A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

Structural study of undoped and (Mn, In)-doped SnO2 thin films grown by RF sputtering

Undoped and 5%(Mn, In)-doped SnO₂ thin films were deposited on Si(1 0 0) and Al₂O₃ (R-cut) by RF magnetron sputtering at different deposition power, sputtering gas mixture and substrate temperature. X-ray reflectivity was used to determine the films thickness (10–130 nm) and roughness (～1 nm). The combination of X-ray diffraction and Mössbauer techniques evidenced the presence of Sn⁴⁺ in an amorphous environment, for as-grown films obtained at low power and temperature, and the formation of crystalline SnO₂ for annealed films. As the deposition power, substrate temperature or O₂ proportion are increased, SnO₂ nanocrystals are formed. Epitaxial SnO₂ films are obtained on Al₂O₃ at 550 °C. The amorphous films are quite uniform but a more columnar growth is detected for increasing deposition power. No secondary phases or segregation of dopants were detected.     

Deposition of microcrystalline silicon films at ultrafast rate by using a new microwave induced plasma source

Synthesis of microcrystalline silicon (μc-Si) film at an ultrafast deposition rate over 100 nm/s is achieved from SiH₄ + He by using a high density microwave plasma source even without employing H₂ dilution and substrate heating techniques. Systematic deposition studies show that high SiH₄ flow rate and working pressure increase film deposition rate while high He flow rate decreases the rate. On the other hand, crystallinity of deposited Si film decreases with increasing SiH₄ or He flow rate and working pressure. Enhancements of gas phase and surface reactions during film deposition process are responsible for the achievement of high deposition rate and high film crystallinity.     

Crystallization of bismuth titanate and bismuth silicate grown as thin films by atomic layer deposition

Bismuth silicate and bismuth titanate thin films were deposited by atomic layer deposition (ALD). A novel approach with pulsing of two Bi-precursors was studied to control the Si/Bi atomic ratio in bismuth silicate thin films. The crystallization of compounds formed in the Bi₂O₃–SiO₂ and Bi₂O₃–TiO₂ systems was investigated. Control of the stoichiometry of Bi–Si–O thin films was studied when deposited on Si(1 0 0) and crystallization was studied for films on sapphire and MgO-, ZrO₂- and YSZ-buffered Si(1 0 0). The Bi–Ti–O thin films were deposited on Si(1 0 0) substrate. Both Bi–Si–O and Bi–Ti–O thin films were amorphous after deposition. Highly a-axis oriented Bi₂SiO₅ thin films were obtained when the Bi–Si–O thin films deposited on MgO-buffered Si(1 0 0) were annealed at 800 °C in nitrogen. The full-width half-maximum values for 200 peak were also studied. An excess of bismuth was found to improve the crystallization of Bi–Ti–O thin films and the best crystallinity was observed with Ti/Bi atomic ratio of 0.28 for films annealed at nitrogen at 1000 °C. Roughness of the thin films as well as the concentration depth distribution were also examined.     

Optoelectronic properties of hot-wire silicon layers deposited at 100 °C

Hot-wire chemical vapor deposition is employed for the deposition of amorphous and microcrystalline silicon layers at substrate temperature kept below 100 °C with the aid of active cooling of the substrate holder. The hydrogen dilution is varied in order to investigate films at the amorphous-to-microcrystalline transition. While the amorphous layers can be produced with a reasonably low defect density as deduced from subgap optical absorption spectra and a good photosensitivity, the microcrystalline layers are of a lesser quality, most probably due to a decrease of crystallinity during the film growth. In the amorphous growth regime, the Urbach energy values decrease with increasing hydrogen dilution, reaching a minimum of 67 meV just before the microcrystalline threshold. By varying the total gas pressure, the growth rate of the films is changed. The lowest deposition rate of this study (0.16 nm/s) produced the amorphous sample with the highest photoresponse (1 × 10⁶).     

Substrate temperature dependence of microcrystalline silicon growth by PECVD technique

Undoped hydrogenated silicon films have been prepared from a gas mixture of silane and hydrogen, varying substrate temperature from 180–380 °C in an ultrahigh vacuum system using RFPECVD technique. XRD and Raman measurements enable us to know that the films are microcrystalline throughout the substrate temperature range. Bond formation of the SiH films at different substrate temperature is studied through different characterisation techniques like Fourier transform infrared spectroscopy and hydrogen evolution study. The infrared absorption spectroscopy and hydrogen evolution study reveal two types of growth: the formation of a void rich material at low T_s (∼180 °C) and a compact material at comparatively higher T_s.     

Hydrogenated amorphous and nanocrystalline silicon solar cells deposited by HWCVD and RF-PECVD on plastic substrates at 150 °C

In this work we present a study of the structural, optoelectronic and transport properties of a series of Si films deposited in a parameter region (namely hydrogen dilution) corresponding to a transition from amorphous-to-nanocrystalline silicon by hot-wire (HW) and radio-frequency plasma enhanced chemical vapor deposition (RF) on plastic substrates at 150 °C. To achieve a higher deposition rate of Si films by RF we used a relatively high power density (350 mW/cm²) and deposition pressure (1.5 Torr). For certain hydrogen dilution values, these deposition conditions can lead to the formation of Si crystals in the silane plasma and to a growth of polymorphous silicon film. This material has improved carrier transport properties (ambipolar diffusion length = 220 nm) and very high photosensitivity (>5 × 10⁶). The best HW amorphous silicon films exhibited lower photosensitivity (7 × 10⁴) and an ambipolar diffusion length of only 100 nm. For solar cell fabrication, we optimized the RF deposition conditions to produce very thin amorphous and nanocrystalline phosphorous and boron doped silicon layers. Our best n–i–p solar cell, with a polymorphous Si intrinsic layer deposited on plastic, has an efficiency of 5.5%, FF = 52.5%, V_OC = 920 mV, J_SC = 11.6 mA/cm². For solar cells with a nanocrystalline Si active layer deposited on glass the following results were achieved: efficiency = 3.4%, FF = 43.5%, V_OC = 460 mV, J_SC = 17.2 mA/cm²; and on plastic substrate: efficiency = 2.2%, FF = 32.7%, V_OC = 397 mV, J_SC = 17.2 mA/cm².     

Effect of deposition pressure on microstructure and properties of hydrogenated carbon nitride films prepared by DC-RF-PECVD

Hydrogenated carbon nitride (a-CN:H films) were deposited on n-type (1 0 0) silicon substrates making use of dual direct current radio frequency plasma enhanced chemical vapor deposition (DC-RF-PECVD), at working pressure of 2–20 Pa, using a mixed gas of CH₄ and N₂ as the source gas. The growth rate, composition, bonding structure of the deposited films were characterized by means of XPS and FTIR, and the mechanical properties of the deposited films were investigated by nano-indentation test. It was found that the parameters for the DC-RF-PECVD process had significant effects on the growth rate, structure and properties of the deposited films. The growth rate of the deposited films increased at first with increasing deposition pressure, then saturated with further increase of the deposition pressure. The N/C ratio inside the deposited films increased with increasing working pressure except that it was as much as 0.50 at a working pressure of 5.0 Pa. The nano-hardness of the films decreased with increasing deposition pressure. CN radicals were remarkably formed in the deposited films at higher pressures, and their contents are related to the nitrogen concentrations in the deposited films.     

Growth and characterization of GaN and AlN films on (1 1 1) and (0 0 1) Si substrates

GaN and AlN films were grown on (1 1 1) and (0 0 1) Si substrates by separate admittances of trimethylgallium (or trimethylaluminum) and ammonia (NH₃) at 1000°C. A high temperature (HT) or low temperature (LT) grown AlN thin layer was employed as the buffer layer between HT GaN (or HT AlN) film and Si substrate. Experimental results show that HT AlN and HT GaN films grown on the HT AlN-coated Si substrates exhibit better crystalline quality than those deposited on the LT AlN-coated Si substrates. Transmission electron microscopy (TEM) of the HT GaN/HT AlN buffer layer/(1 1 1)Si samples shows a particular orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. High quality HT GaN films were achieved on (1 1 1) Si substrates using a 200 Å thick HT AlN buffer layer. Room temperature photoluminescence spectra of the high quality HT GaN films show strong near band edge luminescence at 3.41 eV with an emission linewidth of ∼110 meV and weak yellow luminescence.     

Plasma enhanced chemical vapor deposition of ZnO thin films

Zinc oxide thin films were deposited on silicon and corning-7059 glass substrates by plasma enhanced chemical vapor deposition at different substrate temperatures ranging from 36 to 400 °C and with different gas flow rates. Diethylzinc as the source precursor, H₂O as oxidizer and argon as carrier gas were used for the preparation of ZnO films. Structural and optical properties of these films were investigated using X-ray diffraction, reflection high energy electron diffraction, atomic force microscopy and photoluminescence. Highly oriented films with (0 0 2) preferred planes were obtained on silicon kept at 300 °C with 50 ml/min flow rate of diethylzinc without any post annealing. Reflection high energy electron diffraction pattern also showed the crystalline nature of these films. A textured surface with rms roughness ∼28 nm was observed by atomic force microscopy for the films deposited at 300 °C. A sharp peak at 380 nm in the PL spectra indicated the UV band-edge emission.     

Growth chemistry of nanocrystalline silicon and germanium films

We report on the growth of nanocrystalline Si:H and Ge:H films. The films were grown using plasma deposition and hot wire chemical growth techniques. Conditions such as pressure, temperature and hydrogen dilution were systematically varied. It is shown that excessive hydrogen dilution during growth leads to smaller grains in nanocrystalline Si and Ge. Films with very large grains (56 nm) could be obtained using hot wire growth techniques under appropriate conditions of growth. From the data, it is concluded that the natural growth direction for the films is 〈2 2 0〉, and that excessive bonded hydrogen leads to smaller grains.     

Large grain μc-Si:H films deposited at low temperature: Growth process and electronic properties

We have studied structural and electronic properties of μc-Si:H films deposited from SiH₄ + H₂ and SiH₄ + H₂ + Ar gas mixtures. The use of Ar containing gas mixtures for depositions allows us to increase deposition rate by a factor of two and to obtain films with an important fraction of large grains in comparison with SiH₄ + H₂ gas mixtures. Electronic properties of fully crystallized films become more intrinsic with the increase of large grain fraction. Deposition of highly p- and n-doped μc-Si:H layers from the dopant/SiH₄ + H₂ gas mixture at a temperature of 175 °C is possible without any remarkable changes in crystallinity in comparison with undoped films deposited with the same discharge conditions.     

Crystalline growth of germanium thin films on single crystal silicon substrates by solid phase crystallization

We have studied the epitaxial-like growth of germanium (Ge), due to solid phase crystallization (SPC) from amorphous Ge (a-Ge) deposited on single crystal silicon (Si) substrate. The crystalline growth of Ge following the orientation of Si substrates was successfully obtained by the SPC at 400 °C or higher. The preferential growth on Si (111) substrates continues up to 10,000 Å. Different orientations from the substrate orientation in XRD patterns are slightly observed in the growth on Si (100) substrates at 450 °C, but the preferential growth of (100) orientation continued in the whole film thickness in TEM images. The epitaxial-like growth of Ge may be more preferable on the Si (111) substrate than the (100) one.     

Photoluminescence of Si nanocrystallites in different types of matrices

This paper presents the comparative investigation of photoluminescence (PL) and its temperature dependence for rf-magnetron co-sputtered Si-enriched SiO_x systems and amorphous Si films prepared by hot-wire CVD method with Si nanocrystallites of different sizes. It is shown that PL spectra of Si–SiO_x films consist of the five PL bands peaked at 1.30, 1.50, 1.76, 2.05 and 2.32 eV. Amorphous Si films with Si nanocrystallites are characterized by three PL bands only peaked at 1.35, 1.50 and 1.76 eV. The peak position of the 1.50 eV PL band shifts with the change of Si quantum dot sizes and it is attributed to exciton recombination inside of Si quantum dots. The nature of four other PL bands is discussed as well.     

Effect of hot-wire passivation on the properties of hydrogenated microcrystalline silicon films to reduce post-deposition oxidation

Hydrogenated microcrystalline silicon (μc-Si:H) films have a large number of grain boundaries that oxidize after deposition, leading to deterioration of device performance. In this study, post-treatment of μc-Si:H thin films was carried out with methane-related radicals generated by a hot wire. The effect of the hot-wire passivation on the properties of the μc-Si:H thin films was investigated using Fourier-transform infrared (FT-IR) transmission spectroscopy. Through post-treatment, hydrogen on the silicon-crystallite surface was substituted with hydrocarbon. Further, an increase in filament temperature (T_ft) was found to enhance passivation. For films treated at T_ft above 1700 °C, post-oxidation and nitridation hardly occurred, whereas films treated at T_ft below 1400 °C were oxidized and nitrided even after post-treatment.     

Growth of germanium sulfide by hot wire chemical vapor deposition for nonvolatile memory applications

The growth of amorphous germanium sulfide (Ge–S) thin films using the hot wire chemical vapor deposition method has been performed at deposition temperatures in the range of 22–450 °C and pressures between 100 and 1800 Pa. Tetraallylgermanium and propylene sulfide were used as precursors for germanium and sulfur, respectively. The growth rate varies in the range of 1 and 100 nm/min and increases with increasing pressure and decreasing temperature. However, only the films deposited with lower growth rate exhibit conformal filling and good step coverage that could be observed at a growth rate of approximately 20 nm/min. Higher temperatures yield higher Ge content in the Ge–S films. In addition, the typical resistive switching behavior (three or four orders of magnitude) indicated that those films are suitable for nonvolatile memory applications.     

Thermodynamic analysis of gas phase chemistry in hot wire chemical vapor deposition of a-Si:H and μc-Si:H

Gas phase reactions amongst filament-generated radicals play a crucial role in growth and properties of films deposited by hot wire chemical vapor deposition (HWCVD) technology. Gas phase species of interest are SiH₄, H₂, Si, H, SiH₃, SiH₂ and SiH. Partial pressures of these species for different sets of deposition conditions have been determined from the standard Gibbs free energy data. Equilibrium concentrations of the film forming precursors have been determined. The effect of the various process parameters on the equilibrium concentration of the precursors has been studied. H, Si and SiH are found to be the dominant species in gas phase above a filament temperature of 2300 K. However SiH₃ and SiH₂ concentration peaks are between 1900 and 2300 K, of the filament temperature.     

Growth of pure ZnO thin films prepared by chemical spray pyrolysis on silicon

Structural, morphological, optical and electrical properties of ZnO thin films prepared by chemical spray pyrolysis from zinc acetate (Zn(CH₃COO)₂ 2H₂O) aqueous solutions, on polished Si(1 0 0), and fused silica substrates for optical characterization, have been studied in terms of deposition time and substrate temperature. The growth of the films present three regimes depending on the substrate temperature, with increasing, constant and decreasing growth rates at lower, middle, and higher-temperature ranges, respectively. Growth rate higher than 15 nm min⁻¹ can be achieved at T_s=543 K. ZnO film morphological and electrical properties have been related to these growth regimes. The films have been characterized by X-ray diffraction, scanning electron microscopy and X-ray photoelectron spectroscopy.     

MOCVD and characterization of Hf-silicate thin films using HTB and TEMAS

Hafnium silicate (HfSi_xO_y) films were deposited by metal-organic chemical vapor deposition (MOCVD) using a combination of precursors: hafnium tetra-tert-butoxide [Hf(OC(CH₃)₃)₄, HTB] and tetrakis-ethylmethylamino silane [Si(N(C₂H₅)(CH₃))₄, TEMAS]. The activation energy was independent on the ratio of precursor amounts in the surface reaction regime. The grown films showed Hf-rich characteristics and the impurity concentrations were less than 1 at.% (below detection limits). Hafnium silicate films were amorphous up to 700 °C annealing. Hf/(Hf + Si) composition ratio and dielectric constant (k) of the Hf-silicate films decreased by increasing the growth temperature above 270 °C.     

Electron beam poling in amorphous Ge-doped H:SiO2 films

Amorphous Ge-doped H:SiO₂ films on silica, deposited by matrix-distributed electron cyclotron resonance – plasma enhanced chemical vapor deposition, were irradiated with an electron beam while varying the dose. Using the Maker fringe method, second-harmonic generation was measured in the irradiated regions of the films. With a current of 5 nA, and an acceleration voltage of 25 kV for 25 s, a Ge-doped H:SiO₂ film (3.8 at.% Ge) showed a maximum second-order nonlinearity of d₃₃ = 0.0005 pm/V. In contrast, a H:SiO₂ film with a smaller Ge content (1.0 at.% Ge), showed a large SHG: d₃₃ = 0.06 pm/V when irradiated for 15 s. The second-harmonic generation in the films is caused by a frozen-in electric field induced by charge implantation from the electron beam. The strength of the electric field is determined by two conditions: the trapping centers (numbers, depth) and the remaining conductivity under large electric field.