New insights in microcrystalline silicon deposition with expanding thermal plasma chemical vapor deposition

We report on further insights in the microcrystalline silicon (μc-Si:H) deposition using expanding thermal plasma chemical vapor deposition. We have shown before that the refractive index at 2 eV of μc-Si:H layers increased if the silane (SiH₄) was injected close to the substrate, while the deposition rate remained the same. We argued that at high injection-ring position, the SiH₄ travels a long way to the substrate and therefore has a long interaction time with the plasma, in particular atomic hydrogen. In this way, the SiH₄ injection position influences the number of hydrogen atoms stripped from the SiH₄ as well as the consumption of atomic hydrogen. In this paper, we present an analysis of the growth flux of depositing particles as function of the radical production rate. The data suggest that there is no dependence on the SiH₄ injection position, implying that the mix of depositing radicals is not changed. However, the data also show the microcrystalline-to-amorphous transition shifts to higher SiH₄ flows for lower injection positions. We therefore now think that it is not the interaction time between the SiH₄ and the arc plasma determining the material properties, but the interaction of excess atomic hydrogen with the μc-Si:H growth surface.