Determination of phosphorus contamination during antimony implantation by measurement and simulation

Experimental determination of phosphorus cross-contamination during antimony implantation is presented. As a suitable structure for this experiment, a buried layer was employed which is created by implanting antimony followed by a long diffusion process. The samples implanted in different implanters were analysed by secondary ion mass spectrometry (SIMS), four-point probe and spreading resistance methods. The obtained results were compared with those calculated by program SUPREM-IV. Methods that can and cannot be used to determine phosphorus contamination during antimony implantation and to estimate the fluence of phosphorus being co-implanted with antimony are described in detail.     

Corrosion resistance and blood compatibility of lanthanum ion implanted pure iron by MEVVA

Pure iron is a potential material applying for coronary artery stents based on its biocorrodible and nontoxic properties. However, the degradation characteristics of pure iron in vivo could reduce the mechanical stability of iron stents prematurely. The purpose of this work was to implant the lanthanum ion into pure iron specimens by metal vapor vacuum arc (MEVVA) source at an extracted voltage of 40 kV to improve its corrosion resistance and biocompatibility. The implanted fluence was up to 5 × 10¹⁷ ions/cm². The X-ray photoelectron spectroscopy (XPS) was used to characterize the chemical state and depth profiles of La, Fe and O elements. The results showed lanthanum existed in the +3 oxidation state in the surface layer, most of the oxygen combined with lanthanum and form a layer of oxides. The lanthanum ion implantation layer could effectively hold back iron ions into the immersed solution and obviously improved the corrosion resistance of pure iron in simulated body fluids (SBF) solution by the electrochemical measurements and static immersion tests. The systematic evaluation of blood compatibility, including in vitro platelets adhesion, prothrombin time (PT), thrombin time (TT), indicated that the number of platelets adhesion, activation, aggregation and pseudopodium on the surface of the La-implanted samples were remarkably decreased compared with pure iron and 316L stainless steel, the PT and TT were almost the same as the original plasma. It was obviously showed that lanthanum ion implantation could effectively improve the corrosion resistance and blood compatibility of pure iron.     

Investigation of Fe-Mg-Alloys Produced by Ion Implantation

Iron and magnesium are insoluble elements with each other and there is no phase diagram. However, it is possible to produce artificial alloys by ion implantation, in this study by iron implantation into magnesium. Samples are investigated by conversion electron Moessbauer spectroscopy, Auger electron spectroscopy and x-ray diffraction. While at low doses gaussian shaped iron profiles and paramagnetic doublets as Mössbauer spectra are obtained, the iron concentration reaches at the highest dose 90 at.-% in maximum and the Mössbauer spectrum shows a dominant ferromagnetic fraction. The x-ray diffraction pattern let conclude that a dilated α-iron lattice is formed. Microhardness of all samples is clearly increased due to the implantation.     

The influence of P<Superscript>+</Superscript>, B<Superscript>+</Superscript>, and N<Superscript>+</Superscript> ion implantation on the luminescence properties of the SiO<Subscript>2</Subscript>: nc-Si system

The possible mechanisms of the influence of implanted impurities of Group III and V elements on the luminescence properties of a system consisting of silicon nanocrystals in SiO₂ are considered and generalized. The effect of boron and nitrogen ion implantation on the photoluminescence intensity is investigated experimentally. The experimental results and previously reported data on the ion-implantation doping with phosphorus are discussed in terms of the mechanisms under consideration. The state of implanted phosphorus is determined using x-ray photoelectron spectroscopy. It is shown that the enhancement and degradation of the photoluminescence depend on the type of implanted impurities and the conditions of postimplantation heat treatment.     

Channeling study of boron implanted silicon: Liquid nitrogen temperature implantation

Silicon samples have been boron implanted at 150 keV at liquid nitrogen temperature to a dose of 3.6 × 10¹⁵/cm². This dose rendered the implanted layer amorphous as viewed by helium ion backscattering. Four kinds of room temperature measurements were made on the same set of samples as a function of the isochronal annealing temperature. The measurements made were the determination of the substitutional boron content by the channeling technique using the B¹¹(p, α) nuclear reaction, observation of the disorder by helium ion backscattering, determination of the carrier concentration by van der Pauw Hall measurements, and the sheet resistivity by four point probe measurements. These measurements are compared with results from samples implanted at room temperature. The carrier concentration correlates well with the substitutional boron content for both room temperature and liquid nitrogen temperature implantations. Following annealing temperatures in the 600 to 800°C range, a much larger percentage of the boron lies on substitutional lattice sites, and therefore the carrier concentration is larger, if the implantation is done at liquid nitrogen temperature rather than at room temperature. Following liquid nitrogen temperature implantation, reverse annealing is observed from 600 to 800°C in the substitutional boron content, carrier concentration and sheet resistivity. The boron is more than 90 per cent substitutional after annealing to 1100°C for both the room temperature and liquid nitrogen temperature implantations. The low temperature implantation produced a buried amorphous layer, and this layer was observed to regrow from both the surface and substrate sides at approximately equal rates.     

Optical and magnetic properties of nitrogen ion implanted MgO single crystal

The microstructure,optical property and magnetism of nitrogen ion implanted single MgO crystals are studied. A parallel investigation is also performed in an iron ion implanted single MgO sample as a reference. Large structural,optical and magnetic differences are obtained between the nitrogen and iron implanted samples. Room temperature ferromagnetism with a fairly large coercivity field of 300 Oe (1Oe=79.5775 A/m),a remanence of 38% and a slightly changed optical absorption is obtained in the sample implanted using nitrogen with a dose of 1×1018 ions/cm2 . Tran- sition metal contamination and defects induced magnetism can be excluded when compared with those of the iron ion implanted sample,and the nitrogen doping is considered to be the main origin of ferromagnetism.     

Improvement of the Si-SiO2 interface stress resistance of thin gate oxides after channel ion implantation

The effect of phosphorus and boron ion implantation into silicon dioxide films is examined with regard to the resistance of the Si-SiO₂ interface under high field constant current stress conditions. Phosphorus and boron ions of various doses and energies have been implanted through a 35 nm thick oxide. The interface stress resistance is found to decrease with increasing ion dose and increase with implant energy. However, at high energies, the stress resistance of the boron implanted samples is significantly less than the phosphorus equivalents due to the creation of a second interface trap level. Post-implant annealing increases the interface stress resistance but the best performance is observed for the case of sacrificial oxidation.     

Simulation of Ion Paths in the Target Material for the Injection Complex of the BELA Facility

To realize the simulation experiments with the use of two ion beams at the injection complex of the BELA accelerator (Based on ECR ion source Linear Accelerator), it is necessary to determine the energy and irradiation angle of the beam of light ions which will be implanted into the region of radiation damage induced by heavy-ion beam. The depth of light-ion implantation is determined by the energy and kind of particles initiating the damage, as well as by their incidence angle. It is supposed that the incidence direction of heavy ions will coincide with the normal to the specimen surface. In our work, the necessary implantation zone for the iron ion beam with an energy of 3.2 MeV is located at depths of 300–800 nm. The simulation of the hydrogen and helium ion paths in the material of the iron target in the energy range from 150 to 600 keV at the angle to the normal from 0° to 65° is performed. The range of energies and irradiation angles for the hydrogen and helium ions are determined for the implantation into the radiation-induced defect-formation zone.     

Effect of thermal annealing on nitrogen implanted epitaxial Fe films

Nitridated iron is a promising material for potential applications in permanent magnets. Recent work on stabilization of nitridated iron in a foil form through nitrogen ion implantation and annealing motivates to study effect of thermal annealing on the surface of nitrogen-implanted iron. In this work, we show effect of annealing on chemical state and magnetism of nitrogen implanted epitaxial iron films. It is observed that nitrogen in the lattices only stays at the lower temperatures than 450 °C. In addition, significant reduction and lattice modification are taken placed, when the film is annealed at 450 °C. The increases of saturation magnetization and coercivity, where it is annealed at 450 °C, are likely to be triggered by reduction of oxygen contents at the surface and thinning of Fe₂O₃.     

Structure and micro-mechanical properties of helium-implanted layer on Ti by plasma-based ion implantation

The present paper concentrates on structure and micro-mechanical properties of the helium-implanted layer on titanium treated by plasma-based ion implantation with a pulsed voltage of −30 kV and doses of 3, 6, 9 and 12 × 10¹⁷ ions/cm², respectively. X-ray photoelectron spectroscopy and transmission electron microscopy are employed to characterize the structure of the implanted layer. The hardnesses at different depths of the layer were measured by nano-indentation. We found that helium ion implantation into titanium leads to the formation of bubbles with a diameter from a few to more than 10 nm and the bubble size increases with the increase of dose. The primary existing form of Ti is amorphous in the implanted layer. Helium implantation also enhances the ingress of O, C and N and stimulates the formations of TiO₂, Ti₂O₃, TiO, TiC and TiN in the near surface layer. And the amount of the ingressed oxygen is obviously higher than those of nitrogen and carbon due to its higher activity. At the near surface layer, the hardnesses of all implanted samples increases remarkably comparing with untreated one and the maximum hardness has an increase by a factor of up to 3.7. For the samples implanted with higher doses of 6, 9 and 12 × 10¹⁷ He/cm², the local displacement bursts are clearly found in the load-displacement curves. For the samples implanted with a lower dose of 3 × 10¹⁷ He/cm², there is no obvious displacement burst found. Furthermore, the burst width increases with the increase of the dose.     

Correlation between structural and electrical profiles in ion-implanted GaAs

Abstract

Damaging effect of diatomic phosphorus ions implanted into silicon was compared with that of atomic ions in the range between 25 and 300 keV/atom. Dose was around 10¹⁴ ions/cm². Target temperature varied between 77 and 533 K. Below and at 300 K the “damage enhancement factor” defined as ratio of damage produced by equivalnet molecular and atomic ion implantation varied from 1 to 1.6 depending on incident energy. At elevated implantation temperature this factor increased by almost an order of magnitude. In interpretation of experimental results, fluctuations in damage structure inside the volume of collision cascades was proposed. Conclusions are believed to be relevant for other molecular implantation, e.g. for the BF₂ ⁺.     

Correlation between implantation defects and dopants in Fe-implanted SiC

SiC single crystals were implanted with Fe ions and the effects of implantation temperature, Fe concentration, and subsequent swift heavy ion irradiation on both dopant and damage depth distributions were evaluated by using RBS and channelling techniques. It is found that an increase of the implantation temperature above the threshold temperature for amorphization can lead to the formation of a broad layer (∼50 nm) containing a large concentration of implanted Fe atoms (∼2 at.%) but almost free of implantation defects. This particular configuration is likely due to dynamic annealing during implantation combined with defect annihilation at the surface. It is only observed when the implanted species concentration does not exceed a critical value (which lies between 2 and 5 at.% in the present system). Post-implantation swift heavy ion irradiation leads to a further decrease of the damage level, while the Fe distribution is not affected. The Fe substitutional fraction has been evaluated in the different tested conditions. A maximum value of ∼50% is found when implantation is performed at the temperature above that required to prevent amorphization (470 K in the present system). Swift-heavy ion irradiation seems to induce Fe atoms relocation at substitutional positions.     

Investigation of Implanted Semiconductors by Nuclear Spectroscopie Methods

By help of nuclear spectroscopic methods the microscopic structure of the environments of implanted atoms can be studied. Moessbauer-effect investigations of implanted semiconductors give a dominating substitution of implanted probes and in most cases the observed radiation damage is relatively small. On the other side experiments with perturbed angular correlations (TDPAC) in comparable systems clearly proof that after implantation a high degree of radiation damage exists. Electron channelling investigations support the statements of the Moessbauer experiments. A model for the structure of radiation damaged zones where the tetrahedral coordination of the atoms is prefered strongly and where the bond angles are distributed in a random manner around the ideal values is able to interprete the measured results satisfactorily.     

氮氟复合注入对注氧隔离SOI材料埋氧层内固定正电荷密度的影响

为了抑制埋层注氮导致的埋层内正电荷密度的上升, 本文采用氮氟复合注入方式, 向先行注氮的埋层进行了注氮之后的氟离子注入, 并经适当的退火, 对埋层进行改性. 利用高频电容-电压 (C-V) 表征技术, 对复合注入后的埋层进行了正电荷密度的表征. 结果表明, 在大多数情况下, 氮氟复合注入能够有效地降低注氮埋层内的正电荷密度, 且其降低的程度与注氮后的退火时间密切相关. 分析认为, 注氟导致注氮埋层内的正电荷密度降低的原因是在埋层中引入了与氟相关的电子陷阱. 另外, 实验还观察到, 在个别情况下, 氮氟复合注入引起了埋层内正电荷密度的进一步上升. 结合测量结果, 讨论分析了该现象产生的原因. 关键词： 绝缘体上硅(SOI) 材料 注氮 注氟 埋氧层正电荷密度     

Ion implantation in insulators

The modifications of insulating materials by ion implantation can be of considerable interest for many applications. If ion implantation has considerable potential for changing the properties of insulators, only a few experiments have determined the critical parameters which are important in the behaviour of the implanted layer. As a matter of fact, the ion implantation process is, by its very nature, a non-equilibrium process and, in addition, the injection of charged particles in a lattice determines a concomitant creation of intrinsic lattice defects. These defects are associated with the nuclear part of the energy loss of the particles and sometimes with the electronic one (halide compounds). The characterization of these intrinsic defects and the knowledge of their spatial distribution in the lattice are necessary because the formation or dissolution of phases precipitated in the implanted layer are strongly influenced by point or extended defects.

The main parameters which determine the charge state and site location of the implanted atoms in insulating targets are: ionicity of the chemical bond of the lattice, electronegativity, thermal or radiation enhanced diffusion processes, and intrinsic defects. For heavily implanted insulators, phase changes of compositional type can occur which can lead to strong modifications of the physical properties of the implanted layer. In order to obtain information on the relative extent of the critical parameters of chemical implantation in insulators it is necessary to combine analysis with different techniques such as, nuclear techniques, TEM, ESR, optical spectroscopy, X-ray diffraction at glancing angle, etc.

To illustrate the effects of these parameters, typical experimental results obtained in implanted binary or ternary compounds are reported (alkali halides, silver halides, alkaline earth oxides or fluorides, transition metal oxides, natural minerals, etc.).     

Influence of ion implantation on the thermal diffusivity of semiconductors

The influence of ion implantation on the thermal diffusivities of semiconductors are studied using the mirage effect. The dependences of the thermal diffusivities on the implantation doses are obtained. For silicon wafers implanted by boron, phosphorus and arsenic ions, with constant implantation energy, the thermal diffusivities decrease with increasing dose, when the doses are less than some critical values. The theoretical calculation results by using a one-dimensional multilayer model are in good agreement with the experimental ones. On the other hand, for gallium-arsenide wafers implanted with silicon ions, it is found experimentally that the thermal diffusivity increases with the implantation dose.     

磷离子注入速率对4H-SiC(0001)晶格恢复与电阻率降低的影响

高剂量的磷离子注入4H-SiC(0001)晶面，注入速率从1.0×1012到4.0×1012 P+ cm-2s-1变化，而注入剂量固定为2.0×1015 P+ cm-2。室温注入，1500oC的高温下退火。利用光荧光和拉曼谱分析注入产生的晶格损伤以及退火后的残余缺陷。通过霍耳测试来分析注入层的电学性质。基于上述测试结果，发现通过减小磷离子的注入速率，极大地减少了注入层的损伤及缺陷。考虑到室温注入以及相对较低的退火温度(1500 oC)，在注入速率为1.0×1012 P+ cm-2s-1及施主浓度下为4.4×1019 cm-3的条件下，获得了非常低的方块电阻106 Ω/sq。     

埋氧层注氮工艺对部分耗尽SOI nMOSFET特性的影响

研究了埋氧层中注氮后对制作出的部分耗尽SOInMOSFET的特性产生的影响.实验发现，与不注氮的SIMOX基片相比，由注氮SIMON基片制作的nMOSFET的电子迁移率降低了.且由最低注入剂量的SIMON基片制作的器件具有最低的迁移率.随注入剂量的增加，迁移率略有上升，并趋于饱和.分析认为，电子迁移率的降低是由于Si/SiO2界面的不平整造成的.实验还发现，随氮注入剂量的提高，nMOSFET的阈值电压往负向漂移.但是，对应最低注入剂量的器件阈值电压却大于用SIMOX基片制作出的器件.固定氧化物正电荷及界面陷阱密度的大小和分布的变化可能是导致阈值电压变化的主要因素.另外发现，用注氮基片制作出的部分耗尽SOInMOSFET的kink效应明显弱于用不注氮的SIMOX基片制作的器件. 关键词： SOI nMOSFET 氮注入 电子迁移率 阈值电压     

Concept of deterministic single ion doping with sub-nm spatial resolution

We propose a method for deterministic implantation of single atoms into solids which relies on a linear ion trap as an ion source. Our approach allows a deterministic control of the number of implanted atoms and a spatial resolution of less than 1 nm. Furthermore, the method is expected to work for almost all chemical elements. The deterministic implantation of single phosphor or nitrogen atoms is interesting for the fabrication of scalable solid state quantum computers, in particular for silicon and diamond based schemes. A wide range of further applications is expected for the fabrication of nano and sub-nano electronic devices. PACS 03.67.-a; 29.25.Ni; 61.72.Ji; 81.16.Rf; 85.40.Ry     

Study of iron implanted MgO crystals by low-energy electron induced X-ray spectroscopy

Magnesium oxide crystals implanted with Fe⁺ ions have been studied by means of Low-Energy-Electron-Induced X-ray Spectroscopy. All the implantations were carried out with 100 or 150 keV ion energy, at doses in the range from 10¹⁵ to 10¹⁷ ions cm^?2. The structure of the Fe L_II, L_III X-ray emission bands provides information about the iron chemical state. Fe L_II/L_III band intensity ratio measurements have been performed with a 3 keV electron excitation in order to investigate the whole implanted layer. In addition, by using a filtered Fourier transform technique on observed spectra, some modifications in the oxygen K emission band can be observed in implanted MgO crystals after thermal annealings in air. The oxygen spectrum fine structure suggests that the MgO matrix, partially destroyed by iron implantation, is restored after high temperature treatments. All the implantation, is restored after high temperature treatments. All the results are discussed on the basis of previous Mössbauer Spectroscopy studies and ion channeling investigations.