Effect of the stoichiometry on the electronic structure of the Ni（111）/α-Al2O3（0001） interface： a first-principles investigation

In this paper first-principles calculations of Ni（111）/α-Al2O3（0001） interfaces have been performed, and are compared with the preceding results of the Cu （111）/α-Al2O3（0001） interface [2004 Phil. Mag. Left. 84 425]. The AI- terminated and O-terminated interfaces have quite different adhesion mechanisms, which are similar to the Cu（111）/α Al2O3（0001） interface. For the O-terminated interface, the adhesion is caused by the strong O-2p/Ni-3d orbital hybridization and ionic interactions. On the other hand, the adhesion nature of the Al-terminated interface is the image-like electrostatic and Ni-Al hybridization interactions, the latter is substantial and cannot be neglected. Charge transfer occurs from Al2O3 to Ni, which is opposite to that in the O=terminated interface. The charge transfer direction for the Al-terminated and O-terminated Ni（111）/α-A1203（0001） interfaces is similar to that in the corresponding Cu（111）/α- Al2O3（0001） interface, but there exist the larger charge transfer quantity and consequent stronger adhesion nature, respectively.     

The influence of interfacial barrier engineering on the resistance switching of In₂O₃:SnO₂/TiO₂/In₂O₃:SnO₂ device

The I–V characteristics of In2O3:SnO2/TiO2/In2O3:SnO2 junctions with different interfacial barriers are inves- tigated by comparing experiments. A two-step resistance switching process is found for samples with two interfacial barriers produced by specific thermal treatment on the interfaces. The nonsynchronous occurrence of conducting filament formation through the oxide bulk and the reduction in the interfacial barrier due to the migration of oxygen vacancies under the electric field is supposed to explain the two-step resistive switching process. The unique switching properties of the device, based on interfacial barrier engineering, could be exploited for novel applications in nonvolatile memory devices.     

La0.5Ca0.5MnO3内禀与界面电脉冲诱导电阻转变效应的比较

一般地,钛矿结构锰氧化物的电脉冲诱导电阻转变(EPIR) 效应源于非内禀界面处的肖特基势垒. 本文采用固相烧结法制备了La_0.5Ca_0.5MnO₃ (LCMO)陶瓷样品, 用四线测量模式对样品电输运性质, 特别对其内禀EPIR效应和忆阻器行为进行了研究. 室温下, 尽管样品在四线测量模式下的I-V特性曲线呈欧姆线性规律, 但在适当的脉冲电压刺激下, 仍能诱导产生明显、稳定的EPIR效应. 通过与二线模式的界面EPIR比较, 发现LCMO内禀EPIR效应具有更小的脉冲临界电压、更好的稳定性和抗疲劳特性, 是稀土掺杂锰氧化物中观察到的一类新颖的EPIR效应. 关键词： 钙钛矿结构锰氧化物 电致电阻效应 电脉冲诱导电阻转变效应 肖特基势垒     

Bipolar resistance switching in the fully transparent BaSnO_3-based memory device

The fully transparent indium-tin-oxide/BaSnO3/F-doped SnO2 devices that show a stable bipolar resistance switching effect are successfully fabricated. In addition to the transmittance being above 87% for visible light, an initial forming process is unnecessary for the production of transparent memory. Fittings to the current-voltage curves reveal the interfacial conduction in the devices. The first-principles calculation indicates that the oxygen vacancies in cubic BaSnO3 will form the defective energy level below the bottom of conduction band. The field-induced resistance change can be explained based on the change of the interracial Schottky barrier, due to the migration of oxygen vacancies in the vicinity of the interface. This work presents a candidate material BaSnO3 for the application of resistive random access memory to transparent electronics.     

Ti/HfO2/Pt阻变存储单元中的氧空位聚簇分布

为了研究阻变存储器导电细丝的形成位置和分布规律, 使用X射线光电子能谱研究了Ti/HfO₂/Pt阻变存储器件单元中Hf 4f的空间分布, 得到了阻变层的微结构信息. 通过I-V测试, 得到该器件单元具有典型的阻变特性; 通过针对Hf 4f的不同深度测试, 发现处于低阻态时, 随着深度的增加, Hf⁴⁺化学组分单调地减小; 而处于高阻态和未施加电压前, 该组分呈现波动分布; 通过Hf⁴⁺在高阻态和低阻态下组分含量以及电子能损失谱分析, 得到高阻态下Hf⁴⁺组分的平均含量要高于低阻态; 另外, 高阻态和低阻态下的O 1s谱随深度的演变也验证了Hf⁴⁺的变化规律. 根据实验结果, 提出了局域分布的氧空位聚簇可能是造成这一现象的原因. 空位簇间的链接和断裂决定了导电细丝的形成和消失. 由于导电细丝容易在氧空位缺陷聚簇的地方首先形成, 这一研究为导电细丝的发生位置提供了参考.     

Enhanced resistance switching stability of transparent ITO/TiO2/ITO sandwiches

We report that fully transparent resistive random access memory(TRRAM) devices based on ITO/TiO2/ITO sandwich structure,which are prepared by the method of RF magnetron sputtering,exhibit excellent switching stability.In the visible region(400-800 nm in wavelength) the TRRAM device has a transmittance of more than 80%.The fabricated TRRAM device shows a bipolar resistance switching behaviour at low voltage,while the retention test and rewrite cycles of more than 300,000 indicate the enhancement of switching capability.The mechanism of resistance switching is further explained by the forming and rupture processes of the filament in the TiO 2 layer with the help of more oxygen vacancies which are provided by the transparent ITO electrodes.     

Infrared Faraday rotation on thin film In2O3+SnO2 semiconductors

Two sets of thin film sputtered In₂O₃+SnO₂ samples, one prepared in argon atmosphere with oxigen, and the other without, at various temperatures between 100°C and 250°C, have been studied by measuring their Farday rotation from optical to infrared frequencies, as well as their optical transmission spectra. The effect of the different treatments on the carrier densities and mobilities, show values that grow with deposition temperature. This can be attributed to an increase in the number of oxygen vacancies. On the other hand, the presence of O₂ in the atmosphere during deposition, leads to smaller values at the same temperatures, compared to those obtained in samples prepared in atmosphere without oxygen, seemingly as a result of the filling of the vacancies.     

SnO2 / In2O3 one-dimensional nano-core-shell structures: Synthesis, characterization and photoluminescence properties

SnO₂/In₂O₃ one-dimensional nano-core-shell structures have been synthesized at 1350 ^°C by thermal evaporation of the mixture of metal Sn, Fe(NO₃)₃ powders and In particles. The as-synthesized products have been characterized by energy-dispersive X-ray spectroscopy, selected-area electron diffraction and high-resolution transmission electron microscopy. Microstructure characterization indicates the orientation relationship between core and shell is , . The formation mechanism of this nano-core-shell structure can be attributed to the cover of In₂O₃ on the surface of SnO₂ nanochains. The photoluminescence properties of the nano-core-shell structures have been measured. The PL spectrum shows some difference with the result from pure SnO₂ and In₂O₃ nanostructure that be deemed to relate to interface defects in SnO₂/In₂O₃ nano-core-shell structure.     

Homogeneous interface-type resistance switching in Au/La0.67Ca0.33MnO3/SrTiO3/F:SnO2 heterojunction memories

La0.67Ca0.33MnO3 thin films are fabricated on fluorine-doped tin oxide conducting glass substrates by a pulsed laser deposition technique with SrTiO3 used as a buffer layer. The current-voltage characteristics of the heterojunetions exhibit an asymmetric and resistance switching behaviour. A homogeneous interface-type conduction mechanism is also reported using impedance spectroscopy. The spatial homogeneity of the charge carrier distribution leads to field- induced potential-barrier change at the Au-La0.67Ca0.33MnO3 interface and a concomitant resistance switching effect. The ratio of the high resistance state to the low resistance state is found to be as high as 1.3 x 10^4% by simulating the AC electric field. This colossal resistance switching effect will greatly improve the signal-to-noise ratio in nonvolatile memory applications.     

单根SnO_2纳米线器件的电输运性能及其机理研究

为探究常态环境下氧空位对单根SnO_2纳米线电输运性能的影响,采用化学气相沉积法合成了SnO_2纳米线,通过光刻微加工技术构筑了Au/单根SnO_2纳米线/Au二端纳米器件.将单根SnO_2纳米器件进行氢化处理,测试其在空气与真空中的伏安特性曲线,发现单根SnO_2纳米线在空气和真空环境中呈现异常不同的电输运特性:在空气中,加偏压注入电子会使通过纳米器件的电流减小,Au电极与SnO_2纳米线之间的接触势垒增大;抽真空后,在偏压的影响下,通过纳米器件的电流增大,Au/SnO_2交界面的接触方式由肖特基接触转变成欧姆接触.实验分析表明,影响单根SnO_2纳米线电输运特性行为的因素与纳米线表面的氧原子吸附与脱吸附所引起的氧空位浓度的变化有关.为进一步分析氧空位浓度变化的作用,利用第一性原理计算方法计算了氧空位浓度对SnO_2纳米线电输运性能的影响,通过分析体系的能带结构、态密度及Au/SnO_2接触界面的I-V曲线和透射谱,发现随着氧空位浓度的增大,SnO_2纳米线的带隙变小.同时,氧空位缺陷使Au/SnO_2接触界面处电子透射率增大,体系电输运能力变强.该研究结果将为集成纳米功能器件的设计提供一种新思路.     

Dielectric-breakdown-like forming process in the unipolar resistance switching of Ta2O5−x thin films

We report unipolar resistance switching (URS) in Ta₂O_5−x thin films. The current increased suddenly when we applied voltages up to 5-7 V to the pristine state of Pt/Ta₂O_5−x/Pt, Ni/Ta₂O_5−x/Pt, and Ti/Ta₂O_5−x/Pt cells. Just after this forming process, we observed a repetitive URS occurring independently of the electrodes. We found that the required voltages for the forming process did not depend on the top electrode type, but on the film thickness. These results suggest that the forming process is driven by a dielectric-breakdown-like phenomenon, and that URS occurs due to the formation and rupture of conducting channels inside the Ta₂O_5−x thin film.