Interfacial properties of AlN and oxidized AlN on Si

We report on the characteristics of metal-insulator-semiconductor (MIS) capacitors with aluminum nitride (AlN) as the insulator material. AlN has been grown on (1 1 1) Si by means of molecular beam epitaxy (MBE) and DC magnetron sputtering (SPU). AlN layers have been characterized before and after dry thermal oxidation in O₂. By analyzing changes in morphology and electrical properties, different oxidation mechanisms were identified, due to the crystalline quality difference of the AlN samples. In both cases, oxidation at 1000 °C was beneficial for the electrical characteristics of the MIS structures, presumably due to passivation of atom vacancies. Although AlN was only partially oxidized, the flat-band voltage was reduced and the density of interface traps improved. Dominant conduction mechanism was Poole-Frenkel for the SPU sample, and changed to hopping after oxidation.     

MRCI studies on the electronic structure of AlN and AlN, and the electron affinity of AlN

Using multireference configuration-interaction methods and double to triple-zeta basis sets with semidiffuse and polarization functions, potential energies and spectroscopic constants for low-lying doublet, and quartet states of AlN⁻ were calculated. has R_e=3.280 bohr and . lies 0.17 eV above the ground state. Using an estimated electron affinity of 2.1 eV for AlN, four states of AlN⁻ are found to be stable, namely , , , and . Comparisons with the isovalent anions BN⁻ (three stable states) and AlP⁻ (seven stable states) are made. Photo-detachment of an electron from the state of AlN⁻ can lead to an accurate determination of the energy difference between the two close-lying lowest states of AlN, and , predicted here to be 0.09 eV apart.     

Electron penetration depth in amorphous AlN exploiting the luminescence of AlN:Tm/AlN:Ho bilayers

The penetration depth of electron in amorphous aluminum nitride (AlN) is determined in terms of energy loss per unit length using electron beam in a cathodoluminescence (CL) apparatus. Thin films bilayers of holmium doped aluminum nitride (AlN:Ho) and thulium doped aluminum nitride (AlN:Tm) are deposited on silicon substrates by rf magnetron sputtering method at liquid nitrogen temperatures. The bilayers structure consisted of a 37.8 nm thick AlN:Tm film on the top of a 15.3 nm thick AlN:Ho film. Electron beam of different energies are allowed to penetrate the AlN:Tm/AlN:Ho bilayers film. The spectroscopic properties of AlN:Ho and AlN:Tm, the thickness of the film and the energies of electron beam are used to calculate the penetration depth of electron in amorphous AlN. Electron beam of 2.5 keV energy was able to pass through the 37.8 nm thick AlN:Tm film. The electron penetration depth for AlN is found to be 661.4 MeV/cm.     

Infrared cathodoluminescence of AlN

Measurements were made of cathode-ray excited infrared luminescence band of AlN powder in the temperature range 110 K to 535 K. The form of the temperature-dependent luminescence band and the temperature dependence of the band half-width were used in the determination of the value of the Huang-Rhys factor (S 2) as well as of the frequency of phonons (441 cm^–1) interacting with electron transition. A discussion is presented of the possibility of interaction between an infrared luminescence centre and branch of natural transverse acoustic vibrations of the AlN lattice.Na Slovance 2, Praha 8, Czechoslovakia.The author is indebted to Dr. J. Pastrák for valuable advice and suggestions concerning the measurement as well as the evaluation. Thanks are also due to Mr. J. Hejduk and Mr. J. Veselý for the preparation of AlN powders, and to Dr. V. Kohl for the setting-up of the programme and the computer calculations.     

Solvothermal synthesis of AlN

Abstract

Aluminum nitride is an important material due to its physical properties (electronic, thermal conductivity…). Different processes have been used for preparing such a material. The solvothermal synthesis is characterised by the use of a solvent in supercritical conditions in order to improve the reactivity of the precursors and to control the size of the crystalhtes. Using finely divided aluminum particles as precursor, a new process for the preparation of AlN has been optimised versus the thermodynamical parameters: pressure and temperature and the nature of the additive used for improving the kinetics of nitridation.     

Phonon spectrum and group velocities in AlN/GaN/AlN and related heterostructures

We theoretically investigated acoustic phonon spectrum and group velocities in an ultra-thin layer of wurtzite GaN embedded within two AlN cladding layers. The core GaN layer thickness has been chosen on the order of the room-temperature dominant phonon wavelength so that the phonon spectrum in such a structure is strongly modified compared to bulk. We derived equations of motion for different phonon polarizations in the anisotropic medium approximation, which allowed us to include specifics of the wurtzite lattice. Based on our model we calculated phonon density of states and phonon group velocity. Using several other example material systems, it has also been demonstrated that the phonon group velocity in the core layer can be made higher or lower than that in corresponding bulk material by a proper selection of the cladding material and its thickness. Presented results shed new light on the effect of barrier material on the phonon spectrum of heterostructures and can be used for modeling the thermal and electrical properties of such structures.     

Structure and mechanical properties of Al/AlN multilayer with different AlN layer thickness

Nanometer scale Al/AlN multilayers have been prepared by dc magnetron sputtering technique with a columnar target. A set of Al/AlN multilayers with the Al layer thickness of 2.9 nm and the AlN layer thickness variation from 1.13 to 6.81 nm were determined. Low angle X-ray diffraction (LAXRD) was used to analyze the layered structure of multilayers. The phase structure of the coatings was investigated with grazing angle XRD (GAXRD). Mechanical properties of these multilayers were thoroughly studied using a nanoindentation and ball-on-disk micro-tribometer. It was found that the multilayer hardness and reduced modulus showed no strong dependence on the AlN layer thickness. Al2.9 nm/AlN1.13 nm multilayer had more excellent tribological properties than single layers and other proportion multilayers with a lowest friction coefficient of 0.15. And the tribological properties of all the multilayers are superior to the AlN single layer.     

Photoluminescence, cathodoluminescence, and reflectance study of AlN layers and AlN single crystals

Strained AlN layers grown by MOVPE on sapphire and nominally unstrained AlN single crystals were studied employing photoluminescence, cathodoluminescence, and reflectance spectroscopy in the near-band edge range. The data allow one to determine fundamental optical parameters such as the band edge energy with its crystal field splitting and strain dependence which are still under discussion. Reflection measurements performed on crystal facets with different orientations and subjected to varying selection rules serve to assign the observed transitions to valence band states with specific symmetries.Near-band edge excitonic luminescence at around 6 eV was recorded as a function of temperature (). Fits to the data using standard models from the literature yield the temperature dependence E_g(T) of the band gap.     

AlN/InN和AlN/GaN超晶格能带结构研究

利用Krönig-Penney 模型和形变势理论,从理论上探讨了纤锌矿型AlN/InN和AlN/GaN超晶格系统的能带结构及不同应变模式对能带结构的影响,计算得到了能带结构随各亚层参量变化的一般性规律、超晶格的能量色散关系、应变造成的影响以及不同亚层厚度的系统禁带宽度和导带第一子禁带宽度.研究发现,通过改变亚层厚度可以从不同形式设计能带结构,应变会改变系统禁带宽度,使带阶和子能带明显窄化,价带结构趋于复杂甚至生成准能带结构.与实验结果对比后发现,该模型适于模拟窄势阱结构超晶格,而对于宽势阱则必须 关键词： AlN/InN和AlN/GaN超晶格 Krönig-Penney模型 应变 子能带     

多晶AlN光学性质研究

运用X射线衍射仪和拉曼光谱仪,测量了物理气相输运(PVT)方法生长的AlN多晶材料的X射线衍射和常温拉曼光谱。常温拉曼光谱研究了晶界、晶面方向与拉曼频率的关系,观察到了E和E峰位基本不随测量位置变化,与晶界无关,但是E1(TO),A1(LO)和Quasi-LO声子峰位却明显与晶界有关,为研究晶粒间、晶粒内应力提供了有效手段。     

AlN微晶棒的的制备及光致发光性能研究

采用直流电弧放电方法,在无催化剂的条件下直接氮化Al合成纤锌矿结构的AlN微晶棒。分别利用拉曼光谱仪(Raman)、扫描电子显微镜(SEM)和光致发光(PL)谱等测试手段对所制备样品进行表征和发光性能的研究。结果表明:所制备的Al N微晶棒长度约为30μm,直径约为10μm。在AlN微晶棒的PL谱中,有两个主要发光峰,中心在430 nm的发射源于VN和(V_(Al)-O_N)~(2-)构成的深施主-深受主对缺陷发光,中心在650 nm的发射源于VAl形成的深受主能级到价带的缺陷发光。在激发波长由270 nm逐渐增大到300 nm的过程中发现,Al N微晶棒波长在430 nm处的发光峰先增强后减弱,在激发波长为285 nm时强度最大;650 nm处的发光峰随激发波长增大而逐渐增强。     

Electrostriction in GaN/AlN heterostructures

A one-dimensional model accounting for electrostriction, lattice mismatch, piezoelectricity, and strain is presented with special emphasis on GaN/AlN heterostructures recently examined extensively in the literature. It is shown that electrostriction, being a second-order effect in the strain–electric field relation, plays a significant, sometimes dominant contribution subject to DC voltage conditions and externally imposed hydrostatic pressure. Model results are based on experimentally reported values for electrostriction coefficients in GaN.     

c轴定向氮化铝薄膜的制备

利用电子回旋共振 (ECR)微波增强化学气相沉积法 (PECVD)并使用氮气 (N2 ) ,氩气 (Ar)和AlCl3蒸气作为气源在直径为 6 .35cm的 (10 0 )单晶硅片表面制备了c轴定向氮化铝 (AlN)薄膜 ,并使用X射线衍射仪及其X射线特征能谱和扫描电镜 (SEM)分析了薄膜特征 ,研究了微波功率、基板温度和N2 流量对薄膜c轴定向的影响 ,得到了c轴偏差角小于 5°的高质量大面积AlN薄膜。     

AlN纳米线宏观阵列的制备

借助二次模板法成功的合成了AlN纳米线宏观阵列,并进行了表征.主要研究CVD法制备有一定取向,直径均匀的AlN纳米线宏观阵列的过程.通过气相沉积法和利用PS球自组装模板制备了金属纳米颗粒模板;再以模板上的金属纳米颗粒作为催化剂,利用化学气相沉积在模板上合成AlN纳米线宏观阵列.借助SEM,TEM观察所得样品,AlN纳米线阵列面积约为0.3 mm×0.2 mm,直径和长度分布均匀,平均直径约为41 nm,平均长度为1.8 μm左右,分散密度和覆盖率大的六角结构AlN纳米线宏观阵列.得到了可控制备AlN纳米线 关键词： AlN纳米线阵列 模板法 CVD法 SEM     

N NMR in AlN and BN

A characterisation by ¹⁴N NMR of the binary nitrides AlN and BN is presented. Both the static and magic angle spinning (MAS) lineshapes have been investigated in order to determine, or set upper limits on, the nuclear quadrupole coupling (C_q) at the nitrogen site. Additional data are given for the C_q values at the Al and B sites. A comparison is made with other similar (mainly wurtzite) binary compounds for which C_q is known at each atomic site.     

Effects of AlN nucleation layer thickness on crystal quality of AlN grown by plasma-assisted molecular beam epitaxy

In this paper,the effects of thickness of AlN nucleation layer grown at high temperature on AlN epi-layer crystalline quality are investigated.Crack-free AlN samples with various nucleation thicknesses are grown on sapphire substrates by plasma-assisted molecular beam epitaxy.The AlN crystalline quality is analysed by transmission electron microscope and x-ray diffraction (XRD) rocking curves in both (002) and (102) planes.The surface profiles of nucleation layer with different thicknesses after in-situ annealing are also analysed by atomic force microscope.A critical nucleation thickness for realising high quality AlN films is found.When the nucleation thickness is above a certain value,the (102) XRD full width at half maximum (FWHM) of AlN bulk increases with nucleation thickness increasing,whereas the (002) XRD FWHM shows an opposite trend.These phenomena can be attributed to the characteristics of nucleation islands and the evolution of crystal grains during AlN main layer growth.     

Metallic clusters in the AlN ceramic

Characterization of the local environment of metallic ions (Cu, Fe, Ti, Ni and Er) implanted in the ceramic matrix AlN have led us to conclude that the heat of formation (\Delta H) of the implanted ion nitride (I-N) is the parameter which has to be considered in order to predict the final system. When ΔH_I-N is negative, bonds between the implanted ion and nitrogen atoms are formed, when ΔH_I-N is positive, clusters of the implanted ion are formed. Moreover, we give some physical characteristics of the Cu and Ni clusters in the AlN matrix and show the differences between imbedded and deposited clusters of the same size. This revised version was published online in August 2006 with corrections to the Cover Date.