化学法制备低介电常数聚酰亚胺的研究进展

随着微电子工业的快速发展,为了提高大规模集成电路中芯片间的传输速度以满足高集成化的要求,需要层间绝缘材料具有较低的介电常数。聚酰亚胺已被广泛用于大规模集成电路的层间绝缘材料,降低其介电常数的研究在近年来受到了广泛关注。当采用化学方法降低介电常数时,调控聚酰亚胺的分子结构是基础;在聚酰亚胺中构建多孔结构则是进一步降低介电常数的有效手段。本文从调控分子结构和构建多孔结构的角度出发,综述了化学法制备低介电常数聚酰亚胺的研究进展,并对低介电常数聚酰亚胺的研究前景进行了展望。     

Highly Transparent and Colorless Polyimide Film with Low Dielectric Constant by Introducing Meta-substituted Structure and Trifluoromethyl Groups

An effective design strategy for preparing highly transparent polyimide film with low dielectric constant is presented. The key to the strategy is to simultaneously introduce meta-substituted structure and trifluoromethyl in polymer chains. By using this design strategy, a highly transparent polyimide film with low-k was synthesized from 3,5-diaminobenzotrifluoride(m-TFPDA) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride(6 FDA) through a two-step method. The obtained m-TFPDA/6 FDA(CPI) film(～30 μm) possesses high optical transparency(λ_(cutoff)=334 nm, T_(450nm)=85.26%, Haze=0.31) and is close to colorless(L*=96.03, a*=-0.34, b*=2.12, yellow index=3.96). The intrinsic k and dielectric loss value of the film are 2.27 and 0.0013 at 10 kHz, respectively. More importantly, such low dielectric performance could remain stable up to280 °C, and the film shows a low moisture rate(～0.51%), which helps to maintain the low-k property stability in different humid environments.Meanwhile, the film also shows good thermal stability and mechanical properties, with a glass transition temperature(T_g) of 296 °C and the 5 wt%decomposition temperature(T_(d,5%)) of 522 °C under N_2. The tensile strength and tensile modulus of the film are 85.1 MPa and 1.96 GPa,respectively. In addition, the film is soluble in common solvents, which allows simple solution processing and low-cost, continuous roll-to-roll processes. This design strategy is beneficial to improving the transparency, lightening yellow color, lowering the dielectric constant and meanwhile maintaining the comprehensive properties of polyimide films, which is mainly due to the introduced meta-substituted and trifluoromethyl structures effectively inhibiting the transfer of charge transfer complex(CTC) effects and increasing the free volume of film. This design strategy could also be extended to other high-performance polymer systems.     

含硅氧烷结构聚酰亚胺树脂的耐热稳定性及高温结构演变

基于含硅芳香二胺双(4-氨基苯氧基)二甲基硅烷(APDS)设计制备了系列苯乙炔基封端的含硅氧烷结构聚酰亚胺树脂预聚物(PEPA-PIS), 考察了硅氧烷含量对树脂固化物耐热稳定性的影响规律. 利用非反应性苯酐基团封端的模型预聚物(PA-PIS)证明了温度对于硅氧烷结构演变的影响. 通过对树脂固化物高温固化处理后耐热稳定性与微观结构和表面形貌的关系进行深入研究, 发现在高温下硅氧烷结构发生氧化交联反应, 并在树脂表面形成具有无机特性的二氧化硅结构, 这种有机/无机杂化特性可显著提高聚酰亚胺树脂的耐热稳定性.     

High Tg and high organosolubility of novel polyimides containing twisted structures derived from 4-(4-amino-2-chlorophenyl)-1-(4-aminophenoxy)-2,6-di-tert-butylbenzene

A series of new polyimides (PIs) containing di-tert-butyl side groups were synthesized via the polycondensation of 4-(4-amino-2-chlorophenyl)-1-(4-aminophenoxy)-2,6-di-tert-butylbenzene (3) with various aromatic tetracarboxylic dianhydrides. The introduction of the asymmetric di-tert-butyl groups and twisted-biphenyl structures is an effective way to increase the inter chain distance and decrease the intermolecular interaction and packing ability of the resulted polymers. Thus, these novel PIs exhibited low dielectric constants (2.83-3.10), low moisture absorption (0.95-1.69%), excellent solubility, and high glass transition temperatures (307-456 °C). The PIs derived from the new diamine and the rigid pyromellitic dianhydride (PMDA) were soluble in N-methyl-2-pyrrolidinone, N,N-dimethylacetamide, tetrahydrofuran, m-cresol, and cyclohexanone. The polymers also show good retention of storage modulus at high temperature (325 °C). In addition, ¹H NMR spectrum of the diamine 3 revealed that the protons of 4-aminophenoxy moiety are not chemical shift equivalent.     

静电纺丝法制备抑菌性聚酰亚胺纳米纤维

采用静电纺丝技术,以联苯四甲酸二酐(BPDA)和4,4'-二氨基二苯醚(ODA)为单体,硝酸银为银源,通过两步法制备含银聚酰亚胺(PI/Ag)纳米纤维.通过X射线衍射(XRD)、透射电子显微镜(TEM)及扫描电子显微镜(SEM)表征了PI/Ag纳米纤维的结构和微观形貌;通过浸渍培养法研究了聚酰亚胺(PI)及PI/Ag纳米纤维的抑菌性能.结果表明,聚酰亚胺基体中存在单质银的立方晶体结构,银粒子在聚酰亚胺基体表面均匀分散,平均粒径为10 nm;PI/Ag纳米纤维对大肠杆菌(E.coli)、金黄色葡萄球菌(S.aureus)和枯草芽孢杆菌(B.subtilis)表现出良好的抑菌效果,最大抑菌率可达99.1%,为聚酰亚胺在耐高温抑菌生物医用材料等领域的应用提供了新的方向.     

由A2和CB2型单体合成端羟基超支化聚(脲-氨酯)

超支化聚合物是一类高度支化的具有三维椭球状立体构造的大分子[1]. 由于具有传统线型聚合物所没有的低熔体粘度、高流变性、良好的溶解性及大量末端官能团等一系列独特的物理化学特性, 超支化聚合物自 20世纪 80年代末在杜邦公司诞生以来[2]便很快成为高分子科学界研究的一个热点[3～7], 预计其将在医药载体、大分子建筑"砌块"、催化剂和流变添加剂等诸多领域得到广泛应用[8].     

高介电常数石墨烯/聚酰亚胺复合材料的制备与性能

在原位聚合制备氧化石墨烯/聚酰亚胺复合材料的过程中,加入季铵盐表面活性剂,抑制氧化石墨烯在高温亚胺化时的聚集,同时将氧化石墨烯原位还原,获得高介电常数的石墨烯/聚酰亚胺复合材料.结果表明,采用四丁基溴化铵和四丁基碘化铵作为还原剂,利用原位化学还原方法所制备的石墨烯/聚酰亚胺复合材料的介电常数超过聚酰亚胺薄膜40倍以上,复合材料的热稳定性和机械性能也优于聚酰亚胺薄膜.热重分析结果表明,在复合材料高温亚胺化过程中,季铵盐发生热分解,未残留在复合材料中.     

低介电多孔薄膜的制备及形成机制研究

摘要利用硅烷偶联剂KH-570(γ-甲基丙烯酰氧基甲氧基硅烷)水解缩合生成的多面低聚倍半硅氧烷(POSS)溶胶为模板剂, 经热解制备低介电多孔薄膜材料. 使用FTIR对材料制备过程及形成机制进行动态研究, 通过 ²⁹Si NMR、 椭偏仪、 氮气吸脱附曲线和TEM等对材料的介电性质、 孔洞大小和分布情况进行表征. 制备的介电多孔薄膜材料孔洞分布均匀、 孔径约1 nm, 比表面积为384.1 m²/g, 介电常数为2.5的低.     

Preparation and Properties of Nb-Coated Barium Titanate Composite Particles by Surface Modification with Nb Alkoxide in Hydrophobic Solvent

Chemical processing for the preparation of Nb-coated barium titanate composite particles was investigated using surface modification technology, hydrolyzing Nb ethoxide on the surface of barium titanate particles dispersed in hydrophobic solvent.It was confirmed from the measurements of specific surface area and zeta potential as well as SEM, TEM and EDX observations of the resulting composite particles that the original barium titanate particles were coated uniformly with hydrolysis product of Nb ethoxide.Barium titanates coated with 1 wt% of Nb as oxide were well sintered at 1200–1300°C. The dielectric constants of the sintered barium titanates showed flattened temperature dependence, but it depended upon the average particle size of original barium titanate. The sintered bodies of Nb-coated barium titanate powders with average particle size of 0.2 m gave dielectric constants of 2000–3000 and those of barium titanate with average particle size of 0.5 m showed dielectric constants of 3000–4000 at room temperature.The microstructure of the sintered barium titanate coated with Nb oxide consisted of grains of about 1 m, smaller than those of sintered original barium titanate.     

高残炭硼酚醛树脂的制备

酚醛树脂(PF)因其具有良好的耐热性能和机械性能而被广泛应用。但其耐热性能已经满足不了现代航空航天技术的需求,研究发现,采用硼酸对酚醛树脂进行改性,可以制得具有优良耐高温性能的硼酚醛树脂(BPF)。采用硼酸酯法合成硼酚醛树脂,n(苯酚)∶n(甲醛)=1∶1.5时耐热性最佳。热分析结果表明,合成的BPF在1000℃条件下的残炭率为78%,其耐热性能明显优于传统的酚醛树脂。同时讨论了不同硼酸含量对BPF耐热性能的影响,当n(硼酸)∶n(苯酚)0.33∶1时,残炭率趋于稳定。此外,利用差示扫描量热仪(DSC)方法确定BPF预固化温度为160℃,后固化温度为220℃。     

高比表面NiP非晶态合金的制备及其催化性能

 以次磷酸和硝酸镍为原料,三正丙胺调节溶液的pH值,制备了具有高比表面积的NiP非晶态合金(ABET=200～300 m2/g). 采用ICP,XRD,TEM和N2物理吸附等方法对不同条件下制备的NiP非晶态合金进行了表征,并在250 ml高压反应釜中评价了NiP对环丁烯砜加氢反应的催化活性. 结果表明,在NiP非晶态合金的制备过程中,反应时间、磷/镍投料摩尔比和体系初始pH值等都会对NiP非晶态合金的物化性质产生影响. 制备温度对NiP非晶态合金的物化性质影响很大,温度高会使催化剂的氧化程度加深,催化活性随之迅速下降. 较适宜的NiP非晶态合金的制备温度为283～303 K,此温度范围内制得的NiP催化剂活性可达到90%以上,高于相同条件下使用次磷酸钠、镍盐和氢氧化钠制得的NiP非晶态合金催化剂(活性为50%～60%).     

SB粉水热分解铝酸钠溶液制取大孔容高比表面拟薄水铝石

 以德国Condea公司用有机醇铝法生产的拟薄水铝石SB粉为晶种,采用水热分解铝酸钠溶液结合乙醇分散洗涤种分产物的方法制得了大孔容高比表面拟薄水铝石. 研究了铝酸钠溶液组成(Al2O3浓度和苛化系数)以及晶种循环使用次数等条件对溶液分解率、 Na2O析出率和种分产物孔体积、孔径分布、比表面积以及钠含量等物化性质的影响. 研究表明, 在晶种比为1.0, 温度为125 ℃的条件下用SB粉分解铝酸钠溶液(Al2O3含量为100～140 g/L, 苛化系数为1.30～1.45), 3 h后溶液分解率可达30%左右,而SB粉连续循环使用3次所得产物的孔容和比表面积分别达到0.84 cm3/g和213.6 m2/g, Na2O含量在0.3%以下,部分性质甚至超过了SB粉的技术指标. 该方法为从廉价的铝酸钠溶液制备高附加值的拟薄水铝石提供了一条新的可供选择的路径.