Effect of film properties on the material removing characteristics in femtosecond laser rear-side ablation of chromium film

The microfabrication of films with femtosecond lasers has been researched widely for its high spatial resolution and sub-spot-size features. Compared with the common front-side ablation, femtosecond laser rear-side ablation mechanism of films is more complex due to the possible film breaking process. In this paper, the effect of film properties such as adhesion strength and cohesion strength on the material removing characteristics in femtosecond laser rear-side ablation of Cr film is investigated. The possible film breaking process in the rear-side ablation is analyzed firstly, and then some experiments with different films, the vapor deposited Cr film, the sputtered Cr film and the Cr film of photomask are performed. The experimental results indicate that the film properties are key factors influencing material removal characteristics for laser rear-side ablation. By varying film properties and laser fluence, femtosecond laser rear-side ablation technique can be applied in laser cleaning process and fabrication of nanostructures. The unique feature of rear-side ablation will widen the application of femtosecond laser micromachining technique.     

Effects of closed immersion filtered water flow velocity on the ablation threshold of bisphenol A polycarbonate during excimer laser machining

A closed flowing thick film filtered water immersion technique ensures a controlled geometry for both the optical interfaces of the flowing liquid film and allows repeatable control of flow-rate during machining. This has the action of preventing splashing, ensures repeatable machining conditions and allows control of liquid flow velocity. To investigate the impact of this technique on ablation threshold, bisphenol A polycarbonate samples have been machined using KrF excimer laser radiation passing through a medium of filtered water flowing at a number of flow velocities, that are controllable by modifying the liquid flow-rates. An average decrease in ablation threshold of 7.5% when using turbulent flow velocity regime closed thick film filtered water immersed ablation, compared to ablation using a similar beam in ambient air; however, the use of laminar flow velocities resulted in negligible differences between closed flowing thick film filtered water immersion and ambient air. Plotting the recorded threshold fluence achieved with varying flow velocity showed that an optimum flow velocity of 3.00 m/s existed which yielded a minimum ablation threshold of 112 mJ/cm². This is attributed to the distortion of the ablation plume effected by the flowing immersion fluid changing the ablation mechanism: at laminar flow velocities Bremsstrahlung attenuation decreases etch rate, at excessive flow velocities the plume is completely destroyed, removing the effect of plume etching. Laminar flow velocity regime ablation is limited by slow removal of debris causing a non-linear etch rate over ‘n’ pulses which is a result of debris produced by one pulse remaining suspended over the feature for the next pulse. The impact of closed thick film filtered water immersed ablation is dependant upon beam fluence: high fluence beams achieved greater etch efficiency at high flow velocities as the effect of Bremsstrahlung attenuation is removed by the action of the fluid on the plume; low fluences loose efficiency as the beam makes proportionally large fluence losses at it passes through the chamber window and immersion medium.     

Damage mechanism and morphology characteristics of chromium film in femtosecond laser rear-side ablation

In this paper, damage mechanism and morphology characteristics of chromium film in femtosecond laser rear-side ablation are investigated. The film removing process includes two key sub-processes: the laser ablation dynamic process and subsequent breaking and ejecting dynamic process. Film morphology in rear-side ablation is determined by the interrelation between the laser energy and the film strength. When lower laser energy is used, residual out-layer film is relative thick and tends to break into some large fragments, which results in an irregular ablation shape. While when higher pulse energy is used, thinner residual film with weaker break strength breaks into small fragments, the ablation quality improves correspondingly. Besides laser energy and film property, energy distribution of laser beam also affects the ablation quality. In experiments, this kind of effect is researched by changing the focal position. It is found that ripples, which are familiar nano-structures in front-side ablation, also exist in rear-side ablation. These ripples are formed initially at the interface between quartz substrate and film, and their coverage varies with the energy distribution. Additionally, increasing number of scans is an effective method to shorten the period of ripples.     

Ultrafast double pulses ablation of Cr film on glass

Ultrafast lasers ablation of Cr film was investigated by using double-pulse method. Experimental results show that there exists a temporal ablation window effect with each of the double pulses adjusted just smaller than the threshold. When the delay between the double pulses is within the order of 400 ps, the ablation of Cr film could happen. When the delay between the double pulses is beyond the order of 400 ps, the ablation of Cr film would not happen, and the reflectivity from the surface of the Cr film shows a sharp rise at the same time. The two-temperature model was developed into the form of double pulses to explain the experimental phenomena. Furthermore, microbump structures were formed on the surface of Cr film after ablation by ultrafast double pulses. Their heights exhibit an obvious drop between 1 and 10 ps double pulses delay, which is involved with the electron-phonon coupling process according to the numerical simulation. These results should be helpful for understanding the dynamic processes during ultrafast lasers ablation of metal films.     

Ultrafast laser ablation of indium tin oxide thin films for organic light-emitting diode application

Ultrafast laser ablation of ITO thin film coated on the glass has been investigated as a function of laser fluence as well as the number of laser pulses. The ablation threshold of ITO thin film was found to be 0.07 J/cm² that is much lower than that of glass substrate (about 1.2–1.6 J/cm²), which leads to a selective ablation of ITO film without damage on glass substrate. The changes in the electrical resistance and morphology of ablated trench of ITO electrode were found to be strongly dependent on the processing conditions. We present the performance of organic light-emitting diodes (OLED) fabricated with ITO electrode patterned by ultrafast laser ablation.     

Effect of synthesis conditions on the metal-semiconductor phase transition in vanadium dioxide thin films

The effect of the conditions of synthesis and of the substrate material on the metal-semiconductor phase transition in thin vanadium dioxide films prepared using laser ablation has been studied. The broadening of the hysteresis loop is shown to be due to a decrease in the size of the crystal grains making up the film. Conjectures are put forward to explain the formation of asymmetric hysteresis loops.     

Optical transmission and reflection of aluminum film irradiated by nanosecond laser beam and experimental studying of phase-explosion

In this paper we present evidence for a phase explosion during the laser-induced ablation process by studying the optical reflectivity of the ablated plume. The ablation was produced by irradiating thin film aluminum coated on a quartz substrate with a single pulse laser beam in ambient air. The laser pulse was provided by the second harmonic of a Q-switched Nd:YAG laser with ∼10 ns pulse duration. The transmission of a low power He–Ne laser beam through the hot ablated material plume and its reflection (from the front surface, and rear surface of aluminum film) were also monitored during the duration of the ablation event. The results show that the front surface reflectivity is enhanced at an early time of ablation which is described as strong evidence for the creation of a phase explosion in this process.     

Effective removal of adhering cells via ultrashort laser pulses

A technique for accurately and effectively removing adhering red blood cells in a blood plasma thin film via a picosecond pulsed laser was developed. The laser beam was focused to the surface of the film to generate plasma-mediated ablation and an automated stage was employed for raster scan. The SEM images showed that the red blood cells distributed in the ablation scanned area were removed neatly, leaving the surroundings and the film base intact. For cells across the boundary between the ablated and untreated areas, a trim cutting interface was observed. Complete ablation of red blood cells in the target area is achieved without visible thermal and collateral damage in the remaining structure. The removal method is very effective because it is not necessary to selectively focus a laser beam on individual target cells and remove cells one by one. The ablation is scanned over a certain size of area, enabling practical cell killing or microbial decontamination in clinical/industrial scale.     

The influence of thermal diffusion on laser ablation of metal films

Single-shot ablation thresholds of nickel and gold films in the thickness range from 50 nm to 7 m have been measured for 14 ns laser pulses at 248 nm, using photoacoustic shock wave detection in air. The metal films were deposited on fused silica substrates. The ablation threshold was found to increase linearly with film thickness up to the thermal diffusion length of the film. Beyond this point it remains independent of film thickness. The proportionality between threshold fluence and thickness allows the prediction of ablation thresholds of metal films from the knowledge of their optical properties, evaporation enthalpies and thermal diffusivities. Physically it proves that ablation is driven by the energy density determined by the thermal diffusion length. A simple thermodynamic model describes the data well. Thermal diffusivities, an essential input for this model, were measured using the technique of transient thermal gratings. In addition, the substrate dependence of the ablation threshold was investigated for 150 nm Ni films.     

Single-shot ablation threshold of chromium using UV femtosecond laser pulses

Single-shot ablation threshold for thin chromium film was studied using 266 nm, femtosecond laser pulses. Chromium is a useful material in the nanotechnology industry and information on ablation threshold using UV femtosecond pulses would help in precise micromachining of the material. The ablation threshold was determined by measuring the ablation crater diameters as a function of incident laser pulse energy. Absorption of 266 nm light on the chromium film was also measured under our experimental conditions, and the absorbed energy single-shot ablation threshold fluence was \(46 \pm 5\)  mJ/cm². The experimental ablation threshold fluence value was compared to time-dependent heat flow calculations based on the two temperature model for ultrafast laser pulses. The model predicts a value of 31.6 mJ/cm² which is qualitatively consistent with the experimentally obtained value, given the simplicity of the model.     

Time-resolved measurements during backside dry etching of fused silica

The laser-induced backside dry etching (LIBDE) investigated in this study makes use of a thin metal film deposited at the backside of a transparent sample to achieve etching of the sample surface. For the time-resolved measurements at LIBDE fused silica samples coated with 125 nm tin were used and the reflected and the transmitted laser intensities were recorded with a temporal resolution of about 1 ns during the etching with a ∼30 ns KrF excimer laser pulse. The laser beam absorption as well as characteristic changes of the reflection of the target surface was calculated in dependence on the laser fluence in the range of 250-2500 mJ/cm² and the pulse number from the temporal variations of the reflection and the transmission. The decrease of the time of a characteristic drop in the reflectivity, which can be explained by the ablation of the metal film, correlates with the developed thermal model. However, the very high absorption after the film ablation probably results in very high temperatures near the surface and presumably in the formation of an absorbing plasma. This plasma may contribute to the etching and the surface modification of the substrate. After the first pulse a remaining absorption of the sample was measured that can be discussed by the redeposition of portions of the ablated metal film or can come from the surface modification in the fused silica sample. These near-surface modifications permit laser etching with the second laser pulse, too.     

Thermal characteristics of double-layer thin film target ablated by femtosecond laser pulses

Thermal characteristics of tightly-contacted copper--gold double-layer thin film target under ablation of femtosecond laser pulses are investigated by using a two-temperature theoretical model. Numerical simulation shows that electron heat flux varies significantly on the boundary of copper--gold film with different maximal electron temperature of 1.15×10³ K at 5 ps after ablating laser pulse in gold and copper films, which can reach a balance around 12.6 ps and 8.2 ps for a single and double pulse ablation, respectively, and in the meantime, the lattice temperature difference crossing the gold--copper interface is only about 0.04×10³ K at the same time scale. It is also found that electron--lattice heat relaxation time increases linearly with laser fluence in both single and double pulse ablation, and a sudden change of the relaxation time appears after the laser energy density exceeds the ablation threshold.     

Ablation of polymer foils for backside opening of thin film layered flexible polymer substrates

For increasing the packing density of electronic devices and enabling 3D wiring, new concepts of interconnection for flexible circuit boards are required. The backside wiring is one innovative concept which, however, requires interconnections from the back to the front side by means of vias.Results on backside opening of polymer foils for exposing a thin metal film deposited at the front side are presented. For the experiments, a thin polyimide foil covered with a thin molybdenum metal film was used. By using mask projection of a pulsed UV-laser beam (248 nm, 20 ns) polymer foil was ablated. The laser ablation process must be adjusted in the manner to avoid damage of the thin metal film, to prevent cones formation at laser ablation, but still enabling the clean ablation of the polymer. The influence of process parameters on the backside opening is discussed and compared with theoretical estimations of the laser-induced temperatures. Using a two-step ablation process applying first high fluences to ablate the main part of the foil and finishing with low laser fluence turns out to be advantageous. This backside opening (BSO) can be used to perform an electrical contact from the backside.     

Ablation of silicon suboxide thin layers

We investigate the ablation of SiO _x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm² to above 3 J/cm². SiO _x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm²) the ablation depth corresponds roughly to the film thickness, above 1 J/cm² part of the substrate is ablated as well. In the case of front-side ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm². Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.     

Influence of processing time on nanoparticle generation during picosecond-pulsed fundamental and second harmonic laser ablation of metals in tetrahydrofuran

The influence of fundamental and second harmonic wavelength on ablation efficiency and nanoparticle properties is studied during picosecond laser ablation of silver, zinc, and magnesium in polymer-doped tetrahydrofuran. Laser ablation in stationary liquid involves simultaneously the fabrication of nanoparticles by ablation of the target material and fragmentation of dispersed nanoparticles by post irradiation. The ratio in which the laser pulse energy contributes to these processes depends on laser wavelength and colloidal properties. For plasmon absorbers (silver), using the second harmonic wavelength leads to a decrease of the nanoparticle productivity over process time along with exponential decrease in particle diameter, while using the fundamental wavelength results in a constant ablation rate and linear decrease in particle diameter. For colloids made of materials without plasmon absorption (zinc, magnesium), laser scattering is the colloidal property that limits nanoparticle productivity by Mie-scattering of dispersed nanoparticle clusters.     

Shadowgraphy investigation of laser-induced forward transfer: Front side and back side ablation of the triazene polymer sacrificial layer

Thin films of a photodecomposible triazene polymer are used as sacrificial layer for the micro-deposition of sensitive materials by laser-induced forward transfer. To understand the ablation process of this sacrificial layer, the ultraviolet laser ablation of triazene films was investigated by time-resolved shadowgraphy. Irradiation from the film side shows a complete decomposition into gaseous fragments, while ablation through the substrate causes ejection of a solid flyer of polymer. The occurence of the flyer depends on the film thickness as well as on the applied fluence, and a compact flyer is obtaind when these two parameters are optimized.     

355 nm nanosecond pulsed Nd:YAG laser profile measurement, metal thin film ablation and thermal simulation

Laser ablation of nickel, gold and copper thin film on glass substrates has been investigated using a nanosecond pulsed Nd:YAG laser operating at 355 nm in air with a Gaussian intensity profile. The exact beam profile was measured through mechanical scanning with a photodiode. A small beam defect was observed, which can affect the machining performance at higher pulse energies. The ablation thresholds of the films were calculated from the crater diameter values. The effect of the pulse repetition rate and the film thickness was also studied. At high pulse repetition rates heat accumulation was observed and the ablation threshold decreased with the film thickness. Both cases resulted in higher diameters.     

Sub-picosecond UV-laser ablation of Ni films

Laser ablation of thin Ni films on fused silica by 0.5 ps KrF-excimer-laser pulses at 248 nm is reported. The onset of material removal from different film thicknesses (0.1, 0.3, 0.6 and 1.0 m) was measured in a laser ionization time-of-flight mass spectrometer by the amount of Ni atoms vs laser fluence. Significant amounts of metal atoms are already evaporated at laser fluences around 20 mJ/cm², a threshold up to 100 times smaller compared to the one for 14 ns pulses. In contrast to ns laser pulses, the ablation threshold for 0.5 ps pulses is independent of the film thickness. These results reflect the importance of thermal diffusion in laser ablation of strongly absorbing and thermally good conducting materials and prove that for ablation with short pulses, energy loss to the bulk is minimized.     

Evaluation of excimer laser ablation of thin Cr film on glass substrate by analysing acoustic emission

Excimer laser ablation of a thin Cr film on a glass substrate was evaluated through detecting acoustic emission arising from the ablation process and observing surface morphology. In the experiment, an acoustic emission transducer was coupled to the sample to acquire acoustic emissions of laser–material interaction and an oscilloscope was used to record the signals. The patterned areas were examined by using an optical microscope. Characteristics of the acoustic emissions were studied through applying a range of signal analysis tools. Several features (e.g., average power, RMS) showed a clear linkage with the ablation mechanism of thin Cr film when varying the fluence of the laser source. Moreover, the damage to the glass substrate was well discriminated by the extracted features. In sum, evaluation of acoustic emissions not only provided a tool to study the ablation mechanisms of the thin metal film but also addressed a monitoring strategy for excimer laser micromachining.     

Formation of silicon nanoparticles and web-like aggregates by femtosecond laser ablation in a background gas

We show that the mechanism of nanoparticle formation during femtosecond laser ablation of silicon is affected by the presence of a background gas. Femtosecond laser ablation of silicon in a H₂ or H₂S background gas yields a mixture of crystalline and amorphous nanoparticles. The crystalline nanoparticles form via a thermal mechanism of nucleation and growth. The amorphous material has smaller features and forms at a higher cooling rate than the crystalline nanoparticles. The background gas also results in the suspension of plume material in the gas for extended periods, resulting in the formation (on a thin film carbon substrate) of unusual aggregated structures including nanoscale webs that span tears in the film. The presence of a background gas provides additional control of the structure and composition of the nanoparticles during short pulse laser ablation. PACS 81.16.-c