半导体晶圆制造中的设备效率和设备能力

在半导体制造车间中,设备是非常昂贵的,设备折旧与维修占生产成本组成的最大比重,设备利用率的提高显得尤为重要,因此设备效率和设备能力已成为半导体制造者最关心的问题之一.本文针对该问题,系统地介绍了半导体晶圆制造中设备效率和设备能力的衡量标准及其数据收集,以期达到提高设备利用率的目的.     

半导体晶圆制造中操作工数量的配置

对半导体制造中员工人数的配置问题进行了研究,提出了操作工人数的长期决策和短期决策两种情况,并用仿真模拟的方法对操作工数量需求进行动态研究,而非传统的静态模型.本文还对目前评价操作工绩效的指标进行了阐述,提出了在制品利用率作为评价指标.     

电子表格模型在半导体晶圆制造产能规划中的应用

半导体晶圆厂的设备非常昂贵,对设备利用率的要求较高,设计一套简单实用的办法进行产能规划是十分必要的.本文提出了产能规划的三大模块,在前两个模块中将建立半导体晶圆制造产能规划的电子表格模型(Spreadsheet),在第三个模块中利用产能规划模型的数据结果进行分析,总结出一些改进方法.通过在某半导体晶圆厂的实际应用,该产能规划模型有效地解决了投料不均,设备负荷率波动过大等问题.     

Crossing Automation进入450mm晶圆半导体制造市场

正Crossing Automation,Inc.是顶尖的半导体工厂和工具自动化产品设计厂商和制造商,当今最主要的半导体装置和设备公司均使用其产品。公司日前推出450 mm分类机,即Spartan 450。同时,公司宣布接到了另一顶尖半导体制造商的新型分类机订单。此平台计划于2012年第一季度发货。     

SEMI标准在半导体制造设备中的应用

SEMI标准是一项国际通用的半导体行业标准,为研究SEMI标准在半导体制造设备中的应用情况,介绍了SEMI S2半导体设备安全准则、SEMI F47半导体设备电压暂降抗扰度标准并说明了标准的实际应用。分析了SEMI S23半导体设备能源、电力和原料的使用效率标准、SECS/GEM通讯标准及其研究应用现状;提出了我国半导体产业的快速发展需要加大SEMI标准的普及应用。     

半导体晶圆制造中产量与生产周期的优化方法

在晶圆制造厂中,有时为了提高设备利用率而盲目地增加投料/产出速率,造成生产周期时间增长,在制品增多.本文建立效用函数和多目标决策对其进行优化选择,并且阐述了在晶圆制造厂实际生产中,经济原则对周期时间的影响.     

半导体后段制造自动化

越来越多的半导体厂商开始考虑在半导体后段生产中采用自动化控制，目前还没有开发出非常成功的技术能够满足变化多端的后段工厂。本文介绍了半导体制造自动化的概况，分析了半导体制造自动化的需求，进而提出了一种基于SECS／GEM标准接口的半导体制造全自动化生产线解决方案。所有设备全部都通过使用SECS标准接口连接到单元控制器及更高级别的MES和工厂计划信息系统，系统除了能完成通常的设备监视和控制、数据搜集、配方管理等功能外，还实现了单一元件追踪，具有Stripmap管理，缺陷管理及多芯片管理等功能。半导体厂商通过实施全自动化改善了生产力，同时减少生产周期和场地占用率，并通过最小化人工操作和过程的连贯性带来质量和可靠性的提升．     

光致抗蚀剂在半导体制造中的应用

本文对市场上可采用的光致抗蚀剂应用体系的现状进行评论并做出评价。当应用于半导体工业时,应用体系在光致抗蚀剂的制备中有严格的要求。本文讨论的内容如下:颗粒物质纯化的光致抗蚀剂的制备、表面条件及表面处理、抗蚀剂的旋转复涂机的应用、成象条件及紫外光源、显影、烘烤、腐蚀、清洗及去胶等。     

应用材料：晶圆设备年衰退50％

半导体及面板设备大厂应用材料总裁麦可史宾林特（Mike Splinter）曰前表示：由于晶圆厂产能利用率处于历史低点，内存及晶圆代工厂的利用率介于30％～70％，还有部份晶圆厂已经完全停工，在客户的利用率未回升前，晶圆制造设备资本支出不会复苏，预估今年晶圆制造设备市场将较去年衰退50％，仅剩100亿～120亿美元规模。     

Simultaneous Prediction for Multiple Key Performance Indicators in Semiconductor Wafer Fabrication

The prediction and key factors identification for lot Cycle time (CT) and Equipment utilization (EU) which remain the Key performance indicators (KPI)are vital for multi-objective optimization in semiconductor manufacturing industry.This paper proposes a prediction methodology which predicts CT and EU simultaneously and identifies their key factors.Bayesian neural network (BNN) is used to establish the simultaneous prediction model for Multiple key performance indicators (MKPI),and Bayes theorem is key solution in model complexity controlling.The closed-loop structure is built to keep the stability of MKPI prediction model and the weight analysis method is the basis of identifying the key factors for CT and EU.Compared with Artificial neural network (ANN)and Selective naive Bayesian classifier (SNBC),the simulation results of the prediction method of BNN are proved to be more feasible and effective.The prediction accuracy of BNN has been obviously improved than ANN and SNBC.     

Scheduling Semiconductor Wafer Fabrication Using a New Harmony Search Algorithm Based on Receipt Priority Interval

For the scheduling problem of Semiconductor wafer fabrication (SWF),a new Dispatching rule based on the load balance (DRLB) is proposed.Further,a new Harmony search (HS) algorithm based receipt priority interval (HS_rpi) is presented to minimize the mean cycle time.A kind of chaotic sequence is used as the harmony vector.Then,a conversion method is designed to convert the real number harmony vector to the mixed vector representing the priorities of all receipts and the algorithm parameters.In order to increase the algorithm robustness and decrease the scale of the scheduling problem,based on receipt priority interval and DRLB,we give a special conversion method used to convert the above mixed vector to the solution of the scheduling problem of SWF.Computational simulations based on the practical instances validate the proposed algorithm.     

基于鼓-缓冲器-绳子理论的晶圆厂生产优化研究

鼓-缓冲器-绳子(DBR)理论中瓶颈资源的生产往往采用启发式法则(如最早交货时间法则,EDD)进行安排,得到的排程结果一般不是最优解.为克服基于启发式法则进行瓶颈安排存在的不足,在考虑晶圆生产多目标特性的基础上,给出了瓶颈作业的双目标函数,在提高瓶颈产出率的同时减少订单延迟时间.同时,提出基于禁忌算法的瓶颈作业优化方法.与前期的研究成果相比,算例结果说明了研究的有效性.     

Impact of Production Control and System Factors in Semiconductor Wafer Fabrication

This paper validates a proposed job release methodology and experimentally investigates the impact of production control methodologies and system factors on wafer fab performance in terms of average cycle time, standard deviation of cycle time, average lateness, WIP inventory and fab output by simulating a wafer fab of Chartered Semiconductor Manufacturing Ltd (Chartered) and statistically analyzing the experimental results using t-test and ANOVA. A full factorial design of experiment is conducted to evaluate the performance of three job release methodologies, three dispatching rules and three greedy levels of batching policy under different system environmental settings differentiated by fab output level and machine unreliability level. Based on the experimental results, the proposed job release methodology WIPLOAD Control (WIPLCtrl) appears to be very efficient to be able to potentially improve all the considered performance measures simultaneously. The advantage of WIPLCtrl is robust to the change of system environmental conditions. In contrast, the improvement brought by a dispatching rule on a certain performance measure might cost the deterioration of other performances. Considering the relative impact on the fab performance, job release control appears to be the most important production control factor in comparison with dispatching and batching policy, especially when the system is operating on a high output level and/or with a high system variability level caused by machine unreliability.      

300mm晶圆对半导体设备的挑战

300mm晶圆生产线必须采用新标准、新技术、新流程、新设备、新布局、新厂房和新设施等。因此,300mm晶圆向半导体设备提出了挑战。     

模块化设计在半导体湿法清洗设备中的应用

论述了半导体湿法清洗设备的特点及模块化设计方法在半导体湿法清洗设备中的应用方式,阐明了模块化设计方法在半导体湿法清洗设备中应用的特点及注意事项。     

A Due-Date-Based Algorithm for Lot-Order Assignment in a Semiconductor Wafer Fabrication Facility

This paper focuses on a lot-order assignment problem, called the pegging problem, in a semiconductor wafer fabrication facility. Pegging is a process of assigning wafer lots to orders for wafers. We consider two types of pegging strategies: hard pegging strategy, under which the lot-order assignment is not changed once lots are assigned to orders; and soft pegging strategy, under which the lot-order assignment can be changed during the production period. For the soft pegging strategy, we develop three operational policies and three algorithms for the pegging problem of assigning lots to orders with the objective of minimizing total tardiness of the orders. To evaluate performance of the suggested policies and algorithms, we perform simulation experiments using real factory data as well as randomly generated data sets. Results of the simulation tests show that the repegging policies and the algorithms operated under the soft pegging strategy give better results than the hard pegging strategy.