Self-organization of thin metal films by irradiation with nanosecond laser pulses

Modifications in thin metal films under intensive laser irradiation were studied. Gold, silver, copper, chromium and aluminum films with the thickness of 100 nm were deposited on the glass substrate. Back-side irradiation through the substrate with a burst of nanosecond pulses tightly focused to a line was applied. The film removal threshold with a single pulse F_th was estimated for every material and laser fluence was kept above it in the range of 1.5-3 F_th during experiments. Diverse behavior of the films depending on the metal, the shift between pulses and laser fluence was observed. In chromium, the regular structures were developed in a quite wide range of processing parameters. In gold, three kinds of ripples were observed: transverse (similar to ripples in chromium), longitudinal and a structure of ripples oriented at 60° to each other. The combination of physical properties facilitated the regular assembly of the molten metal in chromium and to some extent in gold.     

Self-organization in a chromium thin film under laser irradiation

Self-organization of chromium on glass was observed during laser ablation of the metal film with partially overlapping laser pulses. The beam of a nanosecond pulse laser tightly focused to a line was applied to the back-side ablation of the chromium thin film on a glass substrate. While the line ablated with a single laser pulse had sharp edges on both sides with ridges of the melted metal, the use of partially overlapping pulses formed a complicated structure made of the metal remaining from the ridges. Regular structures of ripples were developed in a certain range of laser fluence and pulse overlap. The ripple period could be controlled from 2.5 to 4 μm by variation of the processing parameters. Various experimental techniques were applied to test the structures, and different models of the ripple formation in the thin metal film were considered. The initial quasi-periodical formation started because of dewetting of thin liquid metal films on the glass substrate after its melting. Similar to the evaporation of liquid films, the small perturbation in the ridge thickness was able to induce instability in evaporation of the thin melted metal film. Freezing of the nonequilibrium state between laser pulses was one of the stabilizing factors in self-organization of the metal.     

Damage mechanism and morphology characteristics of chromium film in femtosecond laser rear-side ablation

In this paper, damage mechanism and morphology characteristics of chromium film in femtosecond laser rear-side ablation are investigated. The film removing process includes two key sub-processes: the laser ablation dynamic process and subsequent breaking and ejecting dynamic process. Film morphology in rear-side ablation is determined by the interrelation between the laser energy and the film strength. When lower laser energy is used, residual out-layer film is relative thick and tends to break into some large fragments, which results in an irregular ablation shape. While when higher pulse energy is used, thinner residual film with weaker break strength breaks into small fragments, the ablation quality improves correspondingly. Besides laser energy and film property, energy distribution of laser beam also affects the ablation quality. In experiments, this kind of effect is researched by changing the focal position. It is found that ripples, which are familiar nano-structures in front-side ablation, also exist in rear-side ablation. These ripples are formed initially at the interface between quartz substrate and film, and their coverage varies with the energy distribution. Additionally, increasing number of scans is an effective method to shorten the period of ripples.     

High power single-shot laser ablation of silicon with nanosecond 355 nm

We report on high intensity single-shot laser ablation of monocrystalline silicon with a nanosecond Nd:YAG at 355 nm. It is shown that for incident laser intensities exceeding ∼11.5 GW/cm² on the silicon surface, unusually high etch depths can be achieved reaching values up to 60 μm. The results support previous observations of dramatic increase in etch rates in single-shot laser ablation at 266 nm. A laser-induced explosive boiling mechanism together with secondary plasma heating is believed to be associated with this effect.     

KrF excimer laser ablation of thin Cr film on glass substrate

Received: 5 October 1998 / Accepted: 14 December 1998 / Published online: 24 February 1999     

Femtosecond laser patterning of Ta0.1W0.9Ox/ITO thin film stack

Selective laser patterning of thin films in a multilayered structure is an emerging technology for process development and fabrication of optoelectronics and microelectronics devices. In this work, femtosecond laser patterning of electrochromic Ta_0.1W_0.9O_x film coated on ITO glass has been studied to understand the selective removal mechanism and to determine the optimal parameters for patterning process. A 775 nm Ti:sapphire laser with a pulse duration of 150 fs operating at 1 kHz was used to irradiate the thin film stacks with variations in process parameters such as laser fluence, feedrate and numerical aperture of objective lens. The surface morphologies of the laser irradiated regions have been examined using a scanning electron microscopy and an optical surface profiler. Morphological analysis indicates that the mechanism responsible for the removal of Ta_0.1W_0.9O_x thin films from the ITO glass is a combination of blistering and explosive fracture induced by abrupt thermal expansion. Although the pattern quality is divided into partial removal, complete removal, and ITO film damage, the ITO film surface is slightly melted even at the complete removal condition. Optimal process window, which results in complete removal of Ta_0.1W_0.9O_x thin film without ablation damage in the ITO layer, have been established. From this study, it is found that focusing lens with longer focal length is preferable for damage-free pattern generation and shorter machining time.     

Rate dependence of short-pulse laser ablation of metals in air and vacuum

Ablation rates of aluminum and stainless steel are studied as a function of fluence, hole depth, pulse duration and ambient pressure (air vs vacuum). We find a weak rate dependence on pulse duration from 150 fs to 500 ps, and a strong rate dependence on hole depth due to surface roughness. Machining in air plays an important role in deep holes, but has a weaker influence on initial surface ablation rates. Oxidation greatly reduces drilling rates for deep holes in aluminum. Received: 26 December 2001 / Accepted: 9 July 2002 / Published online: 4 November 2002 RID="*" ID="*"Corresponding author. Fax: +1-925/422-5537, E-mail: stuart3@llnl.gov     

Laser ablation and micropatterning of thin TiN coatings

Laser ablation of thin TiN films deposited on steel substrates has been studied under wide-range variation of irradiation conditions (pulsewidth, wavelength, energy density and spot size). It has been demonstrated that both picosecond (150–300 ps) and nanosecond (5–9 ns) laser pulses were suitable for controllable ablation and microstructuring of a 1-μm-thick TiN film unlike longer 150-ns pulses. The ablation rate was found to be practically independent of the wavelength (270–1078 nm) and pulsewidth (150 ps–9 ns), but it increased substantially when the size of a laser spot was reduced from 15–60 μm to 3 μm. The laser ablation technique was applied to produce microstructures in the thin TiN films consisting of microcraters with a typical size of 3–5 μm in diameter and depth less than 1 μm. Tests of lubricated sliding of the laser-structured TiN films against a steel ball showed that the durability of lubricated sliding increased by 25% as compared to that of the original TiN film. Received: 28 July 1999 / Accepted: 17 April 2000 / Published online: 20 September 2000     

Crystalline SiC thin film deposition by laser ablation: influence of laser surface activation

2 ) of the growing SiC film improved the film microstructure equivalent to an increase of the substrate temperature by 150–200 °C. Received: 18 August 1997/Accepted: 8 September 1997     

Drilling enhancement by nanosecond-nanosecond collinear dual-pulse laser ablation of titanium in vacuum

Laser ablation of titanium in vacuum was performed using single- and dual-pulse regime in order to study crater formation. Crater profiles were analyzed by optical microscopy. It was found that the repetition-rate plays an important role in a process of laser ablation. The drilling is most effective for the highest repetition-rate. For the same total number of laser pulses clear drilling enhancement was achieved by dual-pulse regime of ablation in comparison to single-pulse regime. The strongest ablation rate in dual-pulse regime was achieved for the delay time between the pulses τ = 370 ns. Results are discussed in terms of decreased ablation threshold due to continuous heating of the target during the experiment.     

Polarized angular dependence of three-dimensional light-scattering for nanoparticles on thin film wafer

Bidirectional ellipsometry has been developed as a technique for distinguishing among various scattering features near surfaces. The polarized angular dependence of three-dimensional light-scattering by the nanoparticles on thin film wafer is calculated and measured. These calculations and measurements yield angular dependence of bidirectional ellipsometric parameters for out-of-plane light-scattering. The experimental data show good agreement with theoretical predictions for different nanoparticle diameters and thin film thicknesses when bidirectional ellipsometry was employed to measure nanoparticles (60 nm, 100 nm, and 200 nm) on Si wafers with different film thicknesses of 2 nm, 5 nm, and 10 nm. Not only are the diameters of the nanoparticles determined, but also the film thicknesses can be calculated and distinguished from the measurement results. Additionally, the results indicate that improved accuracy is possible for measurements of scattering features from nanoparticles and thin films.     

Photochemical effects in the UV laser ablation of polymers: Implications for laser restoration of painted artworks

0 ∝t^1/2. The best results are expected for a circular top-hat beam shape. Received: 15 January 1999 / Accepted: 18 January 1999     

Ablation of polymer foils for backside opening of thin film layered flexible polymer substrates

For increasing the packing density of electronic devices and enabling 3D wiring, new concepts of interconnection for flexible circuit boards are required. The backside wiring is one innovative concept which, however, requires interconnections from the back to the front side by means of vias.Results on backside opening of polymer foils for exposing a thin metal film deposited at the front side are presented. For the experiments, a thin polyimide foil covered with a thin molybdenum metal film was used. By using mask projection of a pulsed UV-laser beam (248 nm, 20 ns) polymer foil was ablated. The laser ablation process must be adjusted in the manner to avoid damage of the thin metal film, to prevent cones formation at laser ablation, but still enabling the clean ablation of the polymer. The influence of process parameters on the backside opening is discussed and compared with theoretical estimations of the laser-induced temperatures. Using a two-step ablation process applying first high fluences to ablate the main part of the foil and finishing with low laser fluence turns out to be advantageous. This backside opening (BSO) can be used to perform an electrical contact from the backside.     

Adhesion measurement of thin films by a modified laser spallation technique: theoretical analysis and experimental investigation

Laser driven shocks can lead to a dynamic failure, called film spallation. Here, we use a modified laser spallation set-up to measure the dynamic adhesion of thin films and we propose a novel diagnostic technology. Based on correlation theory, new spallation criteria for characterizing the progressive damage at the interface between the film and the substrate are established, such as interface delamination, film spallation and film expulsion. With the help of the theory, the degree of damage and the dimension of damage (i.e. fracture), such as the minimum width of delamination radius, the thickness of the film etc., are estimated. Experiments are carried out on epoxy/stainless steel and epoxy/Al, and the experimental results show that their dynamic bonding strengths are about 25 MPa and 20 MPa, respectively. The detailed results, analyses and discussions are presented in this paper. Received: 6 February 2001 / Accepted: 3 December 2001 / Published online: 11 February 2002     

Vacancies ordered in screw form (VOSF) and layered indium selenide thin film deposition by laser back ablation

Indium selenide thin films are important due to their applications in non-volatile memory and solar cells. In this work, we present an initial study of a new application of deposition-site selective laser back ablation (LBA) for making thin films of In₂Se₃. Invacuo annealing and subsequent characterization of the films by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) indicate that control of substrate temperature during deposition and post-deposition annealing temperature is critical in determining the phase and composition of the films. The initial laser fluence and target film thickness determine the amount of material deposited onto the substrate.     

Femtosecond laser ablation of carbon reinforced polymers

Interaction of intense ultrashort laser pulses (120 fs at 795 nm) with polymer based composites has been investigated. We have found that carbon filled polymers exhibit different ultrafast ablation behaviour depending on whether the filling material is carbon black or carbon fiber and on the polymer matrix itself. The shape and dimensions of the filling material are responsible for some geometrical bad quality effects in the entrance and inner surfaces of drilled microholes. We give an explanation for these non-quality effects in terms of fundamentals of ultrafast ablation process, specifically threshold laser fluences and material removal paths. Since carbon fiber reinforced polymers seemed particularly concerned, this could prevent the use of ultrafast ablation for microprocessing purposes of some of these materials.     

Influence of laser fluence and irradiation timing of F2 laser on ablation properties of fused silica in F2-KrF excimer laser multi-wavelength excitation process

A collinear irradiation system of F₂ and KrF excimer lasers for high-quality and high-efficiency ablation of hard materials by the F₂ and KrF excimer lasers’ multi-wavelength excitation process has been developed. This system achieves well-defined micropatterning of fused silica with little thermal influence and little debris deposition. In addition, the dependence of ablation rate on various conditions such as laser fluence, irradiation timing of each laser beam, and pulse number is examined to investigate the role of the F₂ laser in this process. The multi-wavelength excitation effect is strongly affected by the irradiation timing, and an extremely high ablation rate of over 30 nm/pulse is obtained between -10 ns and 10 ns of the delay time of F₂ laser irradiation. The KrF excimer laser ablation threshold decreases and its effective absorption coefficient increases with increasing F₂ laser fluence. Moreover, the ablation rate shows a linear increase with the logarithm of KrF excimer laser fluence when the F₂ laser is simultaneously irradiated, while single KrF excimer laser ablation shows a nonlinear increase. The ablation mechanism is discussed based on these results. Received: 16 July 2001 / Accepted: 27 July 2001 / Published online: 2 October 2001     

Fabrication of planar gratings by direct ablation using an ultrashort pulse laser in a common optical path configuration

Planar gratings have wide applications and to date, many methods for the fabrication of gratings have been reported. Ultrashort pulse lasers have been used for the machining of gratings primarily because they allow direct ablation and the manufacturing of sub-wavelength structures. In this paper, we present a novel direct ablation technique for the fabrication of planar gratings which makes use of the interference of ultrashort pulses in a common optical path configuration. This technique of grating fabrication not only simplifies the optical setup, but also immunizes the system to extraneous and inherent vibrations, thus enabling the manufacturing of planar gratings of good edge acuity. We have successfully fabricated planar gratings on a copper substrate. Received: 6 November 2001 / Accepted: 4 March 2002 / Published online: 10 September 2002 RID="*" ID="*"Corresponding author. Fax: +65/77-904-674, E-mail: mvenkata@ntu.edu.sg