Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Epoxy composites containing particulate fillers‐fused silica, glass powder, and mineral silica were investigated to be used as substrate materials in electronic packaging application. The content of fillers were varied between 0 and 40 vol%. The effects of the fillers on the thermal properties—thermal stability, thermal expansion and dynamic mechanical properties of the epoxy composites were studied, and it was found that fused silica, glass powder, and mineral silica increase the thermal stability and dynamic thermal mechanical properties and reduce the coefficient of thermal expansion (CTE). The lowest CTE value was observed at a fused silica content of 40 vol% for the epoxy composites, which was traced to the effect of its nature of low intrinsic CTE value of the fillers. The mechanical properties of the epoxy composites were determined in both flexural and single‐edge notch (SEN‐T) fracture toughness properties. Highest flexural strength, stiffness, and toughness values were observed at fillers content of 40 vol% for all the filled epoxy composites. Scanning electron microscopy (SEM) micrograph showed poor filler–matrix interaction in glass powder filled epoxy composites at 40 vol%. Copyright © 2007 John Wiley & Sons, Ltd.     

Influence of filler type and content on properties of styrene‐butadiene rubber (SBR) compound reinforced with carbon black or silica

Rubber compounds are filled with reinforcing fillers to improve their physical properties. Carbon black and silica have different surface chemistries to each other. Differences in properties of carbon black‐ and silica‐reinforced styrene‐butadiene rubber (SBR) compounds were studied. Variation of properties of carbon black‐ or silica‐filled compounds with the filler content was also investigated. The silica‐filled compounds without any coupling agent and dispering agent were prepared to investigate the influence of polar materials‐adsorption on the silica surface. Viscosity and crosslink density increased with increase of the filler content. Hardness, modulus, tensile strength, and wear property were improved more and more by increasing the filler content. Viscosity of the silica‐filled compound was higher than that of the carbon black‐filled one. Cure rate of the silica‐filled compound became slower as the filler content increased, while that of the carbon black‐filled one became faster. Difference in properties between the carbon black‐ and silica‐filled compounds were explained by the poor silica dispersion and the adsorption of cure accelerator on the silica surface. Copyright © 2004 John Wiley & Sons, Ltd.     

Effect of fly ash silica and precipitated silica fillers on the viscosity,cure, and viscoelastic properties of natural rubber

The viscosity, cure properties, storage, and loss moduli and tan δ of natural rubber (NR) filled with the same amounts of precipitated silica (PSi) and fly ash silica (FASi) fillers were measured. The fillers were treated with bis[3‐triethoxysilylpropyl‐]tetrasulfide (TESPT), or, used in the rubber untreated. TESPT is a sulfur‐containing bi‐functional organosilane that chemically adheres silica to rubber and also prevents silica from interfering with the reaction mechanism of sulfur cure. The dispersion of PSi and FASi in the rubber was investigated using scanning electron microscope (SEM). The effects of silica type and loading and surface treatment on the aforementioned properties were of interest. The SEM results showed that the FASi particles were larger in size and had a wider particle size distribution when compared with the PSi particles. The viscosity of the compounds decreased progressively with mixing time, and the compounds with FASi had a lower viscosity than those filled with PSi. The treatment with Si69 had no beneficial effect on the dispersion of the fillers in the rubber matrix. At low temperatures, the type and loading of the filler had no effect on the storage and loss moduli of the compounds, but the effect was more pronounced at high temperatures. There was also evidence from the tan δ and glass transition temperature (T_g) measurements that some limited interaction between the filler particles and rubber had occurred because of TESPT. Copyright © 2008 John Wiley & Sons, Ltd.     

Epoxy – diamine thermoset/thermoplastic blends: thermoset reactions and rheological evolutions during curing

Isothermal rates of reaction during the cure of epoxy‐amine/thermoplastic blends were studied. Epoxy‐amine reaction induces a phase separation. Experimental results show that when TP concentration is higher than 30 wt% an increase of reaction rate is observed after phase separation. A modelling of the kinetics of each phase before and after phase separation, shows that in the epoxy‐amine rich phase, gelation occurs for a conversion close to 0.6. Rheological behaviour was studied during the cure. The viscosity was found greatly dependent of the morphology, the epoxy amine conversion and of the evolution of the phase composition. Modelling of the viscosity using simple relations gives a good fit of the experimental results during the cure.     

Effect of silane coupling agent on the polymer‐filler interaction and mechanical properties of silica‐filled NR

The effects of filler loading and a new silane coupling agent 3‐octanoylthio‐1‐ propyltriethoxysilane (NXT silane) on the polymer‐filler interaction and mechanical properties of silica‐filled and carbon black‐filled natural rubber (NR) compounds were studied. Silica (high dispersion silica7000GR, VN2, and VN3) and carbon black (N330) were used as the fillers, and the loading range was from 0 to 50 phr. The loading of NXT silane was from 0 to 6 phr. Experimental results show that the maximum and minimum torques of silica and carbon black‐filled NR increase with increasing filler loading. With increasing filler loading, the scorch time and optimum cure time decrease for carbon black‐filled NR, but increase for silica‐filled NR. The minimum torque, scorch time, and optimum cure time decrease because of the presence of NXT silane. For the carbon black and silica‐filled NR, the tensile strength and elongation at break have maximum values, but the hardness, M300, M100, and tear strength keep increasing with filler loading. The mechanical properties of silica‐filled NR were improved in the presence of NXT silane. With increasing filler loading, the storage modulus of filled NR increases, but the loss factor decreases. Carbon black shows the strongest polymer‐filler interaction, followed by VN3, 7000GR, and VN2. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 573–584, 2005     

Impedance spectroscopy of reactive polymers. 3. Correlations between dielectric,spectroscopic, and rheological properties during cure of a trifunctional epoxy resin

An investigation was carried out of correlations between dielectric, vibrational spectroscopic, and rheological properties during cure of a thermoset formulation composed of trifunctional epoxy resin and tetrafunctional amine. Experimental techniques utilized include impedance spectroscopy, near-infrared spectroscopy, steady shear, and dynamic mechanical measurements. Reaction kinetics obtained from dielectric and spectroscopic results were in excellent agreement. Gelation and vitrification times determined by dielectric and rheological measurements were also found to agree very well, despite the empirical nature of such correlations. A characteristic pattern in plots of imaginary impedance as a function of reaction time was reported for the first time in the open literature, and it was suggested that it could be used to identify gelation and vitrification during the network formation. A realization of the full potential of dielectric impedance spectroscopy in monitoring the progress of chemophysical changes in reactive polymers, however, hinges upon a development of fundamental scientific correlations between dielectric and chemorheological phenomena during cure.     

Rice Husk‐derived Hierarchical Micro/Mesoporous Carbon–Silica Nanocomposite as Superior Filler for Green Electronic Packaging Material

In this study, a carbon‐controllable hierarchical micro/mesoporous carbon–silica material derived from agricultural waste rice husk was easily synthesized and utilized as filler in an epoxy matrix for electronic packaging applications. Scanning electron microscopy, thermogravimetric analysis, and N₂ adsorption/desorption isotherms were used to characterize the morphology, thermal stability, carbon content, and porous structural properties, respectively, of the as‐obtained carbon–silica material, namely rice husk char (RHC ). As a filler material, the uniformly dispersed RHC filler in the epoxy/RHC composite was easily prepared through hydrogen bonding of the silanol group of silica with the epoxy matrix. For electronic packaging applications, the thermal conductivity and thermomechanical properties (storage modulus and coefficient of thermal expansion) of the epoxy/RHC composites improved with increasing carbon content. Moreover, loading of the 40% RHC filler substantially enhanced the storage modulus of the epoxy/RHC composite (5735 MPa ) compared to the epoxy with 40% commercial silica filler (3681 MPa ). Considerable commercial potential is expected for the carbon–silica composite because of the simple synthesis process and outstanding performance of the prepared packaging material.     

Effects of filler–polymer interactions on cold‐crystallization kinetics in crosslinked,silica‐filled polydimethylsiloxane/polydiphenylsiloxane copolymer melts

Crystallization in a series of variable crosslink density poly(dimethyl‐diphenyl)siloxanes random block copolymers reinforced through a mixture of precipitated and fumed silica fillers has been studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), nuclear magnetic resonance (NMR), and X‐ray diffraction (XRD). The silicone composite studied was composed of 94.6 mol % dimethoylsiloxane, 5.1 mol % diphenylsiloxane, and 0.3 mol % methyl‐vinyl siloxane (which formed crosslinking after peroxide cure). The polymer was filled with a mixture of 21.6 wt % fumed silica and 4.0 wt % precipitated silica previously treated with 6.8 wt % ethoxy‐end‐blocked siloxane processing aid. Molecular weight between crosslinks and filler–polymer interaction strength were modified by exposure to γ‐irradiation in either air or in vacuo. Isothermal DMA experiments illustrated that crystallization at ?85 °C occurred over a 1.8 hour period in silica‐filled systems and 2.2–2.6 hours in unfilled systems. The crystallization kinetics for irradiated samples were found to be dependent on crosslink density. Irradiation in vacuo resulted in faster overall crystallization rates compared to air irradiation for the same crosslink density, likely due to a reduction in the interaction between the polymer chains and the silica filler surface for samples irradiated in air. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 1898–1906, 2006     

Influence of silica fillers during the electron irradiation of DGEBA/TETA epoxy resins, part III: Solid-state NMR investigations

The influence of silica fillers on chemical modifications of diglycidyl ether of bisphenol A/triethylene tetramine (DGEBA/TETA) epoxy resins induced by electron beam irradiation has been studied by ¹³C CP-MAS (Cross Polarisation and Magic Angle Spinning) NMR. Four kinds of silica filler were investigated: a pure micrometric silica, a treated micrometric silica, a pure nanometric silica and a treated nanometric silica. On the unirradiated epoxy resins, the magnetization transfer curves reveal structural differences due to the kind of silica fillers. A decrease of the epoxy network rigidity in the presence of nanometric silica fillers is shown. During irradiation, the formation of phenolic ends and enamine functions is confirmed. The slowing of the magnetization transfer of the pure and treated micrometric silica filled epoxy resin reveals an important decrease of the rigidity of these resins. On the pure and treated nanometric silica filled epoxy resins, reactions of the reactive species created by the irradiation in the epoxy resin and the silica particles surface are shown.     

Enhanced thermal conductivity of epoxy–matrix composites with hybrid fillers

The results of thermal conductivity study of epoxy–matrix composites filled with different type of powders are reported. Boron nitride and aluminum nitride micro‐powders with different size distribution and surface modification were used. A representative set of samples has been prepared with different contents of the fillers. The microstructure was investigated by SEM observations. Thermal conductivity measurements have been performed at room temperature and for selected samples it was also measured as a function of temperature from 300 K down to liquid helium temperatures. The most spectacular enhancement of the thermal conductivity was obtained for composites filled with hybrid fillers of boron nitride–silica and aluminum nitride–silica. In the case of sample with 31 vol.% of boron nitride–silica hybrid filler it amounts to 114% and for the sample with 45 vol.% of hybrid filler by 65% as compared with the reference composite with silica filler. However, in the case of small aluminum nitride grains application, large interfacial areas were introduced, promoting creation of thermal resistance barriers and causing phonon scattering more effective. As a result, no thermal conductivity improvement was obtained. Different characters of temperature dependencies are observed for hybrid filler composites which allowed identifying the component filler of the dominant contribution to the thermal conductivity in each case. The data show a good agreement with predictions of Agari‐Uno model, indicating the importance of conductive paths forming effect already at low filler contents. Copyright © 2014 John Wiley & Sons, Ltd.     

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity,rheology, and lap shear strength

Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.     

Formation of Network by Carbon Black，Silica and Their Mixing Fillers in Isoprene Rubber北大核心CSCD

The network formed by fillers has great influence on the mechanical properties of rubber materials. To understand the formation of network by carbon black,silica,and carbon black/silica mixing fillers in rubber and its influence on the properties of rubber,isoprene rubber/filler composites with different filler loadings are prepared and their micromorphology,rheological and tensile properties are investigated. It is found that the dispersion of fillers is better in rubber after cure than that in rubber before cure for all three rubber systems,and the filler size of silica is smaller than that of carbon black,but the aggregation is more severe in silica filled rubber system. In mixed filler system,the two fillers tend to aggregate separately, leading to the low modulus at small strain than that in single filler system. With the increase of the filler loading,the tensile strength increases first and then decreases,the elongation at break decreases,and the temperature rise in compression flexometer tests increases. Moreover,the temperature rise in mixed filler system is higher than that in single filler system at high filler loading. © 2022, Science Press (China). All rights reserved.     

New insights into the cold crystallization of filled natural rubber

This article is devoted to the cold crystallization of filled natural rubber with different types of filler such as carbon black, silica, and grafted silica. A large set of differential scanning calorimetry data is presented with various scanning rates, times, and temperatures of isothermal crystallization to display the factors affecting natural rubber (NR) crystallization. The crystallization kinetic measurements suggest that fillers can create a region with perturbed mobility where the kinetics of nucleation and/or growth are slowed down, the rest of the matrix being unperturbed. And, the final crystallization level indicates the existence of an excluded region for crystallization close to the filler surface. Furthermore, the presence of fillers appears less unfavorable to NR crystallization than chemical crosslinking. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 955–962, 2007     

Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application

Here we report the effect of microwave treatment on a silica–carbon (SiO₂ /C) filler derived from rice husk and the function of the microwave‐treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO₂ /C filler upon microwave treatment. X‐ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO₂ /C composite was improved by 178% at 40 wt % content of the microwave‐treated SiO₂ /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO₂ /C composites was realized. The improvement in thermal stability of SiO₂ /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.     

Plasma polymerization of acetylene onto silica: an approach to control the distribution of silica in single elastomers and immiscible blends

Surface modification of silica by acetylene plasma polymerization is applied in order to improve the dispersion in and compatibility with single rubbers and their blends. Silica, used as a reinforcing filler for elastomers, is coated with a polyacetylene (PA) film under vacuum conditions. Water penetration measurements show a change in surface energy due to the PA‐film deposition. The weight loss measured by thermo‐gravimetric analysis (TGA) is higher for the PA‐coated silica compared to the untreated filler, confirming the deposition of the PA film on the silica surface. Time of flight‐secondary ion mass spectrometry (ToF‐SIMS) shows the well‐defined PA cluster peaks in the high mass region. Scanning electron microscopy (SEM) measurements show silica aggregates, coalesced by the coating with smooth and uniform surfaces, but without significant change in specific surface area. Elemental analysis by energy dispersive X‐ray spectroscopy (EDX) measurements also confirms the deposition of the polymeric film on the silica surface, as the carbon content is increased. The performance of single polymers and their incompatible blends based on S‐SBR and EPDM, filled with untreated, PA‐ and silane‐treated silica, is investigated by measurements of the bound rubber content, weight loss related to bound rubber, cure kinetics, reinforcement parameter, Payne effect, and mechanical properties. The PA‐ and silane‐modified silica‐filled pure S‐SBR and EPDM samples show a lower filler–filler networking compared to the unmodified silica‐filled elastomers. Decrease in the reinforcement parameter (α_F) for the plasma‐polymerized silica‐filled samples also proves a better dispersion compared to silane‐modified and untreated silica‐filled samples. On the other hand, the PA‐silica‐filled samples show a higher bound rubber content due to stronger filler–polymer interactions. Finally, the PA‐silica‐filled pure EPDM and S‐SBR/EPDM blends show high tensile strength and elongation at break values, considered to be the result of best dispersion and compatibilization with EPDM. Copyright © 2008 John Wiley & Sons, Ltd.     

Role of temperature during ageing under gamma irradiation of filled EPDM: consequences on mechanical properties

Filled EPDM materials have been processed and aged by gamma radiation at ambient temperature and at 80 °C to study the influence of the fillers presence in the material degradation. The acceleration of the polymer degradation by the ATH fillers, evidenced when irradiation is performed at 25 °C, is also effective at 80 °C. In addition, in the case of silica‐filled EPDM, the creation of strong filler‐matrix bonds, already reported for irradiation at 25 °C, is also thermally activated; this enables to this material to keep its integrity at high irradiation dose, whereas the irradiated ATH‐filled EPDM is so degraded that it flows. Thus, the introduction of fillers in the polymer has an impact on its resistance to irradiation, whatever the temperature at which the irradiation is performed. Moreover, the consequences of the degradation on the evolution of the mechanical properties of the composite are very dependent on the filler nature. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 1319–1328, 2010     

Modelling auto-acceleration in DGEBA/diamine systems

Curing of epoxy resins with aliphatic diamines at low temperatures deviates from the 4EQ mechanism (catalytic and non-catalytic dual path) at relatively low conversions, far from vitrification. Although the Horie mechanism relies on a third order reaction it is possible a more realistic approach to epoxy curing kinetics if a detailed analysis of auto-acceleration is made. A single parameter dependent only on the nature of the amine is proposed.     

Observations of Gelation and Vitrification of a Thermosetting Resin during the Evolution of Polymerization Shrinkage

Summary: We report a new methodology to determine the gelation and vitrification of a thermosetting material during the polymerization process by detecting the evolution of cure shrinkage through a thermomechanical analyzer (TMA) and a differential scanning calorimeter (DSC). The gelation and vitrification determined by the evolution of cure shrinkage correspond favorably with that measured by conventional rheological techniques. The isoconversional phenomenon at gelation point was further confirmed by monitoring cure shrinkage at temperatures ranging from 90 to 110 °C. Whereas, vitrification was observed to occur at higher degrees of cure with increasing cure temperatures. Inhibited cure shrinkage was also observed in the vitrification region where the reaction transitioned from chemical to diffusion controlled.

Combination of dimension change detected by DMA and heat flow detected by DSC for determining the relationship of cure shrinkage and degree of cure.     

Effect of nano/micro‐mixed ceramic fillers on the dielectric and thermal properties of epoxy polymer composites

Nano/micro ceramic‐filled epoxy composite materials have been processed with various percentage additions of SiO₂, Al₂O₃ ceramic fillers as reinforcements selected from the nano and micro origin sources. Different types of filler combinations, viz. only nano, only micro, nano/micro, and micro/micro particles, were designed to investigate their influence on the thermal expansion, thermal conductivity, and dielectric properties of epoxy polymers. Thermal expansion studies were conducted using thermomechanical analysis that revealed a two‐step expansion pattern consecutively before and after vitreous transition temperatures. The presence of micro fillers have shown vitreous transition temperature in the range 70–80°C compared with that of nano structured composites in which the same was observed as ~90°C. Similarly, the bulk thermal conductivity is found to increase with increasing percentage of micron‐size Al₂O₃. It was established that the addition of micro fillers lead to epoxy composite materials that exhibited lower thermal expansion and higher thermal conductivity compared with nano fillers. Moreover, nano fillers have a significantly decisive role in having low bulk dielectric permittivity. In this study, epoxy composites with a thermal expansion coefficient of 2.5 × 10^?5/K, thermal conductivity of 1.18 W/m · K and dielectric permittivity in the range 4–5 at 1 kHz have been obtained. The study confirms that although the micro fillers seem to exhibit good thermal conductivity and low expansion coefficient, the nano‐size ceramic fillers are candidate as cofillers for low dielectric permittivity. However, a suitable proportion of nano/micro‐mixed fillers is necessary for achieving epoxy composites with promising thermal conductivity, controlled coefficient of thermal expansion and dielectric permittivity. Copyright © 2013 John Wiley & Sons, Ltd.     

Cure behavior of epoxy resin/MMT/DETA nanocomposite

The Flory's gelation theory, non-equilibrium thermodynamic fluctuation theory and Avrami equation have been used to predict the gel time t _g and the cure behavior of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposites at various temperatures and organo-montmorillonite loadings. The theoretical prediction is in good agreement with the experimental results obtained by dynamic torsional vibration method, and the results show that the addition of organo-montmorillonite reduces the gelation time t _gand increases the rate of curing reaction, the value of k, and half-time of cure after gelation point t_1/2 decreases with the increasing of cure temperature, and the value of n is ~2 at the lower temperatures (<60°C) and decreases to ~1.5 as the temperature increases, and the addition of organo-montmorillonite decreases the apparent activation energy of the cure reaction before gelation point, but has no apparent effect on the apparent activation energy of the cure reaction after gelation point. There is no special curing process required for the formation of epoxy resin/organo-montmorillonite/diethylenetriamine intercalated nanocomposite. This revised version was published online in July 2006 with corrections to the Cover Date.