Spectroscopic ellipsometry study of nickel induced crystallization of a-Si

The aim of this work is to present a spectroscopic ellipsometry study focused on the annealing time effect on nickel metal induced crystallization of amorphous silicon thin films. For this purpose silicon layers with 80 and 125 nm were used on the top of which a 0.5 nm Ni thick layer was deposited. The ellipsometry simulation using a Bruggemann Effective Medium Approximation shows that films with 80 nm reach a crystalline fraction of 72% after 1 h annealing, appearing to be full crystallized after 2 h. No significant structural improvement is detected for longer annealing times. On the 125 nm samples the crystalline volume fraction after 1 h is only around 7%, requiring 5 h to get a similar crystalline fraction than the one achieved with the thinner film. This means that the time required for full crystallization will be strongly determined by the Si layer thickness. Using a new fitting approach the Ni content within the films was also determined by SE and related to the silicon film thickness.     

Crystallization kinetics of 1Na2O · 2CaO · 3SiO2 · glass monitored by electrical conductivity measurements

We investigated the kinetics of crystal nucleation, growth, and overall crystallization of a glass with composition close to the stoichiometric 1Na₂O · 2CaO · 3SiO₂. The nucleation and subsequent growth of sodium-rich crystals in this glass decreases the sodium content in the glassy matrix, drastically hindering further nucleation and growth. Compositional changes of the crystals and glassy matrix at different stages of the crystallization process were determined by EDS. These compositional variations were also monitored by electrical conductivity measurements, carried out by impedance spectroscopy, in glassy, partially, and fully crystallized samples. The electrical conductivity of both crystalline and glassy phases decreases with the increase of the crystallized volume fraction. Starting at a crystallized volume fraction of about 0.5, the crystalline phase dominates the electrical conductivity of the sample. This behavior was corroborated by an analysis of the activation energy for conduction. We show that electrical conductivity is highly sensitive and can indicate compositional shifts, changes in the spatial distribution of mobile ions in the glassy matrix. Conductivity measurements are thus a powerful tool for the investigation of complex heterogeneous systems, such as partially crystallized glasses and glass-ceramics.     

Infrared semiconductor laser irradiation used for crystallization of silicon thin films

We report the rapid thermal crystallization of silicon films using infrared semiconductor laser. Carbon films were used on silicon films to absorb the laser light. Uniform crystalline regions were achieved by a line shape laser beam with a length of 20 μm. Polycrystalline silicon thin film transistors were fabricated in crystallized regions. The effective electron carrier mobility and threshold voltage were achieved to be 130 cm²/Vs and 0.4 V, respectively, when the crystalline volume ratio of the silicon films was 0.95.     

Cross-sectional TEM study on Ni-mediated crystallization of amorphous silicon

Structural characteristics of polycrystalline silicon (poly-Si) made by Ni-mediated crystallization of amorphous silicon (a-Si) were investigated by cross-sectional transmission electron transmission (XTEM) according to various a-Si thickness. The Ni area density of ∼10¹⁴ cm⁻² was deposited onto a-Si and it was annealed at 500 °C in the presence of an electric field of 10 V/cm. It is found that NiSi₂ precipitates form at the top and bottom interfaces of a-Si during annealing. After reaching its critical size the crystallization proceeds from the top and bottom interfaces. The growth of needle-like Si crystallites has been seen, showing a migration of NiSi₂ precipitates through the a-Si network. 1700 nm thick a-Si can be crystallized within 30 min which is longer than that (10 min) of 50 nm thick a-Si. However, the quality of 50 nm thick poly-Si is better than that of 300 nm or 1700 nm thick poly-Si.     

Argon-plasma-induced growth of crystalline grains in microcrystalline silicon: Formation mechanism of grains

A thick (∼300 nm) microcrystalline silicon (μc-Si:H) film with a low crystalline volume fraction (∼24%) and a columnar grain size of about 100 nm was exposed to an argon plasma at a substrate temperature of 220 °C after deposition. It is shown that argon plasma treatment significantly enhances film-crystallinity throughout the μc-Si:H layer: over a factor of 2 in crystalline fraction and by a factor of 3 in columnar grain size after a 90-min argon treatment. Based on these experimental results, it is proposed that crystallization of μc-Si:H is likely mediated by the energy transferred from energetic argon atoms.     

Optical and structural properties of hydrogenated silicon films prepared by rf-magnetron sputtering at low growth temperatures: Study as function of argon gas dilution

Two series of hydrogenated silicon thin films were deposited by the rf-magnetron sputtering (RFMS) at relatively low growth temperatures (T_s = 100 °C), in order to use the new generation of substrates sensitive to elevated temperatures. The effect of the argon gas diluted in hydrogen, on the optical and on the structural properties was carefully investigated by means of optical transmission (OT) measurements, Fourier transform infrared spectroscopy and spectroscopic ellipsometry (SE) technique. The results of this investigation suggest the existence of a threshold dilution around a gas mixture of argon (40%) and hydrogen (60%) for which the crystallization occurs, even at low deposition temperatures. The difference between the amorphous and the crystallized structures is well revealed by the OT and the IR absorption results, and strongly confirmed by the SE ones. The production of Si crystallites in the plasma as means of producing nanocrystalline by RFMS is suggested.     

Generating ordered Si nanocrystals via atomic force microscopy

We describe two successful routes for generating ordered arrays of Si nanocrystals by using atomic force microscopy (AFM) and amorphous silicon thin films (200–400 nm) on Ti/Ni coated glass substrates. First, we show that field-enhanced metal-induced solid phase crystallization at room temperature can be miniaturized to achieve highly spatially localized (below 100 nm) current-induced crystallization of the amorphous silicon films using a sharp tip in AFM. In the second route, resistive nano-pits are formed at controlled positions in the amorphous silicon thin films by adjusting (lowering and/or stabilizing) the exposure currents in the AFM process. Such templated substrates are further used to induce localized growth of Si nanocrystals in plasma-enhanced chemical vapor deposition process. In both cases the crystalline phase is identified in situ as features of enhanced current in current-sensing AFM maps.     

Correlation between the method of preparation and the properties of the sol–gel HfO2 thin films

This work describes the preparation of HfO₂ thin films by the sol–gel method, starting with different precursors such as hafnium ethoxide, hafnium 2,4-pentadionate and hafnium chloride. From the solution prepared as mentioned above, thin films on silicon wafer substrates have been realized by ‘dip-coating’ with a pulling out speed of 5 cm min^?1. The films densification was achieved by thermal treatment for 10 min at 100 °C and 30 min at 450 °C or 600 °C, with a heating rate of 1 °C min^?1. The structural and optical properties of the films are determined employing spectroellipsometric (SE) measurements in the visible range (0.4–0.7 μm), transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM). The main objective of this paper was to establish a correlation between the method of preparation (precursor, annealing temperature) and the properties of the obtained films. The samples prepared from pentadionate and ethoxide precursors are homogenous and uniform in thickness. The samples prepared starting from chloride precursor are thicker and proved to be less uniform in thickness. Higher non-uniformity develops in multi-deposition films or in crystallized films. A nano-porosity is present in the quasi-amorphous films as well in the crystallized one. For the samples deposited on silicon wafer, the thermal treatment induced the formation of a SiO₂ layer at the coating–substrate interface.     

Electron and hole transport in microcrystalline silicon solar cells studied by time-of-flight photocurrent spectroscopy

A photocurrent time-of-flight study of carrier transport in microcrystalline silicon pin diodes prepared over a range of crystallinities is presented. Electron and hole drift mobilities at a crystalline volume fraction >0.35 are typically 3.8 and 1.3 cm²/(V s) respectively at 300 K and a thickness to electric field ratio of 1.8 × 10⁻⁷ cm²/V. A factor of five enhancement in hole mobility over amorphous silicon persists at a crystalline volume fraction as low as 0.1. Current decays are dispersive and mobilities are thermally activated, although detailed field-dependence is still under investigation. Evidence for a sharp fall in the density of states at 0.13 eV above the valence band edge is presented. Similarities in behaviour with certain amorphous and polymorphous silicon samples are identified.     

The characteristics of solid phase crystallized (SPC) polycrystalline silicon thin film transistors employing amorphous silicon process

We investigated the electrical properties of polycrystalline silicon (poly-Si) thin film transistors (TFTs) employing field-enhanced solid phase crystallization (FESPC). An n+ amorphous silicon (n+ a-Si) layer was deposited to improve the contact resistance between the active Si and source/drain (S/D) metal instead of ion doping. By using C–V measurement method, we could explain the diffused phosphorous ions (P+ ions) on the channel surface caused a negatively shifted threshold voltage (V_TH) of ?7.81 V at a drain bias of 0.1 V, and stretched out a subthreshold swing (S) of 1.698 V/dec. This process was almost compatible with the widely used hydrogenated amorphous silicon (a-Si:H) TFT fabrication process and also offers a better uniformity when compared to the conventional laser-crystallized poly-Si TFT process because of non-laser crystallization.     

Influence of crystalline volume fraction on the performance of high mobility microcrystalline silicon thin-film transistors

The influence of the crystalline volume fraction of hydrogenated microcrystalline silicon on the device performance of thin-film transistors fabricated at temperatures below 200 °C was investigated. Transistors employing microcrystalline silicon channel material prepared close to the transition to amorphous growth regime exhibit the highest charge carrier mobilities exceeding 50 cm²/V s. The device parameters like the charge carrier mobility, the threshold voltage and the subthreshold slope will be discussed with respect to the crystalline volume fraction of the intrinsic microcrystalline silicon material.     

Thermal annealing of a-Si/Au superlattice thin films

The superlattice films, which consist of amorphous silicon (a-Si) and amorphous gold (Au), were prepared by ultra-high vacuum evaporation system. The first layer was grown a-Si with a thickness of 4.2 nm and the second layer was grown Au with a thickness of 0.8 nm. Thermal annealing was performed at 473, 673, and 873 K, respectively. The structural properties of the films were investigated using transmission electron microscope (TEM), X-ray diffraction (XRD), and Raman scattering spectroscopy. The electrical property was assessed by the temperature dependence of electrical conductivity. A crystallization of Si and a forming of Au nanoparticles were observed in all of the annealing films. The crystalline volume fraction reached 70% by annealing time for 15 min. An average diameter of the Au nanoparticles embedded in Si matrix also increased with increasing the annealing temperature. At annealing temperature above 873 K, Au atoms migrated toward the film surface. It was observed that the electrical conductivity changed in several temperatures.     

Complex primary crystallization kinetics of amorphous Finemet alloy

The complex primary crystallization kinetics of the amorphous Finemet soft magnetic alloys has been analyzed by non-isothermal DSC measurements. The local activation energies E_c(α) were determined by an isoconversional method without assuming the kinetic model function and its average value was about 383 kJ/mol. The nucleation activation energy E_n and growth activation energy E_g were 425 and 333 kJ/mol, respectively. And the apparent local activation energies E_c can be expressed by E_n and E_g as follows: E_c = aE_n + bE_g. The local Avrami exponents lies between 1 and 2 in a wide range of 0.2 < α < 0.9, and it indicates that dominating crystallization mechanism in the non-isothermal primary crystallization of amorphous Finemet alloy is one dimensional growth at a near-zero nucleation rate for surface crystallization. The significant variation of local Avrami exponent and local activation energy for primary crystallization with crystallized volume fraction demonstrates that the primary crystallization kinetics of amorphous Finemet alloy varies at different stages. In addition, the variable local activation energies E_c(α) and local Avrami exponents n(α) are applicable and correct in describing the primary crystallization process of the amorphous Finemet alloy according to the theoretical DSC curve simulation.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

Spatially localized current-induced crystallization of amorphous silicon films

Field-enhanced metal-induced solid phase crystallization (FE-MISPC) at room temperature is employed to create microscopic crystalline regions at predefined positions in hydrogen-rich amorphous silicon (a-Si:H) films. Electric field is applied locally using a sharp conductive tip in atomic force microscope (AFM) and nickel electrode below the a-Si:H film. The process is driven by a constant current of ?50 pA to ?500 pA while controlling the amount of transferred energy (1–300 nJ) as a function of time. Passing current leads to a formation of nanoscale pits in the a-Si:H films. Depending on the energy amount and rate the pits exhibit lower or orders of magnitude higher conductivity as detected by current-sensing AFM. High conductivity is attributed to a local crystallization of the films. This is confirmed by micro-Raman spectroscopy.     

Cw argon laser crystallization of silicon films: Structural properties

This paper deals with the structural characterization of amorphous silicon films deposited on glass in the amorphous state and then post-crystallized using a continuous wave argon laser. In opposite to the excimer laser crystallization method, the processing window is wider. Due to the low cooling rate induced by the continuous irradiation, very large grains are obtained. With an epitaxial growth induced by an adequate overlapping of the laser traces, grains as large as 100 μm can be reached. Electron back-scattered diffraction analysis highlights the single crystalline character of the large size grains crystallized with this kind of laser. The technique is able to produce large area single crystalline regions, suitable to fabricate high speed circuits.     

Observation of HfO2 thin films by deep UV spectroscopic ellipsometry

Deep UV spectroscopic ellipsometry (SE) is used for structure change observations in thin hafnia (HfO₂) layers deposited by p-MOCVD on silicon substrate. The absorption edge E_g and most of the critical point transitions in HfO₂ are above 6 eV, which makes the extension to Deep UV SE (5–9 eV) very suitable. The phase mixture changes as function of thickness and deposition process temperature, deduced from SE correspond well to XRD and Angle Resolved (AR)-XPS spectroscopy observations. From the absorption spectra at 4.5 eV, defects such as oxygen vacancies are detected, whereas from XPS spectra the estimation of the O/Hf ratio follows the same trend. Deep UV SE reveals differences in the dielectric function with orthorhombic/monoclinic phase mixtures essentially with peaks at 7.5 and 8.5 eV. Quantum confinement originated from the grain size of the films and the excitonic origin of the 6 eV feature are discussed.     

Dependences of the crystallization behavior of Al–Ni–La amorphous alloys on La and Ni contents

Crystallization behaviors of Al–Ni–La amorphous alloys with a fixed Ni (La) content of 6 at.% were investigated by X-ray diffraction and differential scanning calorimeter when the La (Ni) content changes from 3 to 9 at.%. The results show that the thermal stability of the amorphous alloys monotonically increases with increasing the La (Ni) content. Glass transition only exists in the alloys with the La (Ni) content higher than 6 at.%. La plays a more significant role than Ni in promoting the glass-forming ability, improving the thermal stability, stabilizing the supercooled liquid region, depressing the precipitation of fcc-Al in the first crystallization process and increasing the apparent activation energy of the first reaction.     

Aluminum induced formation of SiGe alloy in Ge/Si/Al thin film structure

In this work, a study of aluminum induced crystallization (AIC) of thin film germanium/silicon/aluminum (Ge/Si/Al) structure on oxidized silicon is presented. The Ge/Si/Al trilayer structure was prepared in three consecutive thin film deposition processes. The AIC was performed in nitrogen at 500 °C within time duration between 1 and 9 h. The progress of crystallization was monitored by optical microscopy, Raman spectroscopy, X-ray diffraction (XRD) and scanning electron microscopy (SEM) combined with energy dispersive X-ray spectroscopy (EDS). It was found that in Ge/Si/Al structure the AIC can lead to formation of SiGe alloy at temperature of 500 °C. This presents an alternative low-temperature formation method of SiGe which is suitable for integration with the conventional Si technology in electronic device fabrication.     

Crystallization behavior and microstructure of (CaO·ZrO2·SiO2)–Cr2O3 based glasses

The effects of chromium oxide on the crystallization behavior of glass compositions in the calcium, zirconium and silicon oxides system were investigated by differential thermal analysis, X-ray diffraction and scanning electron microscopic. Results indicate that crystallization is predominantly controlled by a surface nucleation mechanism, even though a partial bulk nucleation has been encountered in compositions containing more than 1.0 mol% of doping oxide. The effect of heating rate on differential thermal analysis curves was studied in order to investigate nucleation mechanisms and to extract the corresponding crystal growth activation energies E_c for the different crystalline phases. Activation energy (E_c) was found to be 490 ± 5 kJ/mol for 5.0 mol% chromium oxide in glasses. The most suitable nucleation temperature was determined as 810 °C for the above mentioned glass. The results of this study have highlighted that a small percentage of chromium oxide strongly affects the crystal formation thereby reducing the time and temperature of the thermal treatment and enhancing the degree of crystallization of calcium, zirconium and silicon oxides glasses.