On the Discontinuity of Polycrystalline Silicon Thin Films Realized by Aluminum-Induced Crystallization of PECVD-Deposited Amorphous Si

Crystallization of glass/Aluminum (50, 100, 200 nm) /hydrogenated amorphous silicon (a-Si:H) (50, 100, 200 nm) samples by Aluminum-induced crystallization (AIC) is investigated in this article. After annealing and wet etching, we found that the continuity of the polycrystalline silicon (poly-Si) thin films was strongly dependent on the double layer thicknesses. Increasing the a-Si:H/Al layer thickness ratio would improve the film microcosmic continuity. However, too thick Si layer might cause convex or peeling off during annealing. Scanning electron microscopy (SEM) and Energy Dispersive X-ray spectroscopy (EDX) are introduced to analyze the process of the peeling off. When the thickness ratio of a-Si:H/Al layer is around 1 to 1.5 and a-Si:H layer is less than 200 nm, the poly-Si film has a good continuity. Hall measurements are introduced to determine the electrical properties. Raman spectroscopy and X-ray diffraction (XRD) results show that the poly-Si film is completely crystallized and has a preferential (111) orientation.     

Rapid initiation of reactions in Al/Ni multilayers with nanoscale layering

Research into nanoenergetic materials is enabling new capabilities for controlling exothermic reaction rates and energy output, as well as new methods for integrating these materials with conventional electronics fabrication techniques. Many reactions produce primarily heat, and in some cases it is desirable to increase the rate of heat release beyond what is typically observed. Here we investigate the Al-Ni intermetallic reaction, which normally propagates across films or foils at rates lower than 10 m/s. However, models and experiments indicate that local heating rates can be very high (10⁷ K/s), and uniform heating of such a multilayer film can lead to a rapid, thermally explosive type of reaction. With the hopes of using a device to transduce electrical energy to kinetic energy of a flyer plate in the timescale of 100's of nanoseconds, we have incorporated a Ni/Al nanolayer film that locally heats upon application of a large electrical current. We observed flyer plate velocities in the 2-6 km/s range, corresponding to 4-36 kJ/g in terms of specific kinetic energy. Several samples containing Ni/Al films with different bilayer thicknesses were tested, and many produced additional kinetic energy in the 1.1-2.3 kJ/g range, as would be expected from the Ni-Al intermetallic reaction. These results provide evidence that nanoscale Ni/Al layers reacted in the timescale necessary to contribute to device output.     

Investigating the nanostructured gold thin films using the multifractal analysis

The atomic force microscopy images representing the surface morphology of the nanostructured gold thin films of thickness of 20, 50 and 200 nm, respectively, were investigated using the multifractal analysis. The interface width and growth exponent corresponding to films of different thicknesses were estimated. The surfaces having greater roughness give rise to larger nonlinearity and wider width of the multifractal spectrum. The statistical tests confirm that the gold thin film surfaces under investigation are multifractal in nature.     

Superior tolerance of Ag/Ni multilayers against Kr ion irradiation: an in situ study

Monolithic Ag and Ni films and Ag/Ni multilayers with individual layer thickness of 5 and 50?nm were subjected to in situ Kr ion irradiation at room temperature to 1 displacement-per-atom (a fluence of 2?×?10¹⁴?ions/cm²). Monolithic Ag has high density of small loops (4?nm in diameter), whereas Ni has fewer but much greater loops (exceeding 20?nm). In comparison, dislocation loops, ～4?nm in diameter, were the major defects in the irradiated Ag/Ni 50?nm film, while the loops were barely observed in the Ag/Ni 5?nm film. At 0.2?dpa (0.4?×?10¹⁴?ions/cm), defect density in both monolithic Ag and Ni saturated at 1.6 and 0.2?×?10²³/m³, compared with 0.8?×?10²³/m³ in Ag/Ni 50?nm multilayer at a saturation fluence of ～1?dpa (2?×?10¹⁴?ions/cm²). Direct observations of frequent loop absorption by layer interfaces suggest that these interfaces are efficient defect sinks. Ag/Ni 5?nm multilayer showed a superior morphological stability against radiation compared to Ag/Ni 50?nm film.     

The formation of intermetallic phases by solid-phase reaction of Fe/Al multilayers

Thin film multilayers of Fe and Al with thicknesses ranging from 10 nm/2 nm to 10 nm/420 nm Fe/Al are used as starting structures to produce intermetallic phases by solid-phase reaction during high-vacuum thermal annealings. By measuring the relative concentrations of the reacting Fe and Al species nearby the growing interfaces and using the recently introduced concept of effective heat of mixing of binary thin-film metallic systems, a method is suggested to predict the phases to be obtained from different combinations of initial multilayer thickness and annealing temperature.     

Crystallization of Poly(Ethylene Oxide) in Thin Films

Crystallization of poly(ethylene oxide) (PEO) in thin films was studied using hot-stage polarized optical microscopy. Isothermal linear crystal growth rates were measured for various film thicknesses at various degrees of undercooling. At a given crystallization temperature, the linear crystal growth rate decreased exponentially with decreasing film thickness below a film thickness of 80 nm. Films showed similar spherulitic morphology down to a film thickness of 30 nm. Control experiments on hydrophilic and hydrophobic surfaces showed that surface chemistry affects stability of the polymer films and causes a competition between crystallization and dewetting.     

CRYSTAL GROWTH OF ISOTACTIC POLYSTYRENE IN ULTRATHIN FILMS: FILM THICKNESS DEPENDENCE

The film thickness dependence of crystal growth is investigated for isotactic polystyrene (it-PS) in thin films for thicknesses from 20 down to 4 nm. The single crystals of it-PS grown at 180°C in the ultrathin films show a morphology typical of diffusion-controlled growth: dense branching morphology and fractal seaweed. The characteristic length of the morphology, i.e., the width of the branch, increases with decreasing film thickness. The thickness dependence of the crystal growth rate shows a crossover around the lamellar thickness of 8 nm. The thickness dependences of the growth rate and morphology are discussed in terms of the diffusion of chain molecules in thin films.     

Optical excitation and emission processes of Si-QD/SiO2 multilayer films with different SiO2 layer thicknesses

Si-rich oxide/SiO₂ multilayer films with different SiO₂ layer thicknesses have been deposited by the plasma enhanced chemical vapor deposition technique, and crystallized Si quantum dot (Si-QD)/SiO₂ multilayer films are obtained after annealing at 1100 ^°C. The photoluminescence (PL) intensity of the multilayer films increases significantly with increasing SiO₂ layer thickness, and the PL peak shifts from 1.25 eV to 1.34 eV. The PL excitation spectra indicate that the maximal PL excitation intensity is located at 4.1 eV, and an excitation–transfer mechanism exists in the excitation processes. The PL decay time for a certain wavelength is a constant when the SiO₂ thickness is larger than 2 nm, and a slow PL decay process is obtained when the SiO₂ layer is 1 nm. In addition, the PL peak shifts toward high energy with decreasing temperature only when the SiO₂ layer is thick enough. Detailed analyses show that the mechanism of PL changes from the quantum confinement effect to interface defects with decreasing SiO₂ layer thickness.     

Transparent conductive ITO/Ag/ITO multilayer electrodes deposited by sputtering at room temperature

ITO/Ag/ITO multilayers have been prepared onto conventional soda lime glass substrates by sputtering at room temperature. The optical and electrical characteristics of single layer and multilayer structures have been investigated as a function of the Ag and ITO film thicknesses. Transmittance and sheet resistance values are found mainly dependent on the Ag film thickness; whereas the wavelength range at which the maximum transmittance is achieved can be changed by adjusting the ITO films thickness. ITO/Ag/ITO electrodes with sheet resistance below 6 Ω/sq have been obtained for Ag film thickness above 10 nm and ITO layers thickness in the 30-50 nm range. These multilayers also show high transmittance in the visible spectral region, above 90% by discounting the glass substrate, with a maximum that is located at higher wavelengths for thicker ITO.     

GaN基紫光LED的高反射率p型欧姆接触

研究用于GaN基大功率倒装焊(Flip-chip)紫光LED(UV-LED)的高反射率p型欧姆接触的电学和光学性能。用磁控溅射的方法在GaN基LED外延片表面沉积了不同厚度Ag,Al,Au和Pd四种金属,测量了样品的反射率和透射率。结合同步辐射高强度X射线衍射和AFM对金属薄膜的晶体结构进行分析,并对表面形貌进行了观测,对由金属薄膜构成的多层膜结构及其对光反射率的作用机理进行了研究。测量结果表明,在入射光波长为400nm时,Ni/Au/Ag和Ni/Au/Al电极的反射率比Ni/Au的反射率提高了三倍。同时与p-GaN有良好的欧姆接触特性。     

Ferromagnetic resonance study of sputtered Co|Ni multilayers

We report on room temperature ferromagnetic resonance (FMR) studies of [ t Co|2t Ni]  × N sputtered films, where 0.1 ≤ t ≤ 0.6 nm. Two series of films were investigated: films with the same number of Co|Ni bilayer repeats (N = 12), and samples in which the overall magnetic layer thickness is kept constant at 3.6 nm (N = 1.2/t). The FMR measurements were conducted with a high frequency broadband coplanar waveguide up to 50 GHz using a flip-chip method. The resonance field and the full width at half maximum were measured as a function of frequency for the field in-plane and field normal to the plane, and as a function of angle to the plane for several frequencies. For both sets of films, we find evidence for the presence of first and second order anisotropy constants, K₁ and K₂. The anisotropy constants are strongly dependent on the thickness t, and to a lesser extent on the total thickness of the magnetic multilayer. The Landé g-factor increases with decreasing t and is practically independent of the multilayer thickness. The magnetic damping parameter α, estimated from the linear dependence of the linewidth ΔH, on frequency, in the field in-plane geometry, increases with decreasing t. This behaviour is attributed to an enhancement of spin-orbit interactions with decreasing Co layer thickness and in thinner films, to a spin-pumping contribution to the damping.     

Microstructures and tribological properties of CrN/ZrN nanoscale multilayer coatings

Nanoscale multilayer CrN/ZrN coatings with bilayer thicknesses ranging from 11.7 to 66.7 nm were prepared by reactive magnetron sputtering techniques. The structure of the thin films was characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). X-ray diffraction results showed that CrN individual layers presented a <1 1 1> preferred orientation in the multilayer coatings. The diffraction peaks of CrN shifted continuously to low diffraction angle with decreasing bilayer thickness. TEM observations showed that the multilayer did not form a superlattice structure instead of the coexistence of nanocrystalline CrN and ZrN layers. Columnar growth for all the coatings was observed by cross-sectional SEM. Nanoindentation tests showed that the multilayer coatings had almost a constant nanohardness of 29 GPa in spite of the variations of bilayer thickness. Pin-on-disk tests indicated that both the friction coefficients and wear rates increased when decreasing bilayer thickness. However, in comparison with the monolayer coating, the multilayer coatings exhibited excellent wear resistance.     

Deformation mechanisms of ultra-thin Al layers in Al/SiC nanolaminates as a function of thickness and temperature

The mechanical properties of Al/SiC nanolaminates with layer thicknesses between 10 and 100 nm were studied by nanoindentation in the temperature range 25 to 100 °C. The strength of the Al layers as a function of the layer thickness and temperature was obtained from the hardness of the nanolaminates by an inverse methodology based on the numerical simulation of the nanoindentation tests by means of the finite element method. The room temperature yield stress of the Al layers showed a large ‘the thinner, the stronger’ effect, which depended not only on the layer thickness but also on the microstructure, which changed with the Al layer thickness. The yield stress of the Al layers at ambient temperature was compatible with a deformation mechanism controlled by the interaction of dislocations with grain boundaries for the thicker layers (>50 nm), while confined layer slip appeared to be dominant for layers below 50 nm. There was a dramatic reduction in the Al yield stress with temperature, which increased as the Al layer thickness decreased, and led to an inverse size effect at 100 °C. This behavior was compatible with plastic deformation mechanisms controlled by grain boundary and interface diffusion at 100 °C, which limit the strength of the ultra-thin Al layers.     

Deposition of ZnO multilayer on LiNbO3 single crystals by DC-magnetron sputtering

Zinc oxide (ZnO) thin films were deposited on LiNbO₃ (LN) single crystals with 200 nm thicknesses by three different ways, where coating of zinc (Zn) film was followed by thermal oxidation for four, two, and one steps with 50, 100, and 200 nm thicknesses repeatedly. Sample, which was produced at 4-step of deposition and oxidation of Zn layer, showed high transmittance and low structural defect due to a lower photoluminescence intensity and Urbach energy. Average grain size in X-ray diffraction (XRD), scanning electron microscopy (SEM) micrograph, and atomic force microscopy (AFM) images for multilayer of ZnO was lower than monolayer of ZnO thin films. Applying multilayer coating technique leads to decrease of surface roughness and scattering on light on surface and fabrication of LiNbO₃ waveguides with lower optical loss.     

Formation of amorphous Al1−x Au x films as a consequence of low-temperature Al/Au-interface reactions in a multilayered system

Al/Au multilayers (average composition Al₂Au, individual layer thicknesses 1 nm Al and 0.71 nm Au) are prepared at 90 K by ion beam sputtering. The electrical resistance of the growing films is monitored in situ. From the results obtained in this way it can be concluded that interface reactions occur transforming the ultrathin layers into an amorphous phase, which is stable up to 255 K.For larger individual layer thicknesses (2.1 nm Au and 3 nm Al), the interface reaction into the amorphous state is incomplete. Based on a simple parallel-resistor model, one finds that the interface reaction into the amorphous phase is restricted to a thickness of less than 3.5 nm. The temperature dependence of the resistance of such thicker multilayers indicates the onset of interdiffusion of the yet unreacted material at T=200 K resulting in the crystalline Al₂Au-phase.     

Modelling the energy gap in transition metal/aluminium bilayers

We present an application of the generalised proximity effect theory. The theory has been used to determine the energy gap (Δ_g) in proximised transition metal/aluminium bilayer structures such as Nb/Al, Ta/Al, V/Al and Mo/Al. These bilayers have different film thicknesses ranging from 5 to 260 nm. For the cases of Nb/Al, Ta/Al and V/Al bilayers, the interface parameters γ and γ_BN (here we define γ as the ratio of the products of normal state resistivity and coherence length in each film of the bilayer while γ_BN is the ratio of the boundary resistance between films 1 and 2 to the product of the resistivity and coherence length in the second film), which were used as input parameters to the model, were inferred experimentally from an existing bilayer of each kind and then suitably modified for different film thicknesses. This experimental assessment is therefore based on a comparison of measurements of the critical temperature and the energy gap at 300 mK with the predictions from the model for various values of γ, γ_BN. The energy gap of the bilayer was experimentally determined by using symmetrical superconducting tunnel junctions (STJs) of the form S–Al–AlO_x–Al–S, where each electrode corresponds to a proximised bilayer. However for the case of Mo/Al bilayers the interface parameters were determined theoretically since currently no STJ data for this configuration are available. The results for the Nb/Al, Ta/Al and V/Al bilayers have also then been compared to experimentally determined energy gaps found for a series of STJs with different film thicknesses. The correspondence between experiment and theory is very good.     

Resonance characteristics of localized plasmonic structures with periodic ZnO nano-patterns

Localized plasmonic structures with the periodic ZnO nano-patterns are demonstrated to increase the sensing characteristics of plasmonic sensor. The ZnO nano-patterns with 30 and 50 nm thicknesses are formed on the Au thin film of 50 nm, which have the periodic nano-patterns of 300 nm. Localized plasmonic structures are optimized using the three-dimensional finite-difference time-domain method as a function of incident angle for the width and thickness of the ZnO nano-structures. Localized plasmonic structures with the periodic ZnO nano-holes are fabricated using the double exposure technique by laser interference lithography. The measured resonance angles of 47.5° and 54° are obtained in the localized plasmonic structures with the periodic ZnO nano-patterns of 30 and 50 nm thicknesses, respectively.     

Fabrication and characterization of freestanding ultrathin diamond-like carbon targets for high-intensity laser applications

Here, we report the fabrication of diamond-like carbon (DLC) thin films using pulsed laser deposition (PLD). PLD is a well-established technique for deposition of high-quality DLC thin films. Carbon tape target was ablated using a KrF (248 nm, 25 ns, 20 Hz) excimer laser to deposit DLC films on soap-coated substrates. A laser fluence between 8.5 and 14 J/cm² and a target to substrate distance of 10 cm was used. These films were then released from substrates to obtain freestanding DLC thin foils. Foil thicknesses from 20 to 200 nm were deposited using this technique to obtain freestanding targets of up to 1-inch square area. Typically, 100-nm-thick freestanding DLC films were characterized using different techniques such as AFM, XPS, and nano-indentation. AFM was used to obtain the film surface roughness of 9 nm rms of the released film. XPS was utilized to obtain 74 % sp², 23 % sp³, and 3 % C–O bond components. Nano-indentation was used to characterize the film hardness of 10 GPa and Young’s modulus of 110 GPa. Damage threshold properties of the DLC foils were studied (1,064 nm, 6 ns) and found to be 7 × 10¹⁰ W/cm² peak intensity for our best ultrathin DLC foils.     

30.4 nm波长SiC/Mg多层膜反射镜

波长30.4 nm的He-II谱线是极紫外天文观测中最重要的谱线之一,空间极紫外太阳观测光学系统需要采用多层膜作为反射元件。为此研究了SiC/Mg、B4C/Mg、C/Mg、C/Al、Mo/Si、B4C/Si、SiC/Si、C/Si、Sc/Si等材料组合的多层膜在该波长处的反射性能。基于反射率最大与多层膜带宽最小的设计优化原则,选取了SiC/Mg作为膜系材料。采用直流磁控溅射技术制备了SiC/Mg多层膜,用X射线衍射仪测量了多层膜的周期厚度,用国家同步辐射计量站的反射率计测量了多层膜的反射率,在入射角12°时,实测30.4 nm处的反射率为38.0%。     

Effect of thickness on the stability of transparent conducting impurity‐doped ZnO thin films in a high humidity environment

The resistivity of transparent conducting Al‐ and Ga‐doped ZnO (AZO and GZO) thin films prepared with a thickness in the range from 20 to 200 nm on glass substrates at a temperature below 200 °C was found to increase with exposure time when tested in a high humidity environment (air at 90% relative humidity and 60 °C). The resistivity stability (resistivity increase) was considerably affected by the thin film thickness. In particular, thin films with a thickness below about 50 nm were very unstable. The increase in resistivity is interpreted as carrier transport being dominated by grain boundary scattering resulting from the trapping of free electrons due to oxygen adsorption on the grain boundary surface. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)