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Monocrystalline semiconductor wafers made of silicon represent the base material for microelectronic devices. The transfer of the precursor material quartz into a 300 mm wafer deposited with an epitaxial layer requires a multitude of process steps, part of which are determined by chemical reactions. This article has introduced into the manufacturing of semiconductor silicon and the processes etching, polishing, cleaning and epitaxy. This technology branch, though, is distinguished by extreme requirements regarding surface perfection and cleanliness, which may be expressed in atomic layers (surface roughness of the wafers) and ppt (contamination of chemicals)  相似文献   

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