Structural and optical properties of ZnO thin films deposited onto ITO/glass substrates

ZnO films were prepared by post deposition thermal oxidation in the ambient atmosphere of metallic Zn films (d = 100–170 nm) vacuum evaporated onto unheated indium tin oxide (ITO)-coated glass substrates. To study the effect of the substrate position during the Zn film deposition on the microstructure and optical properties (transmittance, reflectance and absorbance) of as obtained ZnO films, two set of Zn samples simultaneously deposited onto horizontally and obliquely arranged substrates were prepared. The as obtained ZnO films had a polycrystalline wurtzite structure, those obtained from normally deposited Zn films having a higher c-axis preferred orientation and a lower optical transmittance in the visible wavelength range. The optical band-gap was found to be of 3.14 eV for oxidized normally deposited virgin Zn films and of 3.16 eV for those obliquely deposited.     

Absorption and luminescence in amorphous SixGe1-xO2 films fabricated by SPCVD

Optical absorption and photoluminescence of Ge-doped silica films fabricated by the surface-plasma chemical vapor deposition (SPCVD) are studied in the 2–8 eV spectral band. The deposited on silica substrate films of about 10 μm in thickness are composed as x·GeO₂-(1-x)·SiO₂ with x ranging from 0.02 to 1. It is found that all as‐deposited films do not luminesce under the excitation by a KrF (5 eV) excimer laser, thus indicating lack of oxygen deficient centers (ODCs) in them. After subsequent fusion of silicon containing (x < 1) films by a scanning focused CO₂ laser beam absorption band centered at 5 eV as well as two luminescence bands centered at blue (3.1 eV) and UV (4.3 eV) wavelengths arise, highlighting the formation of the ODCs. The excitation of unfused SPCVD films by an ArF (6.4 eV) excimer laser yields a luminescence spectrum with two bands typical for the ODCs, but with a faster decay kinetics. Intensities of these bands grow up with samples cooling down to a temperature of 80–60 K. Unfused films excited by the ArF laser also demonstrate luminescence due to recombination of a trapped charge resulted from the excitation of localized electron states of the glass network. In the unfused GeO₂ film luminescence related to a self-trapped exciton (STE) typical for GeO₂ crystals with α-quartz structure is observed. The observed STE luminescence can be indicative of the crystalline fraction availability in the film. Whereas GeO₂ crystals are known as not containing twofold coordinated germanium, a polycrystalline inclusion in the SPCVD GeO₂ film serves as a factor explaining the absence of any spectroscopic manifestation of this type of defects in it even after fusion. On the other hand, lack of STE luminescence in other unfused films with x < 1 testifies truly amorphous state of the matter in them.     

Toward the fast deposition of highly crystallized microcrystalline silicon films with low defect density for Si thin-film solar cells

In this study, employing a high-density, low-temperature SiH₄–H₂ mixture microwave plasma, we investigate the influence of source gas supply configuration on deposition rate and structural properties of microcrystalline silicon (μc-Si) films, and demonstrate the plasma parameters for fast deposition of highly crystallized μc-Si films with low defect density. A fast deposition rate of 65 Å/s has been achieved for a SiH₄ concentration of 67% diluted in H₂ with a high Raman crystallinity of X_c > 65% and a low defect density of (1–2) × 10¹⁶ cm⁻³ by adjusting source gas supply configuration and plasma conditions. A sufficient supply of deposition precursors, such as SiH₃, as well as atomic hydrogen H on film growing surface is effective for the high-rate synthesis of highly crystallized μc-Si films, for the reduction in defect density, and for the improvement in film homogeneity and compactability. A preliminary result of p–i–n structure μc-Si thin-film solar cells using the resulting μc-Si films as an intrinsic absorption layer is presented.     

Optoelectronic properties of hot-wire silicon layers deposited at 100 °C

Hot-wire chemical vapor deposition is employed for the deposition of amorphous and microcrystalline silicon layers at substrate temperature kept below 100 °C with the aid of active cooling of the substrate holder. The hydrogen dilution is varied in order to investigate films at the amorphous-to-microcrystalline transition. While the amorphous layers can be produced with a reasonably low defect density as deduced from subgap optical absorption spectra and a good photosensitivity, the microcrystalline layers are of a lesser quality, most probably due to a decrease of crystallinity during the film growth. In the amorphous growth regime, the Urbach energy values decrease with increasing hydrogen dilution, reaching a minimum of 67 meV just before the microcrystalline threshold. By varying the total gas pressure, the growth rate of the films is changed. The lowest deposition rate of this study (0.16 nm/s) produced the amorphous sample with the highest photoresponse (1 × 10⁶).     

Observation of HfO2 thin films by deep UV spectroscopic ellipsometry

Deep UV spectroscopic ellipsometry (SE) is used for structure change observations in thin hafnia (HfO₂) layers deposited by p-MOCVD on silicon substrate. The absorption edge E_g and most of the critical point transitions in HfO₂ are above 6 eV, which makes the extension to Deep UV SE (5–9 eV) very suitable. The phase mixture changes as function of thickness and deposition process temperature, deduced from SE correspond well to XRD and Angle Resolved (AR)-XPS spectroscopy observations. From the absorption spectra at 4.5 eV, defects such as oxygen vacancies are detected, whereas from XPS spectra the estimation of the O/Hf ratio follows the same trend. Deep UV SE reveals differences in the dielectric function with orthorhombic/monoclinic phase mixtures essentially with peaks at 7.5 and 8.5 eV. Quantum confinement originated from the grain size of the films and the excitonic origin of the 6 eV feature are discussed.     

Crystallinity of the mixed phase silicon thin films by Raman spectroscopy

Raman spectra of the mixed phase silicon films were studied for a sample with transition from amorphous to fully microcrystalline structure using four excitation wavelengths (325, 514.5, 632.8 and 785 nm). Factor analysis showed the presence of two and only two spectrally independent components in the spectra within the range from 250 to 750 cm^?1 for all four excitation wavelengths. The 785 nm excitation was found optimal for crystallinity evaluation and by comparison with surface crystallinity obtained by atomic force microscopy, we have estimated the ratio of integrated Raman cross-sections of microcrystalline and amorphous silicon at this wavelength as y = 0.88 ± 0.05.     

A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

Epitaxial growth of the metastable phase ytterbium monoxide on gallium nitride surfaces

Molecular beam deposition systems allow for unparalleled control of film composition and structure. This article addresses the capacity for controlling metal and oxidant fluxes in the Yb/O₂ system to access the metastable phase ytterbium monoxide (YbO). Experiments exploring the growth of polycrystalline YbO_x films by molecular beam deposition demonstrate that a 2:1 molar ratio of Yb:O₂ fluxes is necessary to achieve preferential growth of the divalent oxide. Applying similar deposition conditions to a (0 0 1) GaN surface leads to the growth of epitaxial (1 1 1) YbO films. Similar to other rocksalt oxides grown on GaN surfaces, YbO films display a 3D growth mechanism that leads to a grainy morphology with crystallites of 50 nm lateral dimensions. Rocking curves in ω and φ have full-width half-maximum values of 1.77° and 4.1°, respectively; further improvements in crystal quality appear to be limited by the thermal stability of the YbO phase.     

Characterization of chromium silicide thin layer formed on amorphous silicon films

A detailed investigation of the compositional, optical and electrical properties of a chromium silicide layer grown at room temperature on top of doped amorphous silicon films is presented. The formation of the layer is promoted only when phosphorous atoms are present in the film. The deposition of a very thin n-type doped layer (around 5 nm) on top of a p-type doped film has allowed us to achieve the chromium silicide formation also on p-type material without changing its doping properties. Angle resolved X-ray photoelectron spectroscopy measurements demonstrate the presence of chromium-oxide, chromium silicide and metallic chromium in similar percentages for both p- and n-type doped layers. From the ellipsometric analysis, the refractive index spectra have been extracted, and the layer thickness has been estimated to be 5 nm for both p- and n-type doped layers. From planar conductivity measurements, we have found that the chromium silicide promotes an activation energy reduction from 0.24 eV down to 0.017 eV for the n-type layer and from 0.36 eV down to 0.14 eV for the p-type film.     

Effect of tellurium deposition rate on the properties of Cu–In–Te based thin films and solar cells

To investigate the effects of tellurium (Te) deposition rate on the properties of Cu–In–Te based thin films (Cu/In=0.30–0.31), the films were grown on both bare and Mo-coated soda-lime glass substrates at 200 °C by co-evaporation using a molecular beam epitaxy system. The microstructural properties were examined by means of scanning electron microscopy and X-ray diffraction. The crystalline quality of the films was improved with increase in the deposition rate of Te, and exhibited a single CuIn₃Te₅ phase with a highly preferred (1 1 2) orientation. Te-deficient film (Te/(Cu+In)=1.07) grown with a low Te deposition rate showed a narrow bandgap of 0.99 eV at room temperature. The solar cell performance was affected by the deposition rate of Te. The best solar cell fabricated using CuIn₃Te₅ thin films grown with the highest deposition rate of Te (2.6 nm/s) yielded a total area (0.50 cm²) efficiency of 4.4% (V_oc=309 mV, J_sc=28.0 mA/cm², and FF=0.509) without light soaking.     

Influence of deposition conditions for bottom cell on micromorph tandem device performance

We have realized micromorph tandem solar cells on Asahi U-type TCO-covered glass substrates. The intrinsic layers of both amorphous top cell and microcrystalline bottom cell are grown by very high frequency plasma enhanced chemical vapour deposition (VHF-PECVD) at 100 MHz at low substrate temperature (150 °C). For the bottom cell different growth regimes have been explored by changing both chamber pressure and plasma power. The effect of the structural composition of the microcrystalline absorber layer on the electrical parameters of the device has been investigated. High short circuit current density and constant FF in a wide silane concentration range are obtained when using large power to pressure ratio (0.5 W/Pa). However, low open circuit voltage is generally found in this regime. The largest V_OC values are found at 67 Pa and power to pressure ratio of 0.3 W/Pa, where the highest efficiency (11.1%) is reached. An evaluation of device stability has been done by exposing the tandem solar cells to white light (AM 1.5-like spectrum) for 200 h.     

Growth and characterization of GaN and AlN films on (1 1 1) and (0 0 1) Si substrates

GaN and AlN films were grown on (1 1 1) and (0 0 1) Si substrates by separate admittances of trimethylgallium (or trimethylaluminum) and ammonia (NH₃) at 1000°C. A high temperature (HT) or low temperature (LT) grown AlN thin layer was employed as the buffer layer between HT GaN (or HT AlN) film and Si substrate. Experimental results show that HT AlN and HT GaN films grown on the HT AlN-coated Si substrates exhibit better crystalline quality than those deposited on the LT AlN-coated Si substrates. Transmission electron microscopy (TEM) of the HT GaN/HT AlN buffer layer/(1 1 1)Si samples shows a particular orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. High quality HT GaN films were achieved on (1 1 1) Si substrates using a 200 Å thick HT AlN buffer layer. Room temperature photoluminescence spectra of the high quality HT GaN films show strong near band edge luminescence at 3.41 eV with an emission linewidth of ∼110 meV and weak yellow luminescence.     

Simulation of temperature and gas density field distribution in diamond films growth on silicon wafer by hot filament CVD

In the present study, the temperature and gas density field inside the hot filament chemical vapor deposition (HFCVD) reactor, which play a determinate role on the growth rate and quality of as-deposited diamond films, are simulated using the finite volume method, and the influence of the size and arrangement of filaments and inlets are investigated. Firstly, the correctness of the simulation model is verified by comparing the temperature data obtained from the simulation with that measured in an actual depositing process, and the results show that the error between them is less than 3%. Thereafter, the deposition parameters are optimized using this model as N(filament number)=6, r(filament radius)=0.4 mm, D(filament separation)=16–18 mm, H(substrate–filament distance)=8–9 mm, and 25 inlets. Finally, diamond films are deposited on silicon (100) wafers using above parameters and the results of characterization by SEM and Raman spectrum exhibit that the deposited diamond films appear homogeneous surface with fine-faceted crystals.     

Nanocrystalline silicon TFT process using silane diluted in argon–hydrogen mixtures

We have investigated the effect of Ar dilution on the deposition process of intrinsic nc-Si:H (hydrogenated nanocrystalline silicon) thin films used as active layers of top-gate TFTs, in order to improve the TFTs performances. The nc-Si:H films were deposited by plasma enhanced chemical vapor deposition (PECVD) at low temperature (165 °C) and the related TFTs were fabricated with a maximum process temperature of 200 °C. During the nc-Si:H films deposition, the SiH₄ fraction and the total flow of the diluting gases Ar + H₂ mixture was kept constant, H₂ being substituted by Ar. We have pointed out the active role played by the metastable states of excited Ar atoms in both the dissociation of SiH₄ and H₂ by quenching reactions in the plasma. The role of the atomic hydrogen during the film deposition seems to be promoted by the addition of argon into the discharge, leading to an increase of the deposition rate by a factor of about three and an enhancement of the crystalline quality of the nc-Si:H films. This effect is maximized when the Ar fraction in the Ar + H₂ gases mixture reaches 50%. The evolution with Ar addition of the carriers mobility of the related TFTs is closely connected to the evolution of the crystalline fraction of the intrinsic nc-Si:H film. Mobilities values as high as 8 cm² V^?1 s^?1 are obtained at the Ar fraction of 50%. For higher Ar fractions, the fall of the mobility comes with a degradation of the I_D–V_G transfer characteristics of the processed TFTs due to a degradation of the nc-Si:H films quality. OES measurements show that the evolution of the H_α intensity is closely connected to the evolution of the deposition rate, intrinsic films crystalline fraction and TFTs mobility, providing an interesting tool to monitor the TFTs performances.     

Transport properties of microcrystalline silicon,prepared at high growth rate

Amorphous/microcrystalline transition was studied in the high growth-rate depositions of hydrogenated silicon films at a high pressure (700 Pa) in a depletion regime using a series of samples with the ratio of hydrogen to silane flows from 10 to 32. Results show the characteristic features of the amorphous/microcrystalline transition: abrupt change of dark conductivity and crystallinity accompanied by peaks of roughness and diffusion length, observed previously at standard growth rates.     

Deposition of phosphorus doped a-Si:H and μc-Si:H using a novel linear RF source

A roll-to-roll PECVD system for thin film silicon solar cells on steel foil has been developed by ECN in collaboration with Roth and Rau AG. It combines MW–PECVD for fast deposition of intrinsic Si and novel linear RF sources, which apply very mild deposition conditions, for the growth of doped Si layers. The RF and MW sources can be easily scaled up to deposition widths of up to 150 cm. Here, we report on n-type doping, achieved by RF–PECVD from a H₂/SiH₄/PH₃ mixture in the reaction chamber. The best n-type a-Si:H layers showed E_act = 0.27 eV and σ_d = 2.7 × 10^?3 S/cm. Also thin layers down to 20 nm were of device quality and were deposited at a rate of 0.4 Å/s. Furthermore, n-type μc-Si:H layers with thicknesses of 150 nm, with E_act = 0.034 eV and σ_d = 2 S/cm were grown. Good quality n-type μc-Si:H layers can be made for layer thicknesses down to 50 nm at a rate of 0.15 Å/s. To conclude, the novel RF source is well-suited for the growth of n-doped a-Si:H and μc-Si:H layers for roll-to-roll solar cell production.     

Influence of the nitrogen flow rate on the order and structure of PECVD boron nitride thin films

Three sets of boron nitride (BN) thin films are deposited with different N₂/B₂H₆ flow ratios (r = 4, 10 and 25) by plasma enhanced chemical vapor deposition (PECVD). The variations of physical properties in different deposition sets are analyzed by optical (XPS, FTIR, UV–visible spectroscopies), mechanical and electrical measurements. The films are considered to be deposited in a turbostratic phase (t-BN). Evolution of bonding configurations with increasing r is discussed. Relatively higher nitrogen flow rate in the source gas mixture results in lower deposition rates, whereas more ordered films, which tend to reach a unique virtual crystal of band gap 5.93 eV, are formed. Anisotropy in the film structure and film inhomogeneity along the PECVD electrode radial direction are investigated.     

Structure and optical properties of light-emitting Si films fabricated by neutral cluster deposition and subsequent high-temperature annealing

As a new development of our previous study on the production of light-emitting amorphous Si (a-Si) films by the neutral cluster deposition (NCD) method, we have fabricated light-emitting Si films with improved emission intensity by the combined methods of NCD and subsequent high-temperature annealing. The structure of these films is best characterized by Si nanocrystals, surrounded by an interfacial a-SiO_x (x < 2) layer, embedded in an a-SiO₂ film. These improved Si films were observed by atomic force microscopy and high-resolution transmission electron microscopy, and analyzed by means of X-ray diffraction, X-ray photoelectron spectroscopy, photoluminescence (PL) and Fourier transform infrared-attenuated total reflection measurements. The PL curves of the annealed samples exhibit peaks around 600 nm, at almost the same position as the unannealed samples. Their PL intensities, however, have increased to approximately five times those of the unannealed samples. The source of the luminescence is most likely due to electron-hole recombination in the a-SiO₂/Si interfacial a-SiO_x layer.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

InOx semiconductor films deposited on glass substrates for transparent electronics

Transparent undoped semiconductor indium oxide films were deposited by radio frequency (rf) plasma enhanced reactive thermal evaporation (rf-PERTE) of indium at low substrate temperature. It was experimentally verified that the variation of rf power density has a strong influence on the electrical and structural properties of the films. The thickness of the InO_x films is of about 100 nm. Results show that InO_x films show an average visible transmittance of about 85% and energy gap of about 2.6 eV. Structural and electrical conductivity measurements show that films are polycrystalline and there exists a linear variation of conductivity logarithm vs reciprocal of temperature. Electrical conductivity variation of 17.6 to 5.8 × 10⁻³ (Ω cm)⁻¹ for films produced at rf power densities ranging from 3.9 to 78.1 mW cm⁻³ was obtained. This controllable semiconductor behavior can therefore satisfy the requirement of a particular application for these type of films.