Correlation between shapes of Shockley stacking faults and structures of basal plane dislocations in 4H-SiC epilayers

Abstract

Shockley-type stacking faults expanded in 4H–SiC epilayers induced by ultraviolet illumination were investigated using a photoluminescence imaging method, a photoluminescence mapping method and X-ray topography. After ultraviolet illumination, more than 30 patterns of Shockley-type stacking faults which expanded from perfect basal plane dislocations were observed by photoluminescence imaging. The initial basal plane dislocations were crystallographically classified, and individual shapes of expanded Shockley-type stacking faults were predicted. The correspondence between the predicted shapes and observed ones was discussed.     

Generation and evolution of partial misfit dislocations and stacking faults in thin-film heterostructures

An analysis is made of the specific features in the generation and evolution of partial misfit dislocations at the vertices of V-shaped configurations of stacking fault bands, which terminate in the bulk of the growing film at 90° partial Shockley dislocations. The critical thicknesses h _c of an epitaxial film, at which generation of such defect configurations becomes energetically favorable, are calculated. It is shown that at small misfits, the first to be generated are perfect misfit dislocations and at large misfits, partial ones, which are located at the vertices of V-shaped stacking-fault band configurations emerging onto the film surface. Possible further evolution of stacking-fault band configurations with increasing film thickness are studied.     

Investigation of stacking faults in 4H-SiC using the electron-beam-induced current method

Stacking faults in 4H-SiC crystals introduced upon plastic deformation at 550°C are studied using the electron-beam-induced current (EBIC) method. The types of stacking faults are determined by measuring the cathodoluminescence spectra. The stacking faults are shown to give a bright contrast in the EBIC mode. The nature of such contrast is discussed. The possibility of increasing the efficiency of semiconductor detectors based on structures with stacking faults equivalent to thin 3C-SiC layers is demonstrated.     

Formation of stacking faults and dislocations in phosphorus diffused silicon

Silicon samples diffused with phosphorus at 1050°C and subsequently annealed at 600°C or 700°C in vacuum or O₂ ambients were found to contain extrinsic stacking faults or misfit dislocations. We propose that silicon interstitials are generated to form the extended defects to relieve strain.     

Stacking faults and partial dislocations in graphene

We investigate two mechanisms of crystallographic slip in graphene, corresponding to glide and shuffle generalized stacking faults (GSF), and compute their γ-curves using Sandia National Laboratories Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS). We find evidence of metastable partial dislocations for the glide GSF only. The computed values of the stable and unstable stacking-fault energies are suggestive of a high stability of full dislocations against dissociation and of dislocation dipoles against annihilation.     

X-ray line profile analysis of dislocations and stacking faults in deformed copper

Dislocation configurations and stacking faults in commercial copper rods after 20% and 70% cold-rolling, fatigue and unidirectional tension here studied by x-ray line profile analysis. The analysis of dislocation is based on the Stokes method, the Warren-Averbach analysis and the Wilkens theory for Gaussian or mixed type of strain broadening profiles. For the Cauchy type the range of stress field of dislocations is small, and a model of regular distribution of dislocation dipoles is proposed instead of the Wilkens model of a restrictedly random distribution of dislocations. Due to the obvious texture in all four kinds of deformed samples, the possible glide systems are obtained by using a biaxial stress system. The analysis of stacking faults is based on theories of Patterson, Warren, and Wagner by measuring profile peak shifts, asymmetry and broadening. The broadening due to perfect dislocations and stacking faults can easily be separated. The configuration parameters and density of dislocations, the probabilities of intrinsic, extrinsic and twin stacking faults were deduced in all cases.     

TEM study on relationship between stacking faults and non-basal dislocations in Mg

Recent interest in the study of stacking faults and non-basal slip in Mg alloys is partly based on the argument that these phenomena positively influence mechanical behaviour. Inspection of the published literature, however, reveals that there is a lack of fundamental information on the mechanisms that govern the formation of stacking faults, especially I1-type stacking faults (I1 faults). Moreover, controversial and sometimes contradictory mechanisms have been proposed concerning the interactions between stacking faults and dislocations. Therefore, we describe a fundamental transmission electron microscope investigation on Mg 2.5 at. % Y (Mg–2.5Y) processed via hot isostatic pressing (HIP) and extrusion at 623 K. In the as-HIPed Mg–2.5Y, many 〈c〉 and 〈a〉 dislocations, together with some 〈c + a〉 dislocations were documented, but no stacking faults were observed. In contrast, in the as-extruded Mg–2.5Y, a relatively high density of stacking faults and some non-basal dislocations were documented. Specifically, there were three different cases for the configurations of observed stacking faults. Case (I): pure I2 faults; Case (II): mixture of I1 faults and non-basal dislocations having 〈c〉 component, together with basal 〈a〉 dislocations; Case (III): mixture of predominant I2 faults and rare I1 faults, together with jog-like dislocation configuration. By comparing the differences in extended defect configurations, we propose three distinct stacking fault formation mechanisms for each case in the context of slip activity and point defect generation during extrusion. Furthermore, we discuss the role of stacking faults on deformation mechanisms in the context of dynamic interactions between stacking faults and non-basal slip.     

N型4H-SiC同质外延生长

利用水平式低压热壁CVD (LP-HW-CVD) 生长系统,台阶控制生长和衬底旋转等优化技术,在偏晶向的4H-SiC Si(0001) 晶面衬底上进行4H-SiC同质外延生长,生长温度和压力分别为1550℃和10⁴ Pa,用高纯N₂作为n型掺杂剂的4H-SiC原位掺杂技术,生长速率控制在5μm/h左右.采用扫描电镜(SEM)、原子力显微镜(AFM),傅里叶变换红外光谱(FTIR)和Hg/4H-SiC肖特基结构对同质外延表面形貌、厚度、掺杂浓度以及均匀性进行了测试.实验结果表明,4H-SiC同质外延在表面无明显缺陷,厚度均匀性1.74%, 1.99% 和1.32%(σ/mean),掺杂浓度均匀性为3.37%,2.39%和2.01%.同种工艺条件下,样品间的厚度和掺杂浓度误差为1.54%和3.63%,有很好的工艺可靠性. 关键词： 4H-SiC 同质外延生长 水平热壁CVD 均匀性     

4H-SiC同质外延生长Grove模型研究

本文通过对4H-SiC同质外延化学反应和生长条件的分析,建立了4H-SiC同质外延生长的Grove模型,并结合实验结果进行了分析和验证.通过理论分析和实验验证,得到了外延中氢气载气流量和生长温度对4H-SiC同质外延生长速率的影响.研究表明:外延生长速率在衬底直径上为碗型分布,中心的生长速率略低于边缘的生长速率;随着载气流量的增大,生长速率由输运控制转变为反应速率控制,生长速率先增大而后逐渐降低;载气流量的增加,会使高温区会发生漂移,生长速率的理论值和实验出现一定的偏移;随着外延生长温度的升高,化学反应速率和气相转移系数都会增大,提高了外延速率;温度对外延反应速率的影响远大于对生长质量输运的影响,当温度过分升高后,外延生长会进入质量控制区;但过高的生长温度导致源气体在生长区边缘发生反应,生成固体粒子,使实际参与外延生长的粒子数减少,降低了生长速率,且固体粒子会有一定的概率落在外延层上,严重影响外延层的质量.通过调节氢气流量,衬底旋转速度和生长温度,可以有效的控制外延的生长速度和厚度的均匀性.     

4H-SiC同质外延的绿带发光与缺陷的关系

利用室温光致发光谱(PL)对CVD法生长的4H-SiC同质外延特性进行研究,发现有绿带发光(GL)特性.用扫描电子显微镜(SEM) 、二次离子质谱(SIMS)和X射线光电子谱(XPS)技术获得了4H-SiC样品纵截面形貌和元素相对含量分布.结果表明,GL与4H-SiC晶体中碳空位(V_C)及络合体缺陷相关,V_C和缓冲层的扩展缺陷(点缺陷和刃位错等)是GL微观来源.GL的半峰宽(FWHM) 反映了参与复合发光的V_C及其络合缺陷能级分散的程度.室温下获得的样品GL强度和光谱波长度可用于分析4H-SiC外延中缺陷分布和晶体质量. 关键词： 绿带发光 4H-SiC同质外延 晶体缺陷     

Investigating stacking faults in nonpolar gallium nitride films using X-ray diffraction

Nonpolar (11-20) GaN films with different basal-plane stacking fault (BSF) densities (determined using transmission electron microscopy) were investigated using X-ray diffraction. Diffuse streaking from I₁ and I₂ BSFs was observed in reciprocal space maps of the 10-10 and 20-20 reflections. X-ray calibration curves for BSF density determination can be plotted using the diffusely scattered intensity of open detector 10-10 or 20-20 ω-scans measured at a fixed, large separation from the peak maximum. However, ab initio determination of stacking fault densities is not possible due to additional broadening from other defects. Similarly, ω-scan peak widths are poor indicators of BSF densities.     

Electrical and optical characteristics of vanadium in 4H-SiC

A semi-insulating layer is obtained in n-type 4H-SiC by vanadium-ion implantation. A little higher resistivity is obtained by increasing the annealing temperature from 1450 to 1650℃. The resistivity at room temperature is as high as 7.6×10⁶\Omega .cm. Significant redistribution of vanadium is not observed even after 1650℃ annealing. Temperature-dependent resistivity and optical absorption of V-implanted samples are measured. The activation energy of vanadium acceptor level is observed to be at about E_C-1.1eV.     

4H-SiC中基面位错发光特性研究

本文利用阴极荧光(CL)和选择性刻蚀的方法对4H-SiC同质外延材料中基面位错的发光特性进行了研究. 结果表明螺型基面位错(B_TSD)和混合型基面位错(B_MD)分别具有绿光和蓝绿光特性,其发光峰分别在530 nm附近和480 nm附近. 从测试结果中还发现B_MD 的发光位较B_TSD有所蓝移,分析认为B_TSD位错芯附近原子沿伯格斯 关键词： 4H-SiC 基面位错 发光特性 禁带宽度     

Investigation of dislocations in 8circ off-axis 4H-SiC epilayer

This paper reports that the etching morphology of dislocations in 8^circ off-axis 4H-SiC epilayer is observed by using a scanning electronic microscope. It is found that different types of dislocations correspond with different densities and basal plane dislcation (BPD) array and threading edge dislocation (TED) pileup group lie along some certain crystal directions in the epilayer. It is concluded that the elastic energy of threading screw dislocations (TSDs) is highest and TEDs is lowest among these dislocations, so the density of TSDs is lower than TEDs. The BPDs can convert to TEDs but TSDs can only propagate into the epilyer in spite of the higher elastic energy than TEDs. The reason of the form of BPDs array in epilayer is that the big step along the basal plane caused by face defects blocked the upstream atoms, and TEDs pileup group is that the dislocations slide is blocked by dislocation groups in epilayer.     

Detecting electronic states at stacking faults in magnetic thin films by tunneling spectroscopy

Co islands grown on Cu(111) with a stacking fault at the interface present a conductance in the empty electronic states larger than the Co islands that follow the stacking sequence of the Cu substrate. Electrons can be more easily injected into these faulted interfaces, providing a way to enhance transmission in future spintronic devices. The electronic states associated with the stacking fault are visualized by tunneling spectroscopy, and its origin is identified by band structure calculations.     

Microdefects in lec gallium phosphide and generation of dislocations in homoepitaxial layers

Acta physica Academiae Scientiarum Hungaricae - GaP LEC substrates doped with sulphur (N D−N A≈(3−7)×1017 cm−3) were characterized by transmission electron microscopy...     

New source of stacking faults in heteroepitaxial systems

A new stacking fault formation mechanism has been observed for the first time in ZnO/LiTaO(3) heteroepitaxial films. High resolution electron microscopy studies combined with electron diffraction and numerical image computation suggest that the observed type I1 intrinsic stacking faults in an epitaxial film can be dominantly formed as a result of tilting of the lattices between films and substrate required to maintain a particular orientation relationship.