Logic Design Validation via Simulation and Automatic Test Pattern Generation

We investigate an automated design validation scheme for gate-level combinational and sequential circuits that borrows methods from simulation and test generation for physical faults, and verifies a circuit with respect to a modeled set of design errors. The error models used in prior research are examined and reduced to five types: gate substitution errors (GSEs), gate count errors (GCEs), input count errors (ICEs), wrong input errors (WIEs), and latch count errors (LCEs). Conditions are derived for a gate to be testable for GSEs, which lead to small, complete test sets for GSEs; near-minimal test sets are also derived for GCEs. We analyze undetectability in design errors and relate it to single stuck-line (SSL) redundancy. We show how to map all the foregoing error types into SSL faults, and describe an extensive set of experiments to evaluate the proposed method. These experiments demonstrate that high coverage of the modeled errors can be achieved with small test sets obtained with standard test generation and simulation tools for physical faults.     

5G大规模天线基站下的多用户性能测试技术

在当前5G系统全球商用化的时代,针对基站大规模天线下的多用户技术,对基站和终端进行性能测试是实现产品升级迭代的重要环节。首先,介绍5G多用户技术的主要特点并说明了多用户性能测试的意义。其次,为了实现不同信道环境的大规模天线基站下的多用户性能测试,给出多用户无线信道建模技术。最后,通过对建立的信道模型进行实现,给出了大规模天线多用户性能测试的主要技术方案和测试建议。     

A Low-Cost At-Speed BIST Architecture for Embedded Processor and SRAM Cores

We have introduced a low-cost at-speed BIST architecture that enables conventional microprocessors and DSP cores to test their functional blocks and embedded SRAMs in system-on-a-chip architectures using their existing hardware and software resources. To accommodate our proposed new test methodology, minor modifications should be applied to base processor within its test phase. That is, we modify the controller to interpret some of the instructions differently only within the initial test mode. In this paper, we have proposed a fuctional self-test methodology that is deterministic in nature. In our proposed architecture, a self test program called BIST Program is stored in an embedded ROM as a vehicle for applying tests. We first start with testing processor core using our proposed architedture. Once the testing of the processor core is completed, this core is used to test the embedded SRAMs. A test algorithm which utilizes a mixture of existing memory testing techniques and covers all important memory faults is presented in this paper. The proposed memory test algorithm covers 100% of the faults under the fault model plus a data retention test. The hardware overhead in the proposed architecture is shown to be negligible. This architecture is implemented on UTS-DSP (University of Tehran and Iran Communicaton Industries (SAMA)) IC which has been designed in VLSI Circuits and Systems Laboratory.     

The Coupling Model for Function and Delay Faults

We propose a high-level fault model, the coupling fault (CF) model, that aims to cover both functional and timing faults in an integrated way. The basic properties of CFs and the corresponding tests are analyzed, focusing on their relationship with other fault models and their test requirements. A test generation program COTEGE for CFs is presented. Experiments with COTEGE are described which show that (reduced) coupling test sets can efficiently cover standard stuck-at-0/1 faults in a variety of different realizations. The corresponding coupling delay tests detect all robust path delay faults in any realization of a logic function. This research was sponsored in part by the U.S. National Science Foundation under Grants No. CCR-9872066 and CCR-0073406. Joonhwan Yi received the B.S degree in electronics engineering from Yonsei University, Seoul, Korea, in 1991, and the M.S. and Ph.D degrees in electrical engineering and computer science from the University of Michigan, Ann Arbor, in 1998 and 2002, respectively. From 1991 to 1995, he was with Samsung Electronics, Semiconductor Business, Korea, where he was involved in developing application specific integrated circuit cell libraries. In 2000, he was a summer intern with Cisco, Santa Clara, CA, where he worked for path delay fault testing. Since 2003, he has been with Samsung Electronics, Telecommunication Network, Suwon, Korea, where he is working on system-on-a-chip design. His current research interests include C-level system modeling for fast hardware and software co-simulation, system-level power analysis and optimization, behavioral synthesis, and high-level testing. John P. Hayes received the B.E. degree from the National University of Ireland, Dublin, and the M.S. and Ph.D. degrees from the University of Illinois, Urbana-Champaign, all in electrical engineering. While at the University of Illinois, he participated in the design of the ILLIAC III computer. In 1970 he joined the Operations Research Group at the Shell Benelux Computing Center in The Hague, where he worked on mathematical programming and software development. From 1972 to 1982 he was a faculty member of the Departments of Electrical Engineering– Systems and Computer Science of the University of Southern California, Los Angeles. Since 1982 he has been with the Electrical Engineering and Computer Science Department of the University of Michigan, Ann Arbor, where he holds the Claude E. Shannon Chair in Engineering Science. Professor Hayes was the Founding Director of the University of Michigan's Advanced Computer Architecture Laboratory (ACAL). He has authored over 225 technical papers, several patents, and five books, including Introduction to Digital Logic Design (Addison-Wesley, 1993), and Computer Architecture and Organization, (3rd edition, McGraw-Hill, 1998). He has served as editor of various technical journals, including the Communications of the ACM, the IEEE Transactions on Parallel and Distributed Systems and the Journal of Electronic Testing. Professor Hayes is a fellow of both IEEE and ACM, and a member of Sigma Xi. He received the University of Michigan's Distinguished Faculty Achievement Award in 1999 and the Humboldt Foundation's Research Award in 2004. His current teaching and research interests are in the areas of computer-aided design, verification, and testing; VLSI circuits; fault-tolerant embedded systems; ad-hoc computer networks; and quantum computing.     

Test Generation for Crosstalk-Induced Faults: Framework and Computational Results

Due to technology scaling and increasing clock frequency, problems due to noise effects lead to an increase in design/debugging efforts and a decrease in circuit performance. This paper addresses the problem of efficiently and accurately generating two-vector tests for crosstalk induced effects, such as pulses, signal speedup and slowdown, in digital combinational circuits. These noise effects can propagate through a circuit and create a logic error in a latch or at a primary output. We have developed a mixed-signal test generator, called XGEN, that incorporates classical static values as well as dynamic signals such as transitions and pulses, and timing information such as signal arrival times, rise/fall times, and gate delay. In this paper we first discuss the general framework of the test generation algorithm followed by computational results. Comparison of results with SPICE simulations confirms the accuracy of this approach.     

A mixed-signal demodulator for a low-complexity IR-UWB receiver: Methodology, simulation and design

This works presents an integrated CMOS 2-PPM demodulator based on a switched capacitor network for an energy detection impulse-radio UWB receiver. The circuit has been designed using a top-down methodology that allows to discover the impact of low-level non-idealities on system-level performance. Through the use of a mixed-signal simulation environment, performance figures have been obtained which helped evaluate the influence at system level of the non-idealities of the most critical block. Results show that the circuit allows the replacement of the ADC typically employed in energy detection receivers and provides about infinite equivalent quantization resolution. The demodulator achieves 190 pJ/bit at 1.8 V.     

MDSI: Signal Integrity Interconnect Fault Modeling and Testing for SoCs

Unacceptable loss of signal integrity may cause permanent or intermittent harm to the functionality and performance of SoCs. In this paper, we present an abstract model and a new test pattern generation method of signal integrity problems on interconnects. This approach is achieved by considering the effects for testing inputs and parasitic RLC elements of interconnects. We also develop a framework to deal with arbitrary interconnection topology. Experimental results show that the proposed signal integrity fault model is more exact and more powerful for long interconnects than previous approaches.     

Signal Integrity: Fault Modeling and Testing in High-Speed SoCs

As we approach 100 nm technology the interconnect issues are becoming one of the main concerns in the testing of gigahertz system-on-chips. Voltage distortion (noise) and delay violations (skew) contribute to the signal integrity loss and ultimately functional error, performance degradation and reliability problems. In this paper, we first define a model for integrity faults on the high-speed interconnects. Then, we present a BIST-based test methodology that includes two special cells to detect and measure noise and skew occurring on the interconnects of the gigahertz system-on-chips. Using an inexpensive test architecture the integrity information accumulated by these special cells can be scanned out for final test and reliability analysis.     

Constraining Si Particles within Graphene Foam Monolith: Interfacial Modification for High‐Performance Li+ Storage and Flexible Integrated Configuration

Pulverization of electrode materials and loss of electrical contact have been identified as the major causes for the performance deterioration of alloy anodes in Li‐ion batteries. This study presents the hierarchical arrangement of spatially confining silicon nanoparticles (Si NPs) within graphene foam (GF) for alleviating these issues. Through a freeze‐drying method, the highly oriented GF monolith is engineered to fully encapsulate the Si NPs, serving not only as a robust framework with the well‐accessible thoroughfares for electrolyte percolation but also a physical blocking layer to restrain Si from direct exposure to the electrolyte. In return, the pillar effect of Si NPs prevents the graphene sheets from restacking while preserving the highly efficient electron/Li⁺ transport channels. When evaluated as a binder‐free anode, impressive cycle performance is realized in both half‐cell and full‐cell configurations. Operando X‐ray diffraction and in‐house X‐ray photoelectron spectroscopy confirm the pivotal protection of GF to sheathe the most volume‐expanded lithiated phase (Li₁₅Si₄) at room temperature. Furthermore, a free‐standing composite film is developed through readjusting the pore size in GF/Si monolith and directly integrated with nanocellulose membrane (NCM) separator. Because of the good electrical conductivity and structural integrity of the GF monolith as well as the flexibility of the NCM separator, the as‐developed GF/Si‐NCM electrode showcases the potential use in the flexible electronic devices.