A new ultrasonic measurement system for the cure monitoring of thermosetting resins and composites

Measurements of the ultrasonic sound speed of thermosetting resins and composites can be used as an in-process cure monitoring technique. Ultrasonic measurements have an advantage over other in-process techniques in that ultrasonic sensors do not make contact with the part (thus leaving no imbedded sensor or witness mark) and can make true bulk measurements of the part. A new commercially available ultrasonic cure monitoring system has been developed which easily enables ultrasonic measurements to be made in compression molding, resin transfer molding, and autoclave processes. Advancements in ultrasonic sensor technology enable the sensor to maintain good coupling to the part during thermal cycling to 260C. Data is presented showing the change in ultrasonic sound speed during the compression molding of a graphite-epoxy prepreg. The data shows a good relationship to the ionic conductivity and resistivity data collected via dielectric cure monitoring.This effort was sponsored by the Manufacturing Technology Directorate, Wright Laboratory (WL/MTX), Air Force Material Command, USAF, under cooperative agreement award(s) to NCMS. The U. S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Wright Laboratory or the U.S. Government.     

Comparative studies on the curing kinetics and thermal stability of tetrafunctional epoxy resins using various amines as curing agents

The curing reactions of the epoxy resins tetraglycidyl diaminodiphenyl methane (TGDDM) and tetraglycidyl methylenebis (o-toluidine) (TGMBT) using diaminodiphenyl sulfone (DDS), diaminodiphenyl methane (DDM) and diethylenetriamine (DETA) as curing agents were studied kinetically by differential scanning calorimetry. The dynamic scans in the temperature range 20°–300°C were analyzed to estimate the activation energy and the order of reaction for the curing process using some empirical relations. The activation energy for the various epoxy systems is observed in the range 71.9–110.2 kJ·mol^–1. The cured epoxy resins were studied for kinetics of thermal degradation by thermogravimetry in a static air atmosphere at a heating rate of 10 deg·min^–1. The thermal degradation reactions were found to proceed in a single step having an activation energy in the range 27.6–51.4 kJ·mol^–1.

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Zusammenfassung Die Vernetzungsreaktionen der Epoxidharze Tetraglycidyl-diamino-diphenyl-methan (TGDDM) und Tetraglycidyl-methylen-bis(o-toluidin) (TGMBT) unter Verwendung von Diaminodiphenylsulfon (DDS), Diaminodiphenylmethan (DDM) und Diethylentriamin (DETA) als Vernetzungsmittel wurden kinetisch mittels DSC untersucht. Die dynamischen Scans im Temperaturbereich 20°–300°C wurden analysiert, um unter Anwendung einiger empirischer Gleichungen die Aktivierungsenergie und die Reaktionsordnung des Vernetzungsprozesses zu ermitteln. Die Aktivierungsenergie der einzelnen Epoxy-Systeme liegt im Bereich 71.9–110.2 kJ·mol^–1. An der ausgehärteten Harze wurde mittels TG in einer statischen Luftatmosphäre un deiner Aufheizgeschwindigkeit von 10 Grad/min die Kinetik des termischen Abbaues untersucht. Man fand, daß die thermiscehn Abbaureaktionen in einem Schritt ablaufen und ihre Aktivierungsenergie im Intervall 27.6–51.4 kJ·mol^–1 liegt.

     

Syntheses and characterizations of thermally reworkable epoxy resins. Part I

To meet the need for reworkable epoxy resins, a series of cycloaliphatic diepoxides containing thermally cleavable carbamate linkages were synthesized and characterized. These materials were shown to undergo curing reactions with cyclic anhydride in a similar fashion as a commercial cycloaliphatic epoxide, except that the carbamate group within the diepoxides can act as the internal catalyst. Furthermore, cured samples of the formulations from these diepoxides started to decompose at lower temperatures, i.e., between 200–300°C as compared with 350°C for the cured sample of the commercial cycloaliphatic epoxide, which showed their potential to be used as reworkable underfill encapsulants in the electronic packaging area. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2991–3001, 1999     

Influence of Musa acuminate bio-filler on the thermal,mechanical and visco-elastic behavior of poly (propylene) carbonate biocomposites

Biocomposites were fabricated using poly(propylene) carbonate as matrix and cellulosic polysaccharide banana (Musa acuminate) peel powder as filler in varying concentrations (5–25?wt.%) and were characterized for their functional properties. Microscopic analysis indicated the uniform distribution and existence of microfibrils in the filler. The thermal stability of the composites was lower than the matrix till 320?°C, beyond which it increased. The visco-elastic and mechanical behavior of the biocomposites was found to be enhanced with the addition of fillers. Thus, with better thermal, visco-elastic, and mechanical properties, the biocomposite films can be a replacement for the non-biodegradable polymers for packaging applications.     

Effect of the substituted benzene group on thermal and mechanical properties of epoxy resins initiated by cationic latent catalysts

Epoxy resins (DGEBA) were cured by cationic latent thermal catalysts, that is, N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH) to investigate the effect of substituted benzene group on cure kinetics and mechanical properties of epoxy system. Differential scanning calorimetry (DSC) was undertaken for activation energy of the system. It was also characterized in terms of flexural, fracture toughness, and Izod impact strengths for the mechanical tests. As a result, the cure reaction of both epoxy systems resulted in an autocatalytic kinetic mechanism accelerated by hydroxyl groups. Also, the conversion and cure activation energy of the DGEBA/BQH system were higher than those of DGEBA/BPH system. The mechanical properties of the DGEBA/BQH system were also superior to those of the DGEBA/BPH system, as well as the morphology. This was probably due to the consequence of the effect of the substituted benzene group of the BQH catalyst, resulting in increasing the crosslinking density and structural stability in the epoxy system studied. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2419–2429, 2004     

The effect of network architecture on the thermal and mechanical behavior of epoxy resins

The effects of crosslink functionality (f_c), molecular weight between crosslinks (M_c), and chain stiffness display on the thermal and mechanical behavior of epoxy networks are determined. Both f_c and M_c are controlled by blending different functionality amines with a difunctional epoxy resin. Chain stiffness is controlled by changing the chemical structure of the various amines. In agreement with rubber elasticity theory, the rubbery moduli are dependent on f_c and M_c, but independent of chain stiffness. The glassy moduli and secondary relaxations of these networks are relatively independent of f_c, M_c, and chain stiffness. However, the glass transition temperatures (T_g) of these networks are dependent on all three structural variables. This trend is consistent with free volume theory and entropic theories of T_g. f_c, M_c, and chain stiffness control the yield strength of these networks in a manner similar to that of T_g and is the result that both properties involve flow or relaxation processes. Fracture toughness, as measured by the critical stress intensity factor (K_Ic), revealed that f_c and M_c are both critical parameters. The fracture behavior is the result of the fracture toughness being controlled by the ability of the network to yield in front of the crack tip. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 1371–1382, 1998     

Thermal stability of microencapsulated epoxy resins with poly(urea-formaldehyde)

A series of microcapsules filled with epoxy resins with poly(urea-formaldehyde) (PUF) shell were synthesized by in situ polymerization, and they were heat-treated for 2 h at 100 °C, 120 °C, 140 °C, 160 °C, 180 °C and 200 °C. The effects of surface morphology, wall shell thickness and diameter on the thermal stability of microcapsules were investigated. The chemical structure and surface morphology of microcapsules were investigated using Fourier-transform infrared spectroscope (FTIR) and scanning electron microscope (SEM), respectively. The thermal properties of microcapsules were investigated by thermogravimetric analysis (TGA and DTA) and by differential scanning calorimetry (DSC). The thermal damage mechanisms of microcapsules at lower temperature (<251 °C) are the diffusion of the core material out of the wall shell or the breakage of the wall shell owing to the mismatch of the thermal expansion of core and shell materials of microcapsules. The thermal damage mechanisms of microcapsules at higher temperature (>251 °C) are the decomposition of shell material and core materials. Increasing the wall shell thickness and surface compactness can enhance significantly the weight loss temperatures (T_d) of microcapsules. The microcapsules with mean wall shell thickness of 30 ± 5 μm and smoother surface exhibit higher thermal stability and can maintain quite intact up to approximately 180 °C.     

Syntheses and characterizations of thermally reworkable epoxy resins II

Flip‐chip technology is a face‐down attachment of the active side of the silicon device onto the substrate. It is the ultimate packaging solution to integrated circuit devices used in 21st century electronic systems to meet the requirements of small size, high performance, and low cost. Underfill technology enhances the flip chip on board cycle fatigue life and thus dramatically extends the application of flip‐chip technology in electronics from high‐end to cost‐sensitive commodity products. Reworkable underfill is the key to addressing the nonreworkability of the underfill, so it is very important to electronic packaging. To meet the need for reworkable epoxy resins, four cycloaliphatic epoxides containing thermally cleavable carbonate linkages have been synthesized and characterized. These materials are shown to undergo curing reactions with cyclic anhydride similarly to a commercial cycloaliphatic diepoxide. Furthermore, these cured epoxides start to decompose at temperatures lower than 350 °C, the decomposition temperature for the cured sample of the commercial cycloaliphatic diepoxide. Two formulations based on two carbonate‐containing diepoxides start network breakdown around 220 °C, which is the targeted rework temperature. Moreover, these two formulations have similar properties, including the glass‐transition temperature, coefficient of thermal expansion, storage modulus, viscosity, and adhesion, compared to the standard commercial diepoxide formulation. As such, these two formulations are potential candidates for a successful reworkable underfill. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3771–3782, 2000     

Curing Kinetics and Thermal Stability of Diglycidyl Ether of Bisphenol‐A Using Mixtures of Heterocyclic Derivatives of Stannanes and 4,4′‐Diaminodiphenylsulfone

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of derivatives of stannanes to 4,4'-diaminodiphenylsulfone (DDS) was investigated by the dynamic differential scanning calorimetry. The derivatives were synthesized by reacting 1 mole of biguanide (B) with 1 mole of phenylethyltindihydride (PETH) or phenylmethyltindihydride (PMTH) or phenylbutyltindihydride (PBTH) and designated as BPETH or BPMTH or BPBTH respectively. These derivatives were characterized by elemental analysis and spectroscopic techniques such as IR, ¹H NMR, ¹³C NMR and ¹¹⁹Sn NMR. The mixtures of these derivatives to DDS at ratios of 0∶1, 0.25∶0.75, 0.5∶0.5, 0.75∶0.25 and 1∶0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, and 15 and 20 ℃•min^－1) was used to study the curing kinetics of epoxy resins. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere.     

葡萄色素的提取及稳定性研究

用树脂吸附、膜分离方法处理葡萄酒糟色素提取液 并将色素提取液对热、光和长时间放置的稳定性进行了评价     

Preparation, thermal properties and flame retardancy of phosphorus- and silicon-containing epoxy resins

Phosphorus- and silicon-containing epoxy resins were prepared from (2,5-dihydroxyphenyl)diphenyl phosphine oxide (Gly-HPO), diglycidyloxy methylphenyl silane (DGMPS) and 1,4-bis(glycidyloxydimethyl silyl)-benzene (BGDMSB) as epoxy monomers and diaminodiphenylmethane (DDM), bis(3-aminophenyl)methyl phosphine oxide (BAMPO) and bis(4-aminophenoxy)dimethyl silane (APDS) as curing agents. Epoxy resins with different phosphorus and silicon content were obtained. Their thermal, dynamic mechanical and flame retardant properties were evaluated. The high LOI values confirmed that epoxy resins containing hetero-atoms are effective flame retardants, but a synergistic efficiency of phosphorus and silicon on flame retardation was not observed.     

Thermal decomposition of fire retardant brominated epoxy resins cured with different nitrogen containing hardeners

Epoxy resins frequently have to meet a flame retardancy grade which can be accomplished by incorporating brominated reactive compounds, like tetrabromobisphenol A (TBBA) cured by a number of hardeners. A few brominated epoxy resins (BERs) have been prepared by curing a mixture of diglycidyl ethers of bisphenol A (DGEBA)/diglycidyl ethers of tertabromobisphenol A (DGETBBA) and different hardeners: dicyandiamide (DICY), 4,4′-diaminodiphenyl sulphone (DDS) and polyethylene polyamine (PEPA). The use of different hardeners strongly affects the thermal degradation behaviour of the BER.The main volatile products of pyrolysis, characterized by Pyrolysis-Gas Chromatography-Mass Spectroscopy (PY-GC-MS) at 423 °C were phenol, isopropyl- and isopropenylphenol, mono- and di-brominated phenols, bisphenol A, mono-, di-, tri- and tetra-brominated bisphenol A. No nitrogen containing volatile products or HBr were evolved whereas SO₂ is formed from BER cured with DDS (BER-DDS) and bromoethylene from BER cured with PEPA (BER-PEPA). Differences of 30-60 °C in thermal stability of epoxy network have been found, depending on the hardener. The experimental evidence suggests a cooperative action of bromine and nitrogen in chain scission of epoxy resins. In particular the ability of the hardener in fixing HBr, evolved from TBBA units, seems to depend on the basicity of the N atom of the hardener: the lower the basicity, the lower the scavenging effectiveness and consequently the higher the thermal stability.     

Cure study of addition-cure-type and condensation-addition-type phenolic resins

By the incorporation of propargyl and methylol groups on to novolac backbone, a series of addition-curable phenolic resins and condensation-addition dual-cure type phenolic resins (novolac modified by propargyl groups referred as PN, and novolac modified by propargyl and methylol groups simultaneously referred as MPN) were synthesized. The processing characteristics, thermal cure and catalytic cure behavior for both resins were investigated mainly by means of viscosity measurement and non-isothermal differential scanning calorimetry (DSC) techniques. The effect of propargyl and methylol content of PN and MPN, the molecular weight and the configuration of the parent novolac, on the processing and cure behavior was studied in details. Processing parameters and curing kinetic parameters were obtained. Both resins exhibit excellent processing properties. Thermal cure of PN resins possessed one cure mechanism and that of MPN resins possessed two cure mechanisms according to DSC analysis. The dual-cure-type mechanism made MPN resins superior to PN resins in terms of a mild and controllable cure process. Compared with thermal cure, catalytic cure of PN resins showed lower initiation temperature and cure temperature by about 60 °C. These novel resins have a bright prospect of application as matrix for thermal-structural composite materials.     

超声场中高分子乳液稳定性与多孔材料结构的调控机理研究

采用星型聚合物POSS-（PMMA）₈作为乳化剂兼成膜基质,使用超声乳化法制备w/o型聚合物乳液,制备的乳液液滴初始直径受超声功率调控,阐明了超声功率对液滴直径大小的作用规律.结果表明乳液液滴直径呈双峰分布,且随超声功率的增大液滴直径增大.通过改变水相离子浓度制备聚合物乳液,得到的乳液液滴直径10 μm左右且单分散性好,并发现随超声功率增大乳液的絮凝程度增大.探索了超声功率对乳液失稳机制的影响,当超声功率低于750 W时,奥氏熟化是乳液失稳的主要机制.通过浸渍法制备以玻璃纤维为基底的多孔膜材料,发现多孔材料的孔径变化与对应乳液的液滴直径变化基本一致.本研究证实了通过改变超声功率可以调控乳液的液滴直径,然后利用乳液模板法能获得结构和形貌可控的多孔材料.     

Studies on epoxy resins cured by cationic latent thermal catalysts: The effect of the catalysts on the thermal,rheological, and mechanical properties

To investigate the effect of catalysts on the thermal, rheological, and mechanical properties of an epoxy system, a resin based on diglycidyl ether of bisphenol‐A (DGEBA) was cured by two cationic latent thermal catalysts, N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH). Differential scanning calorimetry was used for the thermal characterization of the epoxy systems. Near‐infrared spectroscopy was employed to examine the cure reaction between the DGEBA and the latent thermal catalysts used. The rheological properties of the blend systems were investigated under an isothermal condition with a rheometer. To characterize the mechanical properties of the systems, flexure, fracture toughness (K_IC), and impact tests were performed. The phase morphology was studied with scanning electron microscopy of the fractured surfaces of mechanical test samples. The conversion and cure activation energy of the DGEBA/BQH system were higher than those of the DGEBA/BPH system. The crosslinking activation energy showed a result similar to that obtained from the cure kinetics of the blend systems. The flexure strength, K_IC, and impact properties of the DGEBA/BQH system were also superior to those of the DGEBA/BPH system. This was a result of the substituted benzene group of the BQH catalyst, which increased the crosslink density and structural stability of the epoxy system studied. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 187–195, 2001     

Stability of Parathion-Methyl,Methiocarb, DDT and 2,4-D in Solid-Phase Extraction Precolumns Packed with a Polymeric Reversed Phase

Abstract

The stability of parathion-methyl, methiocarb, DDT and 2,4-D, adsorbed on the polymeric PLRP-S phase packed in small stainless steel precolumns was examined, with a view to propose the use of these precolumns as alternative means for the transport of water samples. First, water samples spiked with the studied pesticide at low μg/l concentration levels were extracted and preconcentrated in the precolumns, using appropriate conditions for a total recovery. Then, the precolumns were stored at room temperature (15—20°C) or at 35°C for different time periods. At the end of the respective period each precolumn was coupled to an HPLC column via a switching valve and was on-line analyzed by reversed phase chromatography with UV detection. The four pesticide recoveries after one week in the precolumn at room temperature were higher than 90%. The same was true at 35°C except for DDT, which suffered a 30% degradation in one week. Further studies showed that DDT and parathion-methyl were stable at least for five weeks in precolumns stored at room temperature. Methiocarb also was stable for this period but storing the precolumns at 4°C.     

Application of a Laser Diffraction Method for Determination of Stability of Dispersion Systems in Food and Chemical Industry

Laser diffraction was used for determination of particle size of various emulsions. Mean particle size, fractions' number, and dispersion coefficients of tested systems are presented. Stability of greasing emulsions in relation to their pH was also tested. It was found out that determination of droplet size distribution in fat emulsions allows prediction of their properties (stability). The parameter may be helpful in selection of appropriate production process parameters, composition, and control of marketed emulsion systems during their storage. The purpose of the study was to determine applicability of a laser diffraction method for evaluation of stability of selected dispersion systems in food and chemical industry.     

Effect of fluorine functional groups on surface and mechanical interfacial properties of epoxy resins

To improve the surface and mechanical interfacial properties of epoxy resins, fluorine-containing epoxy resin (FEP) was prepared and blended with a commercially available tetrafunctional epoxy resin (TGDDM). As a result, when the fluorine content increased, the total surface energy of TGDDM/FEP blends was gradually decreased, while the water repellency of the blends was increased. The glass transition temperature and thermal stability factors of the blends showed maximum values at 20-40 wt% FEP compared with neat TGDDM epoxy resins. And the mechanical interfacial properties of the blend specimens were significantly increased with increasing the FEP content, which could be attributed to the intermacromolecular interactions in the cured TGDDM/FEP blends. These results indicate that the water repellency and toughness improvements have been achieved without significantly deterioration of the thermal properties in the TGDDM/FEP blends.     

Comparative mechanical property characterization of three indirect composite resin materials compared with two direct composites

Various new indirect composite materials have been developed with required advantages. In this study three indirect composite material (Artglass, Belleglass HP, Targis) were tested for flexural strength, fracture toughness, wear resistance and hardness against Filtek P60 and Z‐100. Five specimens of each material were fabricated according to the manufacturer's directions. The flexural strength and fracture toughness was measured using the bending test. The wear test was performed to accelerated wear in a toothbrushing apparatus. Vickers hardness was measured for each of the tested materials. The statistical tests used for flexural strength, fracture toughness, wear and hardness were One‐way ANOVA and Kruskal–Wallis test. The level of statistical significance chosen was p = 0.05. Results of the study showed that Filtek P60 was superior to the other composites in all tests. Significant differences were found among the materials. The differences in flexural strength, fracture toughnes, wear and hardness may have been due to differences in chemistry or method of polymerization of the composites. Copyright © 2003 John Wiley & Sons, Ltd.