Synthesis and properties of polyimides derived from 1,4-bis(4-aminophenoxy)2,5-di-tert-butylbenzene

Novel aromatic polyimides containing symmetric, bulky di-tert-butyl substituents unit were synthesized from 1,4-bis(4-aminophenoxy)2,5-di-tert-butylbenzene (BADTB) and various aromatic tetracarboxylic dianhydrides by the conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide to give poly(amic acid)s, followed by cyclodehydration to polyimides. The diamine was prepared through the nucleophilic displacement of 2,5-di-tert-butylhydroquinone with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.83–1.88 dL g⁻¹. Most of the polyimides formed transparent, flexible, and tough films. Tensile strength and elongation at break of the BADTB-based polyimide films ranged from 68–93 MPa and 7–11%, respectively. The polyimide derived from 4,4′-hexafluoro-isopropylidenebisphathalic anhydride had better solubility than the other polyimides. These polyimides had glass transition temperatures between 242–298°C and 10% mass loss temperatures were recorded in the range of 481–520°C in nitrogen. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 1527–1534, 1997     

Hydrolytic stability and high Tg of polyimides derived from the novel 4,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]‐diamantane dianhydride

This work reports the synthesis and characterization of diamantane‐based polyimides obtained from 4,9‐bis[4(3,4‐dicarboxyphenoxy)phenyl]diamantane dianhydride and various aromatic diamines. Interestingly, the diamantane‐based polyimides were very stable to hydrolysis. This novel polyimide exhibits a low dielectric constant (2.65–2.77), low moisture absorption (<0.67%), good solubility, high T_g and unusually high thermal stability. Dynamic mechanical analysis (DMA) reveals that the diamantane‐based polyimides have high T_g ranging from 281 to 379 °C. The high‐temperature β₁ subglass transition around 285 °C was observed in polyimide 6a derived from 2,2′‐bis(trifluoromethyl)benzidine. This class of novel diamantane‐based polyimide is very promising for electronic applications, because of its good mechanical properties, good thermal stability, low dielectric constant, excellent hydrolytic resistance, and low moisture absorption. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 1673–1684, 2009     

Synthesis and Characterization of Organosoluble Polyimides Containing Pyridyl Moiety with Ether Linkages

Two novel diamine monomers, bis(4‐amino‐3,5‐dimethylphenyl)‐3‐pyridyl methane and bis(4‐aminophenoxy‐3,5‐dimethylphenyl)‐3‐pyridyl methane were synthesized. A series of pyridine containing aromatic polyimides derived from the diamines were synthesized through a typical two‐step polymerization method. Most of the polymers show good solubility in NMP, DMAc, DMF, DMSO and CHCl₃ at room temperature. These polyimides exhibit T_g in the range of 249–317°C and 10% wt loss (T₁₀) takes place in the range of 474–564°C in N₂ and 469–558°C in air. The polymers have tensile strength in the range of 88–96 MPa, elongation at break in the range of 8.5–12.5% and tensile modulus in the range of 1.5–2.1 GPa. These polyimides also have low dielectric constant (3.26–3.64 at 1 KHz and 3.24–3.61 at 10 KHz) and low moisture absorption (0.42–0.89%).     

Synthesis and characterization of fully aliphatic polyimides from an aliphatic dianhydride with piperazine spacer for enhanced solubility,transparency, and low dielectric constant

A new series of fully aliphatic polyimide (API) based on a novel aliphatic dianhydride monomer‐2,2′‐(1,4‐piperazinediyl)‐disuccinic anhydride (PDA), in which two units of succinic anhydride have been connected by an aliphatic heterocyclic piperazine spacer that possesses aminomethylene (‐NCH₂) moiety in the aliphatic/alicylic backbone capable of inducing charge transfer (CT) interactions in the polyimide network, was successfully synthesized. The APIs were soluble in common polar organic solvents. The polyimide films of PDA with alicyclic diamines were almost colorless. T₁₀ (temperature of 10% weight loss) of APIs were ranged from 299–418 °C and T_g of API3‐API6 were in the temperature range of 170 to 237 °C. The light‐colored polyimide films of API3‐API6 possessed good mechanical properties with tensile strength of 54–72 Mpa, tensile modulus of 1.6–2.3 Gpa and elongation at break of 4–9%. The polyimide films of API3‐API6 were highly flexible and free‐standing which is quite rare in fully APIs. The dielectric constant of one of the synthesized API (API4) was as low as 2.14. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 2316–2328     

Synthesis of polyimides containing triphenylamine‐substituted triazole moieties for polymer memory applications

A series of thermally stable aromatic polyimides containing triphenylamine‐substituted triazole moieties ( AZTA‐PI )s were prepared and characterized. The glass transition temperatures (T_g) of the polyimides were found to be in the range of 262–314 °C. The polyimides obtained by chemical imidization had inherent viscosities of 0.25–0.44 dL g^?1 in N‐methyl‐2‐pyrrolidinone. The number average molecular weights (M_n) and weight average molecular weights (M_w) were 1.9–3.2 × 10⁴ and 3.2–5.6 × 10⁴, respectively, and the polydispersity indices (PDI = M_w/M_n) were in the range of 1.70–1.78. A resistive switching device was constructed from the 4,4′‐hexafluoroisopropylidenediphthalic dianhydride‐based soluble polyimide ( AZTA‐PIa ) in a sandwich structure of indium‐tin oxide/polymer/Al. The as‐fabricated device can be switched from the initial low‐conductivity (OFF) state to the high‐conductivity (ON) state at a switching threshold voltage of 2.5 V under either positive or negative electrical sweep, with an ON/OFF state current ratio in the order of 10⁵ at ?1 V. The device is able to remain in the ON state even after turning off the power or under a reverse bias. The nonvolatile and nonrewritable natures of the ON state indicate that the device is a write‐once read‐many times (WORM) memory. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Highly organosoluble and flexible polyimides with color lightness and transparency based on 2,2‐bis[4‐(2‐trifluoromethyl‐4‐aminophenoxy)‐3,5‐dimethylphenyl]propane

A new diamine containing isopropylidene, methyl substituted arylene ether, and trifluoromethyl groups, 2,2‐bis[4‐(2‐trifluoromethyl‐4‐aminophenoxy)‐3,5‐dimethylphenyl]propane (BTADP), was synthesized and used in preparation of a series of polyimides by direct polycondensation with various aromatic tetracarboxylic dianhydrides in N, N‐dimethylacetamide (DMAc). All polymers derived from diamine (BTADP) with trifluoromethyl substituents were highly organosoluble in the solvents, like N‐methyl‐2‐pyrrolidinone (NMP), N,N‐dimethylacetamide, N,N‐dimethylformamide (DMF), pyridine, chloroform, tetrahydrofuran (THF), dimethyl sulfoxide (DMSO), dichloromethane, cyclohexanone, and γ‐butyrolactone at room temperature or upon heating at 70 °C. Inherent viscosities of the polyimides were found to range between 0.58 and 0.97 dL·g^?1. These polyimides had glass transition temperatures between 256 and 307 °C, and their 10% mass loss temperatures ranged from 440 to 462 °C and 421 to 443 °C under nitrogen and air, respectively. These polyimides had low dielectric constants in the range of 2.84–3.09. All the polyimides could be cast into films from DMAc solutions and were thermally converted into color lightness, optically transparent, flexible, and tough polyimides. The polyimide films had a tensile strength in the range of 83–97 MPa and a tensile modulus in the range of 2.0–2.2 GPa. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5766–5774, 2004     

Synthesis and properties of thermoplastic polyimides with ether and ketone moieties

A series of polyimides containing ether and ketone moieties were synthesized from 1,3‐bis(4‐fluorobenzoyl) benzene and several commercially available dianhydrides via a conventional two‐step polymerization. The inherent viscosities of Polyamide acids ranged from 0.46 to 0.73 dL/g. Thermal properties, mechanical properties, and thermalplasticity of the obtained polimide films were investigated by focusing on the chemical structures of their repeat units. These films were amorphous, flexible, and transparent. All films displayed low T_gs (184–225 °C) but also excellent thermal stability, the 5% weight loss temperature was up to 542 °C under nitrogen. The films showed outstanding mechanical properties with the modulus up to 3.0 GPa and the elongation at break in the range of 8–160%. The uniaxial stretching of PI‐a at high temperature was studied owing to its excellent flexibility. The PI‐a had an elongation at break up to 1600% at 245 °C and the uniaxially stretched film exhibited a much higher modulus (3.9 GPa) and strength (240 MPa) than undrawn film. The results indicated that PI‐a can potentially be used to prepare materials such as fiber, ultra‐thin film or ultra‐high modulus film. All the obtained films also demonstrated excellent thermoplasticity (drop of E′ at T_g > 10³) which made the polyimides more suitable for melt processing. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2878–2884, 2010     

Polyimide–Silica Gel Hybrids Containing Metal Salts: Preparation via the Sol–Gel Reaction

A facile preparation of polyimide–silica gel hybrids by the simultaneous in-situ formation of polyimides during the hydrolysis–condensation of tetramethoxysilane (TMOS) is reported here. The hydrolysis and condensation of TMOS was carried out in a solution of DMAc containing 5% LiCl, CaCl₂ or ZnCl₂ and the seven-membered cyclic polyimide intermediate. The seven-membered cyclic intermediates, precursors of polyimides, were derived from the low-temperature polycondensation of dianhydrides [benzophenonetetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and 4,4-bis(hexafluoroisopropylidene)phthalic dianhydride (6FDA)] and di-isocyanates [isophorone di-isocyanate (IPDI), toluene di-isocyanate (TDI), hexamethylene di-isocyanate (HDI) and 4,4′-diphenylmethane di-isocyanate (MDI)]. These intermediates could readily be converted to the corresponding polyimides. Films were cast from the resulting mixtures and the solvent was gradually evaporated at 130 °C to result in the formation of clear, transparent, pale yellow or amber-colored hybrid films in which the salts were dispersed at the molecular level. Pyrolysis of polyimide–silica gel hybrids at 600 °C gave mesoporous silica. Silica gel obtained from hybrids HPI-8 (containing no salt) and HPI-11 (containing ZnCl₂) had a pore radius (BJH method) of 2.9 nm, while that from hybrid HPI-9 (containing LiCl) had a pore radius of 11.4 nm. The surface areas (BET method) obtained were 203 m² g⁻¹, 19 m² g⁻¹ and 285 m² g⁻¹, while the pore volumes were 0.373 cm³ g⁻¹, 0.158 cm³ g⁻¹ and 0.387 cm³ g⁻¹, respectively, for samples obtained from hybrids HPI-8, HPI-9 and HPI-11. © 1997 by John Wiley & Sons, Ltd.     

Polyimide structure–property relationships. II. Polymers from isomeric diamines

An extensive study of the effects of stereoisomeric variations in aromatic polyimide structures on polyimide properties was conducted. The structural variations were incorporated into the polyimides through the use of two complete series of isomeric aromatic diamine monomers, the diaminodiphenylmethanes and the diaminobenzophenones, as well as several pairs of diamine isomers. The ability of the diamines to polymerize was related to the basicities, and thus reactivities, of the amino groups. Diamines with an amino group located ortho to the group connecting the two aromatic rings were successfully polymerized with dianhydrides for the first time to high molecular weight poly(amic acids). The stereoisomeric polyimides were characterized by determining the glass transition temperatures T_g, mechanical properties, and thermooxidative stabilities of thin films of the polymers. The polymers prepared from p-diamines were shown to have the highest softening points and thus, the most rigid molecular structures. Those synthesized from m-diamines had the lowest T_g values, inferring the most flexible molecular backbone. With limited exceptions, the use of diamines with ortho-oriented amine groups failed to improve the flexibility of the polyimides since their T_g values were usually as high as those of polymers made from p-diamines. Only slight differences in mechanical properties of the isomeric polyimide films were attributable to the variations in isomeric structure, except for those properties dependent upon T_g changes, such as elevated temperature mechanical properties. A study of the thermooxidative stability of the polyimides showed little difference between the polymers prepared from the diaminobenzophenones, but marked differences were observed between the individual members of the diaminodiphenylmethane-derived polyimides.     

Simple and easy recycling of poly(amic acid) gels through microwave irradiation

Poly(amic acid)s (PAAs), which are precursors of polyimides, often undergo gel formation during their synthesis or storage, and these insoluble gels have been discarded. In this work, we discovered that the gels could be converted to homogeneous PAA solutions by fast and simple microwave (MW) irradiation. The PAA gels were placed inside a domestic MW oven, and MW irradiation was carried out with 240 W for 2 min. The recycled PAA solutions afforded polyimide films, coatings, and powders. The polyimides prepared from the recycled PAA solutions exhibited higher glass transition temperatures (T_gs), decomposition temperatures, and char yields than comparison polyimides obtained from ordinary PAA solutions. Flexible free‐standing polyimide films were obtained by drop‐casting of the MW‐treated solutions and subsequent thermal imidization. Mechanical properties and dielectric constants were measured for the polyimide films and coatings, respectively. This new method has significant advantages for the environment, economy, and industry. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 981–987     

Synthesis and properties of polyimides derived from 1,6-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

1,6-Bis(4-aminophenoxy)naphthalene ( I ) was used as a monomer with various aromatic tetracarboxylic dianhydrides to synthesize polyimides via a conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclodehydration to polyimides. The diamine ( I ) was prepared through the nucleophilic displacement of 1,6-dihydroxynaphthal-ene with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.73–2.31 dL/g. All the poly(amic acid)s could be solution cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimide films had a tensile modulus range of 1.53–1.84 GPa, a tensile strength range of 95–126 MPa, and an elongation range at break of 9–16%. The polyimide derived from 4,4′-sulfonyldiphthalic anhydride (SDPA) had a better solubility than the other polyimides. These polyimides had glass transition temperatures between 248–286°C (DSC). Thermogravimetric analyses established that these polymers were fairly stable up to 500°C, and the 10% weight loss temperatures were recorded in the range of 549–595°C in nitrogen and 539–590°C in air atmosphere. © 1995 John Wiley & Sons, Inc.     

Synthesis and Properties of Polyamides and Polyimides Derived From Diamines Having 2-Phenyl-4,5-Oxazolediyl Units and Polyamide/Montmorillonite Composite

Aromatic polyamides were synthesized from 4,5-bis(4-aminophenyl)-2-phenyloxazole (APO) or 4,5-bis[4(4-aminophenoxy)phenyl]-2-phenyloxazole (APPO) containing 2-phenyl-4,5-oxazolediyl units with several aromatic carboxylic dichlorides by a low-temperature solution polycondensation method. The polyamides were obtained quantitatively, and their inherent viscosities ranged from 0.48 to 1.25 dL g^?1. The glass transition temperatures (T _gs) were displayed between 234 to 311°C, and the residual weight at 600°C (Res.wt₆₀₀) exceeded 52% in nitrogen atmosphere. The polyamides showed good solubility in several aprotic polar solvents, such as N,N-dimethylacetoamide (DMAc), N-methyl-2-pyrrolidone (NMP), and dimethyl sulfoxide (DMSO). Aromatic polyimides were derived from APO or APPO with aromatic carboxylic dianhydrides through polyamic acids. The inherent viscosities of the polyamic acids, which were 0.53 to 1.02 dL g^?1, T _gs of the polyimides were observed between 259 to 361°C and their Res.wts₆₀₀ were above 70%. The polyamides and polyimides were amorphous and afforded thin, flexible and tough films. We also prepared a nanocomposite of the polyamide derived from APPO with organophilic montmorillonite clay.     

Determination of glass transition temperature of polyimides from atomistic molecular dynamics simulations and machine-learning algorithms

Glass transition temperature (T_g) plays an important role in controlling the mechanical and thermal properties of a polymer. Polyimides as an important category of engineering plastics have wide applications because of their superior heat resistance and mechanical strength. The capability of predicting T_g for a polyimide a priori is therefore highly desirable in order to expedite the design and discovery of new polyimide polymers with targeted properties and applications. Here we explore three different approaches to either compute T_g for a polyimide via all-atom molecular dynamics simulations or predict T_g via a mathematical model generated by using machine-learning algorithms to analyze existing data collected from the literature. Our simulations reveal that T_g can be determined from examining the diffusion coefficient of simple gas molecules in a polyimide as a function of temperature and the results are comparable to those derived from data on polymer density versus temperature and actually closer to the available experimental data. Furthermore, the predictive model of T_g derived with machine-learning algorithms can be used to estimate T_g successfully within an uncertainty of about 20 degrees, even for polyimides yet to be synthesized experimentally.     

Structural characterization of silica modified polyimide membranes

Polyimide and hybrid polyimide‐siloxane were synthesized by polycondensation, imidization, and sol‐gel reaction. The polyimides were prepared from pyromellitic dianhydride (PMDA) and 4,4‐oxydianiline (ODA) in N‐methyl‐2‐pyrollidone (NMP). Trimethoxyvinyl silane (TMVS) was used as a source of silica. Their surface morphologies, structures and thermal performances were determined using scanning electron microscopy (SEM), infrared spectroscopy (IR), thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The results showed that the silica particles were finely and rather homogeneously dispersed in polymers. The glass transition temperature (T_g) of hybrid membrane materials increased with the increasing silica content. TGA analysis showed that polyimides were thermally stable with silica. Modified polyimide‐siloxane films, thermal characteristics were found to be better than the polyimide films without silica. Copyright © 2006 John Wiley & Sons, Ltd.     

Synthesis and properties of polyimides derived from bis-(Aminophenoxy) containing naphthalene, [Phenyl] propane and [Methyl] cyclohexane segment and 4, 4′-carbonyldiphthalic anhydride

ABSTRACT

Three wholly, semi aromatic and aliphatic-aromatic polyimides containing bis(phenoxy) naphthalene, bis[(phenoxy) phenyl] propane and bis(phenoxy-methyl) cyclohexane segments by the two-step procedure from 2, 7-bis(4-aminophenoxy) naphthalene (BAPON), 2, 2-bis[4-(4-aminophenoxy)phenyl]propane (BAPOP), 1, 4-bis (4-aminophenoxy methyl) cyclohexane (BAPMC) as a diamine and 4,4′-carbonyldiphthalic anhydride (CDPA) were prepared. The first step of this procedure including ring-opening polyaddition in a polar solvent to give poly(amic-acid)s, second step containing cyclodehydration reaction to form polyimides. Synthesized monomer and polyimides were characterized by FT-IR, ¹H NMR spectroscopy and elemental analyses (CHN) that obtained results gave the most powerful evidence. The polyimide synthesized from BAPON was characterized as semi-crystalline, whereas the other polyimides showed amorphous patterns by the x-ray diffraction studies. The inherent viscosity was ranging between 0.87–1.01 dL/g. Tensile strength, initial moduli, and elongation at break of the polyimide films ranged from 88–117 MPa, 1.98–2.32 GPa, and 5–8%, respectively. Thermogravimetric analysis in nitrogen atmosphere shows that these polymers having good stability, so 10% weight will be lost in the range of 500–630°C. The point of polyimide with BAPMC segment, is “adding of good thermal stability and processability” lower moisture absorption and dielectric constant (0.75% and 2.90).     

Poly(silarylene–siloxane)polyimides from allyl‐terminated oligoimides and hydride‐functional silarylene–siloxanes via hydrosilylation polymerization

This research was focused on the design and execution of new synthetic routes to low‐temperature‐curable poly(silarylene–siloxane)polyimides. The synthesis of individual oligoimide and silarylene–siloxane blocks was followed by hydrosilylation polymerization to produce crosslinked copolymers. The silarylene–siloxane and polyimide blocks were structurally characterized by IR and ¹H NMR spectroscopy and size exclusion chromatography. The high‐temperature resistance of the copolymers was evaluated through the measurement of heat distortion temperatures (T_HD's) via thermomechanical analysis and by the determination of the weight loss at elevated temperatures via thermogravimetric analysis. Glass‐transition temperatures (T_g's) of the silarylene–siloxane segments were measured by differential scanning calorimetry. Hydrosilylation curing was conducted at 60 °C in the presence of chloroplatinic acid (H₂PtCl₆). The copolymers displayed both high‐temperature resistance and low‐temperature flexibility. We observed T_g of the silarylene–siloxane segment as low as ?77 °C and T_HD of the polyimide segment as high as 323 °C. The influence of various oligoimide molecular weights on the properties of copolymers containing the same silarylene–siloxane was examined. The effect of various silarylene–siloxane molecular weights on the properties of copolymers containing the same oligoimide was also examined. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4922–4932, 2005     

Thermal analysis of phenylethynyl end-capped fluorinated imide oligomer afr-pepa-4

Thermal analysis of phenylethynyl end-capped imide oligomer AFR-PEPA-4 was performed to characterize cure reaction, thermal stabilities and semicrystalline behavior of AFR-PEPA-4 oligomer and its cured polyimide. Cured AFR-PEPA-4 polyimide showed high T _gs up to 418°C. Both AFR-PEPA-4 oligomer and polyimide exhibit excellent thermal stabilities comparable to PETI-5 polyimides. AFR-PEPA-4 imide oligomer has a T _m of 330°C and exhibits spherulite crystalline morphology in the film. The crystallinity in AFR-PEPA-4 films could not be regenerated under any annealing conditions after the initial melt.     

Toughening of a High-performance Bis-nadimide Thermoset by Blending with High-Glass Transition Temperature Linear Polyimides

A nadimide end-capped thermosetting oligomer was modified by blending with three homologous soluble linear polyimides containing bulky lateral fluorene groups with the intention of improving its fracture toughness. These linear polyimides were prepared by polycondensation between 4,4′-(9H-fluoren-9-yliden)-bisphenylamine (cardo structure) and three different bis-phthalic anhydride derivatives, containing between the bis-phthalic moities a secondary alcohol function, a carbonyl function or a hexafluoropropylidene group respectively. The thermoset produced upon heating a thermostable polynadimide network having a glass transition temperature (T_g) close to 300° and a critical stress intensity factor equal to 0.9 MPa.m^1/2. The T_gs of the studied linear polyimides were located above 340° in connection with the chain–chain molecular interactions. After dissolving, the precipitated blend powders with different compositions were thermally polymerized under pressure to give bulk specimens. The resulting morphologies were dependent on the chemical structure of the linear polyimide. As shown by the position of heat deflection temperatures, a well-defined two-phase blend was obtained by introducing the hexafluoropropylidene-containing polyimide, when a fully miscible system was formed with the secondary alcohol-containing polyimide. The parallel increase in fracture toughness seemed to be controlled by the degree of phase separation between the blend components. The greater improvement resulted from the partially fluorinated polyimide: the corresponding K_IC reaching 1.23 MPa.m^1/2 with 20 wt% of linear component. Finally, the toughening effect due to the latter polymer was examined in relation to its average molecular weight. Almost no change was observed if the corresponding inherent viscosity in N-methyl pyrrolidone solution was above 0.2 dl/g. In any case, owing to the high T_g of the linear component, the thermomechanical stability of the blend was maintained at the same level as that of the initial polynadimide network. © 1997 John Wiley & Sons, Ltd.     

Synthesis and characterization of spirobifluorene‐based polyimides

The synthesis and properties of organosoluble aromatic polyimides, containing spiro‐skeletal units in the polymer backbone on the basis of the spiro‐diamine monomer, 2,2′‐diamino‐9,9′‐spirobifluorene, are described. In the case of the spiro segment, the two fluorene rings are orthogonally arranged and connected through a tetrahedral bonding carbon atom, the spiro center. As a consequence, the polymer chain is periodically zigzagged with a 90° angle at each spiro center. This structural feature minimizes interchain interactions and restricts the close packing of the polymer chains, resulting in amorphous polyimides that have good solubility in organic solvents. Compared with their fluorene‐based cardo analogues, the spirobifluorene‐based polyimides have an improved solubility. Furthermore, the main‐chain rigidity of the polyimide appears to be preserved because of the presence of the spiro structure, which restricts the free segmental mobility. As a result, these polyimides exhibit a high glass‐transition temperature (T_g's) and good thermal stability. The T_g's of these polyimides were in the range of 287–374 °C, and the decomposition temperatures in nitrogen for a 10% weight loss occurred at temperatures above 570 °C. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 3615–3621, 2002     

Preparation and properties of novel soluble aromatic polyimides from 4,4′-diaminotriphenylamine and aromatic tetracarboxylic dianhydrides

New aromatic polyimides containing triphenylamine unit were prepared by two different methods, i.e., a conventional two-step method starting from 4,4′-diaminotriphenylamine and aromatic tetracarboxylic dianhydrides and the one-step thioanhydride method starting from the aromatic diamine and aromatic tetracarboxylic dithioanhydrides. Both procedures yielded high-molecular-weight polyimides with inherent viscosities of 0.47–1.17 dL/g. Some of these polymers were soluble in organic solvents such as N,N-dimethylacetamide, N-methyl-2-pyrrolidone, m-cresol, and pyridine. All the polyimides afforded transparent, flexible, and tough films, and the color varied from pale yellow to dark red, depending markedly on the tetracarboxylic acid components. The glass transition temperatures (T_gs) of these polyimides were in the range of 287–331°C and the 10% weight loss temperatures were above 520°C in air. The polyimides prepared by the one-step method exhibited better solubility in organic solvents and had somewhat lower T_gs than the polymers prepared by a conventional two-step method.