Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Cure behavior and thermal stability of an epoxy: new bismaleimide blends for composite matrices

A new bismaleimide (BMI) resin was synthesized to formulate epoxy(tetraglycidyl diaminodiphenyl methane; TGDDM) – bismaleimide thermoset blends for composite matrix applications. 4,4′-diaminodiphenyl methane (DDM) was used as an amine curing agent for the TGDDM. A Fourier transform infrared (FTIR) spectroscopy was employed to characterize the new BMI resin. Cure behavior of the epoxy–BMI blends was studied using a differential scanning calorimeter (DSC). DSC thermograms of the thermoset blends indicated two exothermic peaks. The glass transition temperature of the thermoset blends decreased with BMI content. Thermogravimetric analysis (TGA) was carried out to investigate thermal degradation behavior of the cured epoxy–BMI thermoset blends. The new BMI resin reacted partially with the DDM and weak intercrosslinking polymer networks were formed during cure of the thermoset blends.     

Curing properties of novel curing agent based on phenyl bisthiourea for an epoxy resin system

Phenyl bisthioureas: 4,4′-(bisthiourea)diphenylmethane (DTM), 4,4′-(bisthiourea)diphenyl ether (DTE), and 4,4′-(bisthiourea)diphenyl sulfone (DTS) were synthesized and used as curing agents for the epoxy resin diglydicyl ether bisphenol A (DGEBA). Synthesized phenyl bisthioureas were characterized using FT-IR and ¹H-NMR analysis. For comparison studies the epoxy system was also cured using the conventional aromatic amine 4,4′-diaminodiphenyl ether (DDE). Curing kinetics of epoxy/amine system was studied by dynamic and isothermal differential scanning calorimeter (DSC). Curing kinetic was evaluated based on model-free kinetics (MFK) and ASTM E 698 model, and the activation energy was compared with DDE. Curing system of phenyl bisthiourea link (DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS) shows two exothermic peaks, while that of the conventional aromatic amines showed only a single peak. The initial exothermic peak is due to the primary nitrogen of the thiourea group, and the exotherm at higher temperature is due to the presence of thiourea groups. Glass transition temperature (T _g) of DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS cured resins were lowered by 323 K when compared to the widely used diaminodiphenyl ether (DDE) cured resin. Oxidation induction temperature measurement performed on DSC suggests that the DGEBA/DTM, DGEBA/DTE, and DGEBA/DTS system cured resins has better oxidative stability when compared to cured DGEBA/DDE resin system.     

Interdiffusion at the interface between poly(vinylpyrrolidone) and epoxy

Electron microprobe analysis (EMP) was used to study interdiffusion in bilayer films of thermoplastic poly(vinylpyrrolidone) (PVP) and a thermoset epoxy. The bilayer films were prepared by casting a stoichiometric mixture of the uncured diglycidyl ether of bisphenol A epoxy (DGEBA) and 4,4′-diaminodiphenylsulfone (DDS) on the PVP film and then curing the system in a two-step process under a nitrogen atmosphere. For the EMP studies, the sulfur signal was used as a probe for DDS, while the nitrogen signal served as a probe for both DDS and PVP. The addition of brominated DGEBA to the conventional DGEBA in a 1: 1 weight ratio allowed the bromine signal to be used as a probe for the epoxy phase. It was found that the interfacial thickness was much larger for the film prepared from low molecular weight PVP than that from high molecular weight PVP. Interdiffusion was suppressed when the initial cure temperature in the two-step cure cycle was 130°C compared to 170°C, in which the first stage of the cure reaction dominated the interdiffusion process. More importantly, it was demonstrated that the diffusion front of the curing agent was located closer to the thermoplastic polymer phase as compared to that of the thermoset polymer in the interface region. This tendency was more significant in the system with the larger interfacial thickness. These results have important consequences on interphase structures and properties. They suggest that crosslinking of the epoxy in the interphase may be suppressed because of an insufficient amount of curing agent and that the not-fully-reacted curing agent in the PVP phase may act to plasticize this phase. © 1997 John Wiley & Sons, Inc.     

Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines

The curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) was investigated by the dynamic differential scanning calorimetry using varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS). The imide-amines were prepared by reacting 1 mole of naphthalene 1,4,5,8-tetracarboxylic dianhydride (N) and 4,4′-oxodiphthalic anhydride (O) with 2.5 moles of 4,4′-diaminodiphenyl ether (E) or 4,4′-diaminodiphenyl methane (M) or 4,4′-diaminodiphenylsulfone (S) and designated as NE/OE or NM/OM or NS/OS. The mixture of the imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. A single exotherm was observed on curing with mixture of imide-amines and DDS. This clearly shows that the two amines act as co-curing agents. Curing temperatures were higher with imide-amines having sulfone linkage irrespective of anhydride. Curing of DGEBA with mixture of imide-amines and or DDS resulted in a decrease in characteristic curing temperatures. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was higher in case of resins cured imide-amines based on N and E. The activation energy of decomposition and integral procedural decomposition temperature were also calculated from the TG data.     

Isoconversional method to explore the cure reaction mechanisms and curing kinetics of DGEBA/EMI‐2,4/nano‐SiC system

The curing kinetics of the diglycidyl ether of bisphenol‐A (DGEBA)/2‐ethyl‐4‐methylimidazole (EMI‐2,4)/nano‐sized carborundum (nano‐SiC) system was studied by means of nonisothermal differential scanning calorimetry (DSC). An isoconversional method of kinetic analysis yields a dependence of the effective activation energy E on the extent of conversion that decreases initially, and then increases as the cure reaction proceeds. The variations of E were used to study the cure reaction mechanisms, and the Shrinking Core Model was used to study the resin–particle reaction. The results show that the presence of nano‐SiC particles prevents the occurrence of vitrification, as well as inhibits the cure reaction. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 371–379, 2006     

Properties of tetra-N-glycidyl-4,4′-diamino diphenyl methane (TGDDM) cured thick films

Thick films of tetra-N-glycidyl epoxy resin of p,p′-diaminodiphenyl methane (TGDDM) were prepared using p,p′-diaminodiphenyl methane (DDM), p,p′-diaminodiphenyl sulfone (DDS) and diethylene triamine (DETA) as curing agent with or without the epoxy fortifiers PGEHA and VCDRC (at 20 phr level). These thick films were used to evaluate various physical, mechanical, chemical resistant and dielectric properties.     

A Well-Defined Cyclotriphosphazene-Based Epoxy Monomer and Its Application as A Novel Epoxy Resin: Synthesis,Curing Behaviors,and Flame Retardancy

Abstract

A novel cyclotriphosphazene-based epoxy monomer, hexa-[4-(glycidyloxycarbonyl) phenoxy]cyclotriphosphazene (HGCP), was synthesized via a four-step synthetic route, and fully characterized by ¹H, ¹³C, and ³¹P NMR spectroscopy, high-resolution mass spectrometry, and elemental analysis. Thermosetting systems based on HGCP with three curing agents, for example, 4,4′-diaminodiphenylsulfone (DDS), 4,4′-diaminodiphenylmethane (DDM), and dicyandiamide (DICY), were used for making a comparison of their thermal curing behaviors. The curing behaviors were measured by differential scanning calorimetry. Moreover, flame retardancy of HGCP thermosetting systems was estimated by Limiting Oxygen Index (LOI) and Vertical Burning Test (UL-94). The resulting HGCP thermosetting systems exhibited better flame retardancy than the common epoxy resins diglycidyl ether of bisphenol A (DGEBA) and the regular brominated bisphenol A epoxy resin (TBBA) cured by DDS, respectively. When HGCP was cured by DDS, its thermosetting system gave the most char residues, met the UL-94 V-0 classification, and had a limiting oxygen index value greater than 35.     

Benzoxazine modified diglycidyl ether of bisphenol-a/silicon/siliconized epoxy hybrid polymer matrices: Mechanical,thermal, electrical and morphological properties

Benzoxazines modified epoxy hybrid polymer matrices were developed using benzoxazines (CB_DDM and BMPB_DDM) and epoxy resins (DGEBA, SE and EP-HTPDMS) to make them suitable for high performance applications. The benzoxazine-epoxy hybrid polymer matrices were prepared via in-situ polymerization and were investigated for their thermal, thermo-mechanical, mechanical, electrical and morphological properties. Two types of skeletal modified benzoxazines namely 1,1-bis(3-methyl-4-hydroxyphenyl)cyclohexane benzoxazine (CB_DDM) and bis(4-maleimidophenyl) benzoxazine (BMPB_DDM) were synthesized by reacting paraformaldehyde and 4,4′-diaminodiphenylmethane with 1,1-bis (3-methyl-4-hydroxyphenyl)cyclohexane and N-(4-hydroxyphenyl)maleimide respectively. Epoxy resins viz., diglycidyl ether of bisphenol-A (DGEBA), silicon incorporated epoxy (SE) and siliconized epoxy resin (EP-HTPDMS) were modified with 5, 10 and 15 wt% of benzoxazines using 4,4′-diaminodiphenylmethane as a curing agent at appropriate conditions. The chemical reaction of benzoxazines with the epoxy resin was carried out thermally and the resulting product was analyzed by FT-IR spectra. The glass transition temperature, curing behavior, thermal stability, char yield and flame resistance of the hybrid polymers were analysed by means of DSC, TGA and DMA. Mechanical properties were studied as per ASTM standards. The benzoxazines modified epoxy resin systems exhibited lower values of dielectric constant and dielectric loss with an enhanced values of of arc resistance, glass transition temperatures, degradation temperatures, thermal stability, char yield, storage modulus, tensile strength, flexural strength and impact strength.     

Syntheses,structure, reactivity,and thermal properties of new cyclic phosphine oxide epoxy resins cured by diamines

A new type of epoxy resin which contained cyclic phosphine oxide group in the main chain was synthesized. The structure of the new type of epoxy resin was confirmed by elemental analyses (EA), infrared spectroscopy (IR), and ¹H-NMR and ¹³C-NMR spectroscopies. In addition, compositions of the new synthesized cyclic phosphine oxide epoxy resin (EPCAO) with three curing agents, e.g., bis(3-aminophenyl)methylphosphine oxide (BAMP), 4,4′-diamino-diphenylmethane (DDM), and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardancy with that of Epon828 and DEN438. The reactivities were measured by differential scanning calorimetry (DSC). Through the evaluation of thermal gravimetric analysis (TGA), those polymers which were obtained through the curing reactions between the new epoxy resin and three curing agents (BAMP, DDM, DDS) also demonstrated excellent thermal properties as well as a high char yield. © 1996 John Wiley & Sons, Inc.     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Miscibility and cure kinetics studies on blends of bisphenol-A polycarbonate and tetraglycidyl-4,4′-diaminodiphenylmethane epoxy cured with an amine

Differential scanning calorimetry (DSC) has been applied to characterize the glass transition behavior of the blends formed by bisphenol-A polycarbonate (PC) with a tetrafunctional epoxy (tetraglycidyl-4,4′-diaminodiphenyl methane, TGDDM) cured with 4,4′-diaminodiphenylsulphone (DDS). A rare miscibility in the complete composition range has been demonstrated in these blends. Additionally, the blend morphology was examined using scanning electron microscopy (SEM) and a homogeneous single-phase PC/epoxy network has been observed in the blends of all compositions. Moreover, polycarbonate incorporation has been found to exert a distinct effect on the cure behavior of the epoxy blends. The cure reaction rates for the epoxy-PC blends were significantly higher due to the presence of PC. In addition, the cure mechanism of the epoxy blends was no longer autocatalytic. An n-th order reaction mechanism with n = 1.2 to 1.5 has been observed for the blends of DDS-cured epoxy with PC of various compositions studied using DSC. The proposed n-th order kinetic model has been found to describe well the cure behavior of the epoxy/PC blends up to the vitrification point. © 1995 John Wiley & Sons, Inc.     

Near‐infrared spectroscopic studies on the cure behaviors of the CAE/DGEBA blend system initiated by a thermal latent catalyst

The latent properties and cure behaviors of an epoxy blend system based on cycloaliphatic epoxy (CAE) and diglycidyl ether of bisphenol A (DGEBA) epoxy containing N‐benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator were investigated with near‐infrared (N‐IR) spectroscopy. The assignments of the latent properties and cure kinetics were performed by the measurements of the N‐IR reflectance for epoxide and hydroxyl functional groups at different temperatures and compositions. As a result, this system showed more than one type of reaction, and BPH was an excellent thermal latent catalyst without any coinitiator. The cure behaviors were identified by the changes in the absorption intensity of the hydroxyl groups at 7100 cm⁻¹ with different composition ratios. Moreover, characteristic N‐IR band assignments were used to evaluate the reactive kinetics and were shown to be an appropriate method for studying the cure behaviors of the CAE/DGEBA blend system containing a thermal latent catalyst. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 326–331, 2001     

Facile synthesis of bio-based phosphorus-containing epoxy resins with excellent flame resistance

The development of high-performance biomass-derived epoxy thermosets with excellent flame resistance is vital to various applications (i.e., composites, coatings and adhesives). Herein, a difunctional epoxy monomer bis(2-methoxy-4-(oxiran-2-ylmethyl)phenyl) phenyl phosphate (BEU-EP) was synthesized from abundant and biobased eugenol. In addition, BEU-EP was cured by 4,4′-diaminodiphenyl methane (DDM) and the cured resin diglycidyl ether of bisphenol A (DGEBA)/DDM was used as a reference. Results indicated that BEU-EP/DDM not only showed a 58.1%, 28.8% and 35.1% increase in residual char (at 700 °C), flexural and storage modulus (at 30 °C) compared with DGEBA/DDM, but also exhibited excellent flame resistance and smoke suppression. BEU-EP/DDM passed V-0 rating (in UL-94 testing) with limiting oxygen index (LOI) of 38.4% and greatly decreased the peak heat release rate (pHRR) and total smoke production (TSP) by 84.9% and 80.5%, respectively. The mechanism analysis confirmed that the phosphorus-containing group and aromatic structure from BEU-EP contributed both the gas and condensed-phase flame retardation of BEU-EP/DDM network. This work provides an efficient and scalable route for synthesizing biobased epoxy thermosets with high integrated performance and superior flame resistance.     

Hybrid epoxy-based thermosets based on polyhedral oligosilsesquioxane: Cure behavior and toughening mechanisms

Polyhedral oligosilsesquioxane (POSS)-reinforced thermosets based on octaglycidyl epoxy polyhedral oligosilsesquioxane cured with 4,4′-diaminodiphenyl sulfone (DDS) were prepared and studied for their cure, thermomechanical, and microstructural characteristics. Particular attention was paid to nanometer-scale deformation processes responsible for toughening, as revealed by transmission electron microscopy (TEM) in conjunction with the thermal properties. A cure analysis investigated with calorimetry and rheometry showed a significant dependence of the cure mechanism and kinetics on the DDS content, but all hybrid thermosets reacted completely below 300 °C into rigid solids. A dynamic mechanical analysis of this hybrid resin system showed that increasing the DDS concentration used during cure increased the dynamic storage modulus in the glassy (temperature < glass-transition temperature) and rubbery (temperature > glass-transition temperature) states, simply through an increase in the crosslink density. The phase structures revealed by TEM with selective POSS staining were drastically affected by the DDS concentration and manifested as altered nanomechanical deformation structures. It was qualitatively found that the main toughening mechanism in the studied POSS-reinforced thermosets was void formation at the nanometer scale, possibly templated by limited POSS aggregation. As the crosslinking density increased with the DDS concentration, microshear yielding between voids prevailed, providing a balance of stiffness, strength, and toughness. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 3299–3313, 2003     

Cure Kinetics of Poly(acrylonitrile-butadiene-styrene) Modified Epoxy–Amine System

The cure kinetics of epoxy based on the diglycidyl ether of bisphenol A (DGEBA) modified with different amounts of poly(acrylonitrile-butadiene-styrene) (ABS) and cured with 4,4′-diaminodiphenylsulfone (DDS) was investigated by employing differential scanning calorimetry (DSC). The curing reaction was followed by using an isothermal approach over the temperature range 150–180°C. The amount of ABS in the blends was 3.6, 6.9, 10 and 12.9 wt%. Blending of ABS in the epoxy monomer did not change the reaction mechanism of the epoxy network formation, but the reaction rate seems to be decreased with the addition of the thermoplastic. A phenomenological kinetic model was used for kinetic analysis. Activation energies and kinetic parameters were determined by fitting the kinetic model with experimental data. Diffusion control was incorporated to describe the cure in the latter stages, predicting the cure kinetics over the whole range of conversion. The reaction rates for the epoxy blends were found to be lower than that of the neat epoxy. The reaction rates decreased when the ABS contents was increased, due to the dilution effect caused by the ABS on the epoxy/amine reaction mixture.     

环氧树脂/氧化石墨纳米复合物的等温固化行为研究

用示差扫描分析仪(DSC)研究了氧化石墨(GO)对N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯基甲烷环氧树脂(TGDDM)/4,4'-二氨基二苯基砜(DDS)体系的等温固化反应的影响,用X射线光电子能谱仪(XPS)和傅里叶变换红外光谱仪(FTIR)研究了GO上存在的官能团及其对TGDDM/DDS体系固化行为的影响,用热失重分析仪(TGA)研究了天然石墨和GO的热力学稳定性.XPS、FTIR和TGA结果表明,GO上存在的大量羟基、羧基、环氧基等官能团能够影响环氧树脂的固化行为.DSC研究发现,环氧树脂/氧化石墨纳米复合物的固化反应属于自催化类型,随着GO含量的增加,达到最大反应速率的时间不断减小,初始反应速率不断增大,这说明GO对环氧树脂的固化反应有促进作用.Kamal模型计算得到的结果表明,随着GO含量的增加自催化反应初期阶段表观活化能E1先减小再增大,而自催化反应结束后表观活化能E2略微减小.经Kamal模型扩散控制函数修正后,整个固化过程中拟合得到的结果与实验数据相当吻合.以上结果说明,少量的GO对TGDDM/DDS体系的固化反应起着催化作用.     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006