532 nm纳秒激光辐照下的单晶硅表面微结构及荧光特性

采用Nd:YAG纳秒脉冲激光对单晶硅在空气中进行辐照,研究了表面微结构在不同能量密度和扫描速度下的演化情况。扫描电子显微镜测量表明,激光在相对较低能量密度下辐照硅表面诱导出鱼鳞状波纹结构,激光能量密度相对较大时,诱导出絮状多孔的不规则微结构。光致荧光谱（PL）表明,激光扫描区域在710 nm附近有荧光发射。用氢氟酸腐蚀掉样品表面的SiOx后,荧光峰的强度显著降低,说明SiOx在光致发光增强上起重要作用。能量色散X射线谱（EDS）表明氧元素的含量随激光能量密度的增大而增加。研究表明:纳秒激光的能量密度和扫描速度对微结构形成起着决定性作用,改变了硅材料表面微结构尺寸,增大了光吸收面积; 氧元素在光致发光增强上起重要作用,微构造硅和SiOx对光致荧光的发射都有贡献。     

飞秒脉冲激光辐照下硅表面光致荧光特性(英文)

采用钛宝石飞秒脉冲激光对单晶硅在空气中进行辐照,研究了硅表面在不同扫描速度和能量密度下的光致荧光特性。光致荧光谱(PL)测量表明,在样品没有退火处理的情况下,激光扫描区域观察到橙色荧光峰(603nm)和红色荧光带(680nm附近)。扫描电子显微镜(SEM)测量显示,在飞秒脉冲激光辐照硅样品的过程中硅表面沉积了大量的纳米颗粒。利用傅里叶变换红外光谱仪(FT-IR)检测到了低值氧化物SiOx(x2)的存在,并且结合能谱仪(EDS)检测结果发现氧元素在光致发光中起着重要作用。研究表明:603nm处橙色荧光峰来自微构造硅表面低值氧化物SiOx,680nm附近红色荧光带来自量子限制效应。同时样品表面硅纳米颗粒的尺寸和氧元素的浓度分别决定了红色荧光带和橙色荧光的强度,通过调节飞秒激光脉冲的扫描速度和能量密度,可以有效地控制样品的荧光强度。     

多孔硅量子点中的电子局域态

经过激光辐照和高温退火加工能够生成多孔硅样品,在650—780 nm处检测到很强的光致荧光（PL）峰,并且有明显的钉扎和增强效应.实验表明,这种PL发光的强度与样品受辐照和退火的时间短密切相关.通过第一性原理模拟计算发现,样品表面用SiO 双键和Si—O—Si桥键钝化,能隙中会出现电子局域态.激光辐照和高温退火的时间长短决定了样品表面SiO双键和Si—O—Si桥键的密度,而该密度正是影响多孔硅量子点中电子局域态生成的关键. 关键词： 多孔硅量子点 硅氧钝化键 电子局域态     

1064 nm纳秒脉冲激光诱导硅表面微结构研究

利用Nd:YAG纳秒激光(波长为1064 nm)在不同气氛(空气、N₂,真空)中对单晶硅进行累积脉冲辐照,研究了表面微结构的演化情况.在激光辐照的初始阶段,与532和355 nm纳秒脉冲激光在硅表面诱导出波纹结构不同,1064 nm脉冲激光诱导出了微孔结构和折断线结构,并且硅的晶面取向不同,相应的折断线结构也不同.对于Si(111)面,两条折线交角为120°或60°,形成网状;而对于Si(100)面,两条折断线正交,从而将表面分成了15—20 μm的矩形块.结果表明,微孔结构的生长过程主要与相爆炸有关,而折断线的形成主要是热应力作用的结果.不同气氛对微结构形成的影响表明,刻蚀率和生长率与微结构的形成有密切的关系. 关键词： 纳秒激光 硅的微结构 相爆炸 热应力     

a—Si：O：H薄膜微结构及其高温退火行为研究

以微区Raman散射、X射线光电子能谱和红外吸收对等离子体增强化学气相沉积（PECVD）法制备的氢化非晶硅氧（a-Si:O:H)薄膜微结构及其退火行为进行了细致研究。结果表明a-Si:O:H薄膜具有明显的相分离结构,富Si相镶嵌于富O相之中,其中富Si相为非氢化四面体结构形式的非晶硅（a-Si),富O相为Si,O,H三种原子随机键合形成的SiOx:H(x≈1.35)。经1150℃高温退火,薄膜中的H全部释出;SiOx:H(x≈1.35)介质在析出部分Si原子的同时发生结构相变,形成稳定的SiO2和SiOx(x≈0.64);在析出的Si原子参与下,薄膜中a-Si颗粒固相晶化的成核和生长过程得以进行,形成纳米晶硅（nc-Si),研究发现此时的薄膜具有典型的壳层结构,在nc-Si颗粒表面和外围SiO2介质之间存在着纳米厚度的SiOx(x≈0.64)中间相。     

不同气氛下SiOx纳米线的制备及形貌、红外、光致发光研究

以N2/H2、N2或NH3为载气,利用碳辅助化学气相沉积法,常压1140℃下在石英衬底上制备了大量直径为20-300 nm,长数百微米的非晶SiOx纳米线.制备得到的纳米线具有高度定向生长的特性.利用透射电子显微镜、扫描电子显微镜及电子能谱对SiOx纳米线的形貌及组分进行了分析,Si与O原子之比为1∶1.8.傅里叶红外吸收谱显示了非晶氧化硅的三个特征峰(482,806和1095 cm-1)及1132 cm-1无序氧化硅结构的强吸收峰.SiOx纳米线光致发光光谱(PL)在440 nm(2.83 eV)处具有较强的荧光峰;N2为载气生长的SiOx纳米线的PL峰强比NH3为载气生长的SiOx纳米线峰强大四个数量级.     

纳秒激光脉冲诱导硅表面微结构

利用Nd:YAG纳秒激光脉冲,在能量密度为1～10 J/cm2范围内辐照单晶硅,形成了表面锥形微结构,在SF6气氛和空气环境下均形成了锥形尖峰表面微结构。SF6气氛下产生的锥形尖峰顶端都有小球,部分锥形上还有二次尖峰形成,空气中纳秒激光诱导的锥形尖峰微结构顶端和边缘有由液滴固化形成的粒状物质,不同于利用准分子纳秒激光诱导的细长须状结构和飞秒激光辐照下产生的具有表面枝蔓状纳米结构的锥形微结构。实验结果表明,这种尖峰微结构的形成与辐照激光的波长和脉冲持续时间有关。对空气中微构造硅的辐射反射的初步研究表明,在500～2 400 nm范围内的光辐射反射率不高于20%。     

纳米Si-SiO_x和Si-SiN_x复合薄膜的低温制备及其发光特性

用等离子体增强化学气相沉积法在低温 (低于 5 0℃ )衬底上沉积Si SiOx 和Si SiNx 复合薄膜 ,可得到平均颗粒尺寸小至 3nm的高密度 (最高可达 4 0× 10 1 2 cm- 2 )纳米硅复合薄膜 .5 0 0℃快速退火后 ,这种复合薄膜显现出优异的可见光全波段光致发光特性 .通过比较相同条件下所制备的纳米Si SiOx 和Si SiNx 复合薄膜的光致发光效率 ,发现纳米Si SiNx 具有更为优异的光致发光效率 ,这一点在可见光短波区表现得尤为显著     

刻蚀改变InGaN/AlGaN应变多量子阱发光特性

为了分析干法刻蚀对应变多量子阱(SMQWs)发光特性的影响,采用感应耦合等离子体(ICP)刻蚀技术对金属有机物化学气相沉积(MOCVD)生长的InGaN/AIGaN应变多量子阱覆盖层表面刻蚀了约95 nm。通过光致发光(PL)特性表征发现,干法刻蚀后量子阱光致发光强度较未刻蚀量子阱光致发光强度提高了近3倍。干法刻蚀后,量子阱表面呈现高低起伏状形貌,粗糙度提高,出射光在起伏状粗糙形貌表面反复散射,从而逃逸概率增大,有助于光致发光强度增强。理论计算结果得出表面形貌变化引起的量子阱光致发光强度增强因子约为1．3倍。另外,由于所采用的感应耦合等离子体功率较小,刻蚀损伤深度几乎不会达到量子阱阱层,然而干法刻蚀过程中Ar离子隧穿到量子阱阱层内部可能形成新的发光中心,从而使量子阱的发光强度得到提高。     

刻蚀改变InGaN/AIGaN应变多量子阱发光特性

为了分析干法刻蚀对应变多量子阱(SMQWs)发光特性的影响,采用感应耦合等离子体(ICP)刻蚀技术对金属有机物化学气相沉积(MOCVD)生长的InGaN/AlGaN应变多量子阱覆盖层表面刻蚀了约95 nm.通过光致发光(PL)特性表征发现,干法刻蚀后量子阱光致发光强度较未刻蚀量子阱光致发光强度提高了近3倍.干法刻蚀后,量子阱表面呈现高低起伏状形貌,粗糙度提高,出射光在起伏状粗糙形貌表面反复散射,从而逃逸概率增大,有助于光致发光强度增强.理论计算结果得出表面形貌变化引起的量子阱光致发光强度增强因子约为1.3倍.另外,由于所采用的感应耦合等离子体功率较小,刻蚀损伤深度几乎不会达到量子阱阱层,然而干法刻蚀过程中Ar离子隧穿到量子阱阱层内部可能形成新的发光中心,从而使量子阱的发光强度得到提高.     

Strong visible photoluminescence in amorphous SiOx and SiOx : H thin films prepared by thermal evaporation of SiO powder

Amorphous SiO_x and SiO_x : H films were prepared by thermal evaporation of SiO powder in ultrahigh vacuum or under a flow of hydrogen ions onto silicon substrates maintained at 100°C. Photoluminescence (PL) can be seen in the visible range with the naked eye on the as-deposited samples without post-treatments. Composition and structure investigations were performed by infrared and Raman spectrometry experiments on films annealed at different temperatures. Hydrogen and oxygen bonding was studied by infrared spectrometry. The PL is attributed to the quantum confinement of excitons in a-Si clusters embedded in the a-SiO_x matrix. Our results demonstrate that oxygen creates an efficient potential barrier and no further passivation by hydrogen is necessary.     

Time-resolved photoluminescence study of the red emission in nanoporous SiGe alloys

Porous Si_1−xGe_x (PSiGe) layers with efficient room temperature visible photoluminescence (PL) were elaborated by anodical etching from p-type doped epitaxial layers with Ge contents from 5 to 30%. The luminescence is characterised by a broad PL band centred at 1.8 eV. Time resolved photoluminescence decay is studied in porous silicon germanium as a function of germanium content, temperature, emission energies and surface passivation. The PL decay line shape is well described by a stretched exponential in all cases. The effective lifetime at low temperature in as prepared porous Si_1−xGe_x is 400 μs, i.e. an order of magnitude less than in porous silicon. After the formation of a 20 Å thick oxide surface layer we observe a decrease of the effective lifetime to 20 μs at T=4 K.     

Infrared absorption spectra and compositions of evaporated silicon oxides (SiOx)

Clear and simple relationships among oxygen content, peak position in the 9–10 μm region and intensity of infrared absorption were obtained for a wide range of x value in evaporated silicon oxides (SiO_x). Using these relationships, the origin of 875 cm⁻¹ peak was proposed to be due to a vibrational mode from a structural combination of Si---(O_ySi_4-y) (y = 2, 3 and 4).     

Visible and infrared photoluminescence from Er-doped SiOx

The annealing behaviors of photoluminescence of SiO_x and Er-doped SiO_x grown by molecular beam epitaxy in the wavelength range of visible and infrared light are studied. For SiO_x, four PL bands located at 510, 600, 716 and 810 nm, respectively, are observed. For Er-doped SiO_x, the 716 nm band, which is believed to be originated from the electron–hole recombination at the interface between crystalline Si and amorphous SiO₂, disappears in the annealing temperature range of 500–900°C. It is suggested the enhancement of Er luminescence is partially due to the energy transfer from the recombination at the interface between crystalline Si and SiO₂ to Er ions.     

Erbium in silicon–germanium quantum wells

Strained Si_1−xGe_x/Si quantum wells have been doped with erbium by implantation. A comparison is made with strained Si_1−xGe_x/Si quantum wells and relaxed Si_1−xGe_x, with x between 10% and 25%, doped with erbium during MBE growth. The erbium concentration was between 1×10¹⁸ and 5×10¹⁸ cm⁻³ throughout the active regions. Transmission electron microscopy, X-ray diffraction, and photoluminescence studies indicate that good regrowth can been achieved after full amorphisation by implantation of the strained quantum wells. The erbium luminescence is more intense in the Si_1−xGe_x/Si layers, but erbium-implanted samples containing Si_1−xGe_x exhibit defect luminescence in the region of 0.9–1.0 eV. These defects are also present when Si_1−xGe_x/Si quantum wells are implanted with an amorphising dose of silicon, and then regrown. They are attributed to small germanium-rich platelets, rather than to erbium-related defects. Electroluminescence is presented from a forward biased erbium-implanted Si_0.87Ge_0.13/Si structure at a drive current density of only 1.8 mA/cm².     

UHV-MOCVD growth of TiO2 on SiOx/Si(1 1 1): Interfacial properties reflected in the Si 2p photoemission spectra

Metal–organic chemical vapour deposition growth of titanium oxide on moderately pre-oxidised Si(1 1 1) using the titanium(IV) isopropoxide precursor has been studied for two different growth modes, reaction-limited growth at 300 °C and flux-limited growth at 500 °C. The interfacial properties have been characterized by monitoring synchrotron radiation excited Si 2p photoemission spectra. The cross-linking from oxidised Si to bulk Si after TTIP exposure has been found to be very similar to that of SiO_x/Si(1 1 1). However, the results show that the additional oxidation of Si most probably causes a corrugation of the SiO_x/Si interface. Those conclusions are valid for both growth modes. A model is introduced in which the amorphous interface region is described as (TiO₂)_x(SiO₂)_y where x and y changes linearly and continuously over the interface. The model quantifies how (TiO₂)_x(SiO₂)_y mixing changes the relative intensities of the signals from silicon oxide and silicon. The method can be generalised and used for the analyses of other metal-oxides on silicon.     

包含硅量子点的富硅SiNx 薄膜结构与发光特性

采用等离子体增强化学气相沉积法, 以NH₃与SiH₄为反应气体, n型单晶硅为衬底, 低温(220 ℃)沉积了富硅氮化硅(SiN_x)薄膜. 在N₂氛围中, 于500–1100 ℃ 范围内对样品进行了热退火处理. 采用Raman 光谱技术分析了薄膜内硅量子点的结晶情况, 结果表明, 当退火温度低于950 ℃时, 样品的晶化率低于18%, 而当退火温度升为1100 ℃, 晶化率增加至53%, 说明大部分硅量子点都由非晶态转变为晶态. 实验通过Fourier 变换红外吸收(FTIR)光谱检测了样品中各键的键合结构演变, 发现Si–N键和Si–H键随退火温度升高向高波数方向移动, 说明了薄膜内近化学计量比的氮化硅逐渐形成. 实验还通过光致发光(PL)光谱分析了各样品的发光特性, 发现各样品中均有5个发光峰, 讨论了它们的发光来源, 结合Raman光谱与FTIR光谱表明波长位于500–560 nm的绿光来源于硅量子点, 其他峰则来源于薄膜内的缺陷态. 研究了硅量子点的分布和尺寸对发光带移动的影响, 并根据PL峰位计算了硅量子点的尺寸, 其大小为1.6–3 nm, 具有良好的限域效应. 这些结果有助于制备尺寸不同的硅量子点和基于硅量子点光电器件的实现. 关键词： 硅量子点 氮化硅薄膜 光致发光 Fourier 变换红外吸收     

Variation of passivation behavior induced by sputtered energetic particles and thermal annealing for ITO/SiO_x/Si system

The damage on the atomic bonding and electronic state in a SiO_x(1.4-2.3 nm)/c-Si(150 μm) interface has been investigated.This occurred in the process of depositing indium tin oxide(ITO) film onto the silicon substrate by magnetron sputtering.We observe that this damage is caused by energetic particles produced in the plasma(atoms,ions,and UV light).The passivation quality and the variation on interface states of the SiO_x/c-Si system were mainly studied by using effective minority carrier lifetime(τ_(eff)) measurement as a potential evaluation.The results showed that the samples' τ_(eff)was reduced by more than 90%after ITO formation,declined from 107 μs to 5 μs.Following vacuum annealing at 200 ℃,the τ_(eff) can be restored to 30 μs.The components of Si to O bonding states at the SiO_x/c-Si interface were analyzed by x-ray photoelectron spectroscopy(XPS) coupled with depth profiling.The amorphous phase of the SiO_x layer and the "atomistic interleaving structure" at the SiO_x/c-Si interface was observed by a transmission electron microscope(TEM).The chemical configuration of the Si-O fraction within the intermediate region is the main reason for inducing the variation of Si dangling bonds(or interface states) and effective minority carrier lifetime.After an appropriate annealing,the reduction of the Si dangling bonds between SiO_x and near the c-Si surface is helpful to improve the passivation effect.     

Luminescence from Si-Si1−xGex/Si1−yCy-Si structures

Near band edge photoluminescence has been obtained from Si_1−yC_y quantum well (QW) and neighboring Si_1−xGe_x/Si_1−yC_y double QW (DQW) structures. Enhanced no-phonon recombination is observed from the DQW structures and it is attributed to a breaking of the k-selection rule in the presence of the heterointerface. The luminescence persists for measurement temperatures up to 30–50 K and the intensity exhibits a quenching behavior with an activation energy equal to 8–20 meV. In electroluminescence only recombination in the Si_1−xGe_x layer has been observed from neighboring Si_1−xGe_x and Si_1−yC_y DQW structures.     

Formation of luminescent (NH4)2SiF6 phase from vapour etching-based porous silicon

In this paper we describe the formation of a luminescent (NH₄)₂SiF₆ via porous silicon (PS) obtained from HNO₃/HF vapour etching (VE) silicon (Si) substrates. It was found that at specific conditions, PS transforms in a luminescent thick white powder (WP) layer. Scanning electron microscopy (SEM) revealed that the WP has a coral-like structure. It was also found that PS persists as an intermediate layer between the Si substrate and the WP, and seems to be the seed that transforms into the WP. SEM microanalysis show that the WP is essentially composed of silicon (Si), nitrogen (N) and fluorine (F). Fourier transform infrared (FTIR) spectroscopy investigations show that this WP contains SiF₆²⁻ and NH₄⁺ ions and N---H chemical bonds. X-ray diffraction (XRD) patterns of the WP confirm that a (NH₄)₂SiF₆ cubic phase is concerned. SEM microanalyses show an excess of Si in the WP matrix. FTIR spectroscopy and XRD analysis reveal the presence of crystalline Si particles and SiO_x, both originating from the excess of Si. The (NH₄)₂SiF₆ WP phase emits an intense photoluminescence (PL) band, shifted towards higher energies as compared to the starting PS layer. The possible origin and mechanism of the luminescence emission was discussed taking into account the ability of small SiO_x-surrounded Si particles to emit PL at rather high energy. The wide range variation of the thickness of the (NH₄)₂SiF₆ WP may be easily used for the grooving of Si wafers.