Elastic thermal stresses in a hollow circular overlay/substrate system

This paper investigates the thermal elastic fields in the hollow circular overlay fully bonded to a rigid substrate, which is subjected to a temperature change. Following our previous work for a solid circular overlay/substrate system (Yuan and Yin, Mech. Res. Commun. 38, 283–287, 2011), this paper presents a closed form approximate solution to the axisymmetric boundary value problem using the plane assumption, whose accuracy is verified by the finite element models. When the inner radius is reduced to zero, the present solution recovers the previous solution. When the outer radius approaches infinite, the solution provides the elastic fields for a tiny hole in the overlay. The effects of thickness and width of the overlay are investigated and discussed. When a circular crack initiates in a solid circular overlay, the fracture energy release rate is investigated. This solution is useful for thermal stress analysis of hollow circular thin film/substrate systems and for fracture analysis of spiral cracking in the similar structures.     

Residual stresses in thin film systems: Effects of lattice mismatch,thermal mismatch and interface dislocations

This paper explores the mechanisms of the residual stress generation in thin film systems with large lattice mismatch strain, aiming to underpin the key mechanism for the observed variation of residual stress with the film thickness. Thermal mismatch, lattice mismatch and interface misfit dislocations caused by the disparity of the material layers were investigated in detail. The study revealed that the thickness-dependence of the residual stresses found in experiments cannot be elucidated by thermal mismatch, lattice mismatch, or their coupled effect. Instead, the interface misfit dislocations play the key role, leading to the variation of residual stresses in the films of thickness ranging from 100 nm to 500 nm. The agreement between the theoretical analysis and experimental results indicates that the effect of misfit dislocation is far-reaching and that the elastic analysis of dislocation, resolved by the finite element method, is sensible in predicting the residual stress distribution. It was quantitatively confirmed that dislocation density has a significant effect on the overall film stresses, but dislocation distribution has a negligible influence. Since the lattice mismatch strain varies with temperature, it was finally confirmed that the critical dislocation density that leads to the measured residual stress variation with film thickness should be determined from the lattice mismatch strain at the deposition temperature.     

Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies

A two-dimensional model has been developed for thermal stresses, elastic strains, creep strains, and creep energy density at the interfaces of short and long trilayer assemblies under both plane stress and plane strain conditions. Both linear (viscous) and non-linear creep constitutive behavior under static and cyclic thermal loading can be modeled for all layers. Interfacial stresses and strains are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Partial differential equations are linearized through a simple finite difference discretization procedure. The approach is mathematically straightforward and can be extended to include plastic behavior and problems involving external loads and a variety of geometries. The model can provide input data for thermal fatigue life prediction in solder or adhesive joints. For a typical solder joint, it is demonstrated that the predicted cyclic stress–strain hysteresis shows shakedown and a rapid stabilization of the creep energy dissipation per cycle in agreement with the predictions of finite element analysis.     

Thermal stresses induced by a point heat source in a circular plate by quasi-static approach

The present paper deals with the determination of quasi-static thermal stresses due to an instantaneous point heat source of strength g_pi situated at certain circle along the radial direction of the circular plate and releasing its heat spontaneously at time t = τ. A circular plate is considered having arbitrary initial temperature and subjected to time dependent heat flux at the fixed circular boundary of r = b. The governing heat conduction equation is solved by using the integral transform method, and results are obtained in series form in terms of Bessel functions. The mathematical model has been constructed for copper material and the thermal stresses are discussed graphically.     

Small edge crack in a semi-infinite solid subjected to thermal stratification

The mode I stress intensity factor for a small edge crack in an elastic half-space is found when the space is in contact with two stratified fluids of different temperatures, the boundary between the fluids oscillating sinusoidally over the solid surface. The variation in the stress intensity factor, which may lead to thermal fatigue crack growth, is examined as a function of time, crack depth, amplitude and temporal frequency of oscillation, surface heat transfer coefficient and material properties of the half-space. It is shown how this ‘boundary layer’ solution may be applied to problems involving finite geometries.     

Anisotropic buckling patterns in spheroidal film/substrate systems and their implications in some natural and biological systems

We establish a quantitative mechanics framework of elastic buckling of a spheroidal thin film/substrate system, which is highly relevant to the morphologies of quite a few natural and biological systems. The anisotropic stress-driven bifurcation is governed by the ratios between the effective size/thickness, the equatorial/polar radii, and the substrate/film moduli. The possibilities of manipulating the undulations through external constraints, anisotropic growth/material properties, and substrate geometry/structure are discussed. Analytical equations correlating the undulation characteristics with the geometry/material properties are derived. The quantitative mechanics framework established herein not only has important implications on the morphogenesis of various fruits, vegetables, nuts, eggs, tissues, and animal body parts, but also could guide the three-dimensional micro-fabrications via controlled self-assembly on curved substrate surfaces.     

Elastic stresses in a half-plane with a periodic system of exogeneous circular inclusions located along the boundary of the half-plane

Podol'sk Engineering Institute. Translated from Prikladnaya Mekhanika, Vol. 27, No. 6, pp. 59–64, June, 1991.     

Nonlinear analyses of wrinkles in a film bonded to a compliant substrate

Subject to a compressive membrane force, a film bonded to a compliant substrate often forms a pattern of wrinkles. This paper studies such wrinkles in a layered structure used in several recent experiments. The structure comprises a stiff film bonded to a compliant substrate, which in turn is bonded to a rigid support. Two types of analyses are performed. First, for sinusoidal wrinkles, by minimizing energy, we obtain the wavelength and the amplitude of the wrinkles for substrates of various moduli and thicknesses. Second, we develop a method to simultaneously evolve the two-dimensional pattern in the film and the three-dimensional elastic field in the substrate. The simulations show that the wrinkles can evolve into stripes, labyrinths, or herringbones, depending on the anisotropy of the membrane forces. Statistical averages of the amplitude and wavelength of wrinkles of various patterns correlate well with the analytical solution of the sinusoidal wrinkles.     

Generalized thermoelastic analysis of the stress-focusing effect in a solid cylinder under rotationally asymmetrical instantaneous thermal loading

Summary  This paper investigates the stress-focusing effect in an infinitely long cylinder under rotationally asymmetrical instantaneous thermal loading on the basis of the generalized thermoelastic Lord–Shulman (L-S) and Green–Lindsay (G-L) theories. Combined forms of the governing equations of both theories are given in a cylindrical coordinate system. The two-dimensional generalized thermoelastic problems are solved by numerical inversion of Laplace transform. Calculations have been performed to find distributions of thermal stresses on the basis of the L-S theory. Stress-focusing phenomena under different heating conditions are presented. The effects of thermomechanical coupling and relaxation time on the stress-focusing phenomena as well as the singularity of stresses are discussed. Received 15 November 2000; accepted for publication 15 November 2001     

Modeling of progressive delamination in a thin film driven by diffusion-induced stresses

A semi-analytical method based on the cohesive model has been developed to investigate the progressive growth of interface delamination in an axisymmetric thin film electrode driven by diffusion-induced stresses under the assumption that the electrode remains elastic during the Li-ion diffusion process. The evolutions of the cohesive zone and debonding zone with respect to charging time have been predicted. The cohesive zone propagates in an accelerating manner and the debonding zone advances in a slowing down manner. The key parameters that control the interfacial stresses and delamination have been identified from the obtained governing equations. And according to the discussions on the key parameters, design insights into the geometry, charging velocity and material properties of the electrode have been provided.     

A coated rigid elliptical inclusion loaded by a couple in the presence of uniform interfacial and hoop stresses

We consider a confocally coated rigid elliptical inclusion, loaded by a couple and introduced into a remote uniform stress field. We show that uniform interfacial and hoop stresses along the inclusion–coating interface can be achieved when the two remote normal stresses and the remote shear stress each satisfy certain conditions. Our analysis indicates that: (i) the uniform interfacial tangential stress depends only on the area of the inclusion and the moment of the couple; (ii) the rigid-body rotation of the rigid inclusion depends only on the area of the inclusion, the coating thickness, the shear moduli of the composite and the moment of the couple; (iii) for given remote normal stresses and material parameters, the coating thickness and the aspect ratio of the inclusion are required to satisfy a particular relationship; (iv) for prescribed remote shear stress, moment and given material parameters, the coating thickness, the size and aspect ratio of the inclusion are also related. Finally, a harmonic rigid inclusion emerges as a special case if the coating and the matrix have identical elastic properties.     

Non-axisymmetric thermal stress of a functionally graded coated circular inclusion in an infinite matrix

This paper is to study the non-axisymmetric two-dimensional problem of thermal stresses in an infinite matrix with a functionally graded coated circular inclusion based on complex variable method. With using the method of piece-wise homogeneous layers, the general solution for the functionally graded coating having radial arbitrary elastic properties is derived when the matrix is subjected to uniform heat flux at infinity, and then numerical results are presented for several special examples. It is found that the existence of the functionally graded coating can change interfacial thermal stresses, and choosing proper change ways of the radial elastic properties in the coating can obviously reduce the thermal stresses.     

Extension of Stoney's formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry

Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. By considering a circular thin film/substrate system subject to non-uniform, but axisymmetric temperature distributions, we derive relations between the film stresses and temperature, and between the plate system's curvatures and the temperature. These relations featured a “local” part which involves a direct dependence of the stress or curvature components on the temperature at the same point, and a “non-local” part which reflects the effect of temperature of other points on the location of scrutiny. Most notably, we also derive relations between the polar components of the film stress and those of system curvatures which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary radial non-uniformities. These relations also feature a “non-local” dependence on curvatures making full-field measurements of curvature a necessity for the correct inference of stress. Finally, it is shown that the interfacial shear tractions between the film and the substrate are proportional to the radial gradients of the first curvature invariant and can also be inferred experimentally.     

Thermal fracture of a functionally graded/homogeneous bimaterial with system of cracks

The thermal fracture of a bimaterial consisting of a homogeneous material and a functionally graded material (FGM) with a system of internal cracks and an interface crack is investigated. The bimaterial is subjected to a heat flux. The thermal properties of FGM are assumed to be continues functions of the thickness coordinate, while the elastic properties are constants. The method of the solution is based on the singular integral equations. For a special case where the interface crack is much larger than the internal cracks in the FGM the asymptotic analytical solution of the problem is obtained as series in a small parameter (the ratio between sizes of the internal and interface crack) and the thermal stress intensity factors (TSIFs) are derived as functions of geometry of the problem and material characteristics. A parametric analysis of the effects of the location and orientation of the cracks and of the inhomogeneity parameter of FGM’s thermal conductivity on the TSIFs is performed. The results are applicable to such kinds FGMs as ceramic/ceramic FGMs, e.g., TiC/SiC, MoSi₂/Al₂O₃ and MoSi₂/SiC, and also some ceramic/metal FGMs.     

Thermoelastic contact mechanics for a flat punch sliding over a graded coating/substrate system with frictional heat generation

The problem of thermoelastic contact mechanics for the coating/substrate system with functionally graded properties is investigated, where the rigid flat punch is assumed to slide over the surface of the coating involving frictional heat generation. With the coefficient of friction being constant, the inertia effects are neglected and the solution is obtained within the framework of steady-state plane thermoelasticity. The graded material exists as a nonhomogeneous interlayer between dissimilar, homogeneous phases of the coating/substrate system or as a nonhomogeneous coating deposited on the substrate. The material nonhomogeneity is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The Fourier integral transform method is employed and the formulation of the current thermoelastic contact problem is reduced to a Cauchy-type singular integral equation of the second kind for the unknown contact pressure. Numerical results include the distributions of the contact pressure and the in-plane component of the surface stress under the prescribed thermoelastic environment for various combinations of geometric, loading, and material parameters of the coated medium. Moreover, in order to quantify and characterize the singular behavior of contact pressure distributions at the edges of the flat punch, the stress intensity factors are defined and evaluated in terms of the solution to the governing integral equation.     

Non-uniform, axisymmetric misfit strain： in thin films bonded on plate substrates/substrate systems： the relation between non-uniform film stresses and system curvatures

Current methodologies used for the inference of thin film stress through curvature measurements are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. By considering a circular thin film/substrate system subject to non-uniform, but axisymmetric misfit strain distributions in the thin film, we derived relations between the film stresses and the misfit strain, and between the plate system’s curvatures and the misfit strain. These relations feature a ‘‘local’’ part which involves a direct dependence of the stress or curvature components on the misfit strain at the same point, and a ‘‘non-local’’ part which reflects the effect of misfit strain of other points on the location of scrutiny. Most notably, we also derived relations between the polar components of the film stress and those of system curvatures which allow for the experimental inference of such stresses from full-field curvature measurements in the presence of arbitrary radial non-uniformities. These relations also feature a ‘‘non-local’’ dependence on curvatures making a full-field measurement a necessity. Finally, it is shown that the interfacial shear tractions between the film and the substrate are proportional to the radial gradients of the first curvature invariant and can also be inferred experimentally.     

Magneto-hydrodynamic mixed convection of a power-law fluid past a stretching surface in the presence of thermal radiation and internal heat generation/absorption

The problem of magneto-hydrodynamic mixed convective flow and heat transfer of an electrically conducting, power-law fluid past a stretching surface in the presence of heat generation/absorption and thermal radiation has been analyzed. After transforming the governing equations with suitable dimensionless variables, numerical solutions are generated by an implicit finite-difference technique for the non-similar, coupled flow. The solution is found to be dependent on the governing parameters including the power-law fluid index, the magnetic field parameter, the modified Richardson number, the radiation parameter, the heat generation parameter, and the generalized Prandtl number. To reveal the tendency of the solutions, typical results for the velocity and temperature profiles, the skin-friction coefficient, and the local Nusselt number are presented for different values of these controlling parameters.     

The stress concentration near a rigid line inclusion in a prestressed, elastic material. Part I.: Full-field solution and asymptotics

A lamellar (zero-thickness) rigid inclusion, so-called ‘stiffener’, is considered embedded in a uniformly prestressed (or prestrained), incompressible and orthotropic elastic sheet, subject to a homogeneous far-field deformation increment. This problem is solved under the assumption of plane strain deformation, with prestress principal directions and orthotropy axes aligned with the stiffener. A full-field solution is obtained solving the Riemann-Hilbert problem for symmetric incremental loading at infinity (while for shear deformation the stiffener leaves the ambient field unperturbed). In addition to the full-field solution, the asymptotic Mode I near-tip representation involving the corresponding incremental stress intensity factor are derived and these results are complemented with the Mode II asymptotic solution. For null prestress, the full-field stress state is shown to match correctly with photoelastic experiments performed by us (on two-part epoxy resin samples containing an aluminum lamina). Our experiments also confirm the fracture patterns for a brittle material containing a stiffener, which do not obey a hoop-stress criterion and result completely different from those found for cracks. Issues related to shear band formation and evaluation of energy release rate for a stiffener growth (or reduction) are deferred to Part II of this article.     

Partial stresses in heterogeneous media by a direct statistical approachContraintes partielles en milieux hétérogènes par une approche statistique

The total stress tensor in a structured or non-structured medium can be obtained by a direct statistical approach using the generalized virial theorem, without any reference to a potential function, as soon as positions, velocities and interactions of the particles are given by Molecular Dynamics. However, as shown here, it would be wrong to apply these results to a given class of particles in an heterogeneous medium without adding a cross internal virial tensor to the self internal virial tensor and the partial kinetic energy tensor relative to this class of particles. To cite this article: P. Jouanna, L. Pèdesseau, C. R. Mecanique 332 (2004).     

Analytical model for thermal resistance due to multiple moving circular contacts on a coated bodyModèle analytique pour la résistance thermique due à des contacts circulaires mobiles multiples à la surface d'un solide revêtu

The heat transfer at the interface of two solids in sliding/rolling contact depends on the constriction phenomenon which occurs at the vicinity of asperities. In order to study this problem, the micro-contacts are represented by multiple moving circular heat sources on the surface of a body. The studied body is constituted of a substrate and a surface coating. The thermal constriction resistance due to those contacts is determined analytically in this paper. The solution is developed by using the integral Fourier transforms, and it is valid regardless of the velocity and the relative contact size values. To cite this article: A. Baïri, C. R. Mecanique 331 (2003).