Preparation of polyimide/BaTiO3/Ag nanocomposite films via in situ technique and study of their dielectric behavior

Triphase polyimide nanocomposite films were fabricated using barium titanate （BaTiO3） with high dielectric constant and silver （Ag） with high conductivity as fillers. In situ method was utilized to obtain the homogeneous dispersion of nanoparticles. The in situ polymerization of polyimide precursor-poly（amic acid） was performed in the presence of BaTiO3 particles. Silver compound 1,1,1-trifluoro-2,4-pentadionato silver（I） was added into the BaTiO3 containing poly（amic acid） solution to achieve silver nanoparticles via in situ self metallization technique. The thermally induced reduction converted silver （I） to metallic silver with concomitant imidization of poly（amic acid） to polyimide. Both BaTiO3 and silver nanoparticles were uniformly dispersed in the polyimide substrate. The dependence of dielectric behavior on the BaTiO3 and Ag contents was studied. The incorporation of small amount of silver nanoparticles greatly increased dielectric constant of composite films.     

One-step fabrication of ultralow dielectric polyimide films consisting of size-controlled mesoporous nanoparticles

Dielectric materials with ultralow dielectric constants (<2.0) are desiderated in the integrated circuits (ICs). In this work, we fabricated polyimide (PI) films consisting of mesoporous nanoparticles (MPNPs-PF) through a one-step solvent evaporation induced self-assembly method. Poly(amic acid) was selected as the polymer matrix; and the commercial triblock copolymer F127 was adopted as the mesoporous template as well as the nanoparticle morphology controller, respectively. After imidization and template removal, the dense films consisting of closed-packed PI nanoparticles with an average diameter less than 50 nm were obtained. Since the nanoparticles were fully composed of worm-like mesopores, the dielectric constant (k value) of the resultant porous PI films can reach as low as 1.92. When the reactive end-capper of maleic anhydride (MA) was blended into poly(amic acid), k value decreased even lower to 1.86. Meanwhile, the modulus of the resultant porous PI films was higher than 1 GPa.     

Preparation and dielectric properties of polyimide/silica nanocomposite films prepared from sol–gel and blending process

Using poly(amic acid) (PAA) as a precursor followed by thermal imidization, the polyimide/silica nanocomposite films were prepared via an improved sol–gel process and a blending process, respectively. FT‐IR, TEM and TGA measurements were used to characterize the structure and properties of the obtained films. The results confirmed that the introduction of silica did not yield negative effects on the conversion of the PAA precursor to the polyimide. With the increase of silica content, the aggregation of silica appeared in the polyimide matrix, and the thermal stability decreased slightly for both kinds of films. The dielectric constant (ε) of both films increased slowly with the increase of the silica concentration. The dielectric constant of the obtained polyimide/silica nanocomposite films displayed good stability within a wide range of temperatures or frequency. Based on modeling relation between ε and silica content, the difference in dielectric properties for two kinds of nanocomposites are discussed. Copyright © 2007 John Wiley & Sons, Ltd.     

In situ sol–gel fabrication of new poly(amide–ether–imide)/titania (TiO<Subscript>2</Subscript>) nanocomposite thin films containing <Emphasis Type="SmallCaps">l</Emphasis>-leucine moieties

In this study, the synthesis, morphology, and thermal properties of amino acid containing polyimide/titania nanohybrid films are investigated. At first, a chiral diamine containing l-leucine moieties in the structure (synthesized previously) was polymerized with 4,4′-oxydiphthalic anhydride in extremely dry conditions. Resulted poly(amic acid) (PAA) was mixed with a moisture-sensitive titania precursor (tetraethyl orthotitanate [Ti(OEt)₄]) and casted to a dust-free glass plate. The water derived from thermal imidization of PAA hydrolyzed Ti(OEt)₄ to titania nanoparticles with almost spherical shapes. The thermogravimetric analysis of various nanocomposites confirms the improvement in the thermal stability with the increase in the percentage of titania nanoparticle. The transmission electron microscopy of nanohybrid films with 3%, 5%, and 10% w/w of titania contents confirms well dispersion of nanoparticles in the polymer ground. The X-ray diffraction spectra showed that the titania contents have amorphous structure.     

Preparation, structure and properties of porous polyimide films via PAA/PU alloy

A new route to porous polyimide (PI) films with pore sizes in the nanometer regime was developed. A polyamic acid (PAA)/polyurethane (PU) blend with PU as the disperse phase was first prepared via in situ polymerization of pyromellitic dianhydride and 4,4-oxydianiline in PU solutions. Porous PI films were obtained from PAA/PU films by thermolysis of PU at 360°C and imidization of PAA at 300°C, respectively. Fourier transform infrared spectroscopy and thermal gravimetric analysis were used to detect the imidization and thermolysis processes of PAA/PU blends under thermal treatment. The microporous structure of the PI films was observed by transmission electron microscopy. It was found that the size and content of pores increased with an increase in the PU mass fraction in the PAA/PU blend up to 20%. Because of the existence of nanopores, the dielectric constant of PI films decreased by a wide margin and was less than 2.0 at a PU mass fraction of 20%. It implies that this is an effective means to reduce the dielectric constant of PI, but it also causes the decrease of tensile strength and the rise of water absorption. Translated from Chemistry Journal of Chinese Universities 2006, 27(1): (in Chinese)     

Spontaneous molecular orientation of polyimides induced by thermal imidization (4): Casting- and melt-induced in-plane orientation

Driving forces of in-plane chain orientation of polyimides (PIs) and their precursors were discussed and the mechanisms were proposed. A polyimide precursor, poly(amic acid) (PAA) derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with p-phenylenediamine (PDA) showed a certain degree of in-plane orientation in its solution-casting process and clear molecular weight dependence. The results allowed us to propose the casting-induced in-plane orientation mechanism of the rigid PAA chains. The imidization-induced in-plane orientation mechanism was also discussed by investigating how residual solvent content influences the degree of in-plane orientation of resultant PI films. The results suggested that the magnitudes of the PI chain in-plane orientation are dominated by a combined effect of the initial PAA orientation, apparent stretching based on a great thickness decrease, and the molecular mobility during thermal imidization. In a system derived from s-BPDA with 2,2′-bis(trifluoromethyl)benzidine (TFMB), the effect of molecular mobility during thermal imidization was predominant when cured under usual thermal conditions owing to the presence of the trifluoromethyl groups contributing to weakened intermolecular interaction. In s-BPDA/TFMB and s-BPDA/m-TOL systems (m-TOL = m-tolidine), a melt-induced in-plane orientation phenomenon was observed at temperatures corresponding to their T_g’s when the extents of in-plane chain orientation (f values) were monitored as a function of temperature in the stepwise heating process. This behavior is very curious because there are no appreciable dimensional, morphological, and structural changes as some driving forces just above the T_g of s-BPDA/TFMB.     

A study of the curing behavior of polyamic acid coated on a Cu or Zn layer

ZnO and Cu₂O nanoparticles can be formed through the thermal decomposition of the complex between Zn or Cu with polyamic acid (PAA), accompanying with the formation of polyimide (PI). Transmission electron microscopy (TEM) analysis showed that the formation of ZnO nanoparticles needs a longer curing time than that of Cu₂O. Fourier transform infrared spectroscopy (FT-IR) characterization shows that both Zn and Cu will delay the imidization process of PAA. However, the retarding degree of imidization process is higher for Zn than that of Cu. Further investigation showed the structure of Zn–PAA complex is different from that of Cu–PAA, which is the reason for the difference of initial imidization temperature. Thermogravimetric and differential thermal analysis (TG–DTA) characterization agrees well with the results of FT-IR. Also, the thermal decomposition temperature of the polyimide was changed by the involvement of Zn or Cu during curing.     

Preparation of core‐shell polystyrene‐polyimide particles by dispersion polymerization of styrene using poly(amic acid) as a stabilizer

Dispersion polymerization of styrene (S) and vinylbenzyltrimethylammonium chloride (VBA) was conducted in an ethanol‐water medium using an aromatic poly(amic acid) (PAA) as the stabilizer. When equimolar amounts of VBA and the carboxylic acid of PAA were used, monodisperse particles with high PAA content were obtained quantitatively. The imidization of PAA on the particles proceeded with acetic anhydride and N,N‐dimethylaminopyridine to form core‐shell PS‐polyimide particles.     

Poly(ether‐imide) and related sepiolite nanocomposites: investigation of physical,thermal, and mechanical properties

Novel poly(ether‐imide) and sepiolite nanocomposites were synthesized based on a unique diamine monomer with the aim of improving physical and mechanical properties of final polyimide films. The diamine was polycondensed with 4,4′‐(hexafluoroisopropylidene) diphthalic anhydride to produce related poly(ether amic acid) prepolymer. Pure poly(ether‐imide) and nanocomposite films were prepared via thermal imidization process of poly(ether amic acid). Coexistence of ether, pyridine, and phenylene functional groups in the diamine chemical structure resulted in flexible polyimide films with significant thermal, physical, and mechanical properties. Thermal stability, glass‐transition temperature, dimensional stability, and tensile properties of polymer and nanocomposites were studied and compared. Morphology of nanocomposites was also investigated using scanning and transmission electron microscopic methods to study the distribution and dispersion behavior of sepiolite nanofibers in the polyimide matrix. By introduction of sepiolite nanoparticles, overall improvement of properties was observed in respect to pure polyimides. Copyright © 2015 John Wiley & Sons, Ltd.     

Thermal imidization of poly(pyromellitic dianhydride-4,4′-oxydianiline) precursors on fluoropolymers modified by surface graft-copolymerization with glycidyl methacrylate

Composite films of polyimide (PI) and poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) or of PI and poly(tetrafluoroethylene) (PTFE) were prepared by thermal imidization of the poly(amic acid) (PAA) precursors of poly(pyromellitic dianhydride-4,4′-oxydianiline) (PMPA-ODA) on glycidyl methacrylate (GMA) graft-copolymerized FEP and PTFE films. The resulting PI/GMA-g-FEP and PI/GMA-g-PTFE composites exhibited T-peel adhesion strength of approximately 7.0 and 6.5 N/cm, respectively, compared to negligible adhesion strength for the laminates prepared from thermal imidization of the PAA on the pristine and the Ar plasma-treated FEP and PTFE films. X-ray photoelectron spectroscopy (XPS) results revealed that both the PI/GMA-g-FEP and PI/FEP-g-PTFE composite films delaminated by cohesive failure inside the FEP and PTFE films, respectively. The so-delaminated PI films with a covalently tethered FEP or PTFE surface layer were highly hydrophobic, having static water contact angles above 140°. The highly hydrophobic property depends on both the composition and roughness of the delaminated surface.     

Preparation of nonwoven polyimide/silica hybrid nanofiberous fabrics by combining electrospinning and controlled in situ sol-gel techniques

A controlled in situ sol-gel synthesis combined with the electrospinning technique and postspun imidization was applied in the fabrication of polyimide/silica hybrid nonwoven nanofiberous fabrics with excellent thermal and mechanical performance. The nanofiberous fabrics were prepared by electrospinning of the solution of tetraethoxysilane (TEOS) and polyamic acid (PAA). The different silica contents in the fabrics were achieved by varying the amount of TEOS while fitting the solid content of PAA. The final polyimide/silica fabrics was obtained after imidization of PAA and gelation of silica phase simultaneously accomplished through a step-wise heating process. Some specific IR techniques and other characterizations indicated the successful incorporation of the silicon dioxide (SiO₂) into the PI matrix and the relatively even distribution of the SiO₂ in the fabrics. An increase of 133 °C in the decomposition temperature and 4-fold enhancement of the ultimate tensile strength were achieved for the hybrids with a 6.58 wt.% of SiO₂ content, compared to the pure PI fabric. The excellent performance could be attributed to the good compatibility between the polyimide and silica, and good adhesion among the fibers, which resulted from the controlled TEOS hydrolysis and the simultaneous imidization and gelation process.     

Microstructure and properties of polyamideimide/silica hybrids compatibilized with 3-aminopropyltriethoxysilane

In this work, we prepared and characterized polyamideimide (PAI)/silica hybrids compatibilized with 3-aminopropyltriethoxysilane (APTES). PAI/silica nanohybrid thin films were prepared using an in situ sol-gel process, followed by thermal imidization. We have investigated the microstructures and properties of the PAI/silica hybrids using FT-IR spectroscopy, X-ray diffraction, small-angle X-ray scattering (SAXS), and differential scanning calorimetry (DSC). We also measured their tensile properties, thermal properties, refractive indices, and dielectric constants. In general, the properties of the PAI/silica hybrids were optimized when the silica content was 6 wt.%.     

Spontaneous molecular orientation of polyimides induced by thermal imidization (5). Effect of ordered structure formation in polyimide precursors on CTE

Six poly(amic acid) (PAA) systems based on pyromellitic dianhydride (PMDA) formed some ordered structures with optical anisotropies clearly detectable on an optical polarizing microscope (POM) in N-methyl-2-pyrrolidone (NMP) at room temperature at high solute concentrations (15-25 wt.%) with complete sol-gel transition reversibility, whereas PAA systems based on 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with a variety of diamine components showed no optical anisotropy in solution. However, a fluorescence probe technique combined with solution viscosity measurements suggested that a PAA derived s-BPDA with 1,4-phenylenediamine (PDA), i.e., PAA(s-BPDA/PDA) forms some ordered structure with a POM-undetectable very local scale during prolonged storage in NMP at room temperature. The introduction of the biphenyldiimide (BPDI) units at 33% into the PAA(s-BPDA/PDA) main chains by copolymerization allowed the formation of optically anisotropic gels with a smectic liquid crystal-like ordered structure by cooling the NMP solution at −20 °C. PI films derived from s-BPDA with PDA, i.e., PI(s-BPDA/PDA) were prepared upon thermal imidization of the BPDI-containing PAA films dried at 40 °C for 2.5 h. An increase in the BPDI content caused a gradual decrease in the linear coefficient of thermal expansion (CTE) of the PI films. This can be interpreted as a result of an intensified pre-orientation at the stage of the PAA cast films by incorporation of the BPDI units. When the BPDI-containing PAA solutions were heated at 70 °C for 4 min prior to the drying process at 40 °C, the ordered structures can be cancelled without imidization, and the CTE values of the resulting PI films appreciably increased compared to the case without heating at 70 °C. A similar effect was observed even in the BPDI-free original s-BPDA/PDA system. The results suggest the presence of a POM-undetectable very locally ordered structure in the PAA cast films, which promotes the pre-orientation of the PAA chains in the cast films and consequently can contribute to a further decrease in the CTE of the PI(s-BPDA/PDA) films.     

PAA/PU合金制备多孔PI薄膜及结构与性能研究

以N,N-二甲基乙酰胺(DMAc)为溶剂, 在聚氨酯(PU)溶液中使均苯四酸二酐(PMDA)与4,4′-二氨基二苯醚(4,4′-ODA)缩聚成聚酰亚胺(PI)预聚体聚酰胺酸(PAA), 从而制成PAA/PU的混合溶液, 然后刮涂成膜, 经过热处理使得PAA亚胺化和PU降解, 制备多孔PI薄膜. 通过对薄膜进行红外光谱,热失重分析及透射电镜(TEM)观察, 结果表明, 最佳的PU热降解温度为360 ℃, PU降解后在PI基体中留下长条状纳米孔, 且孔径大小随聚氨酯含量的增加而增大. 通过对薄膜进行力学性能、 介电性能和吸水率研究, 结果表明, 随着体系中PU用量的增加, 热处理后的多孔PI薄膜的介电常数逐渐下降, 但拉伸强度降低, 吸水率上升.     

Partly Imidized Polyamic Acid and Its UniaxialStretched Polyimide Films

Partly imidized polyamic acid(PAA) has been used to prepare high performance polyimide films. The behaviors of two polyamic acids derived from pyromellitic dianhydride(PMDA)/4,4′-oxydianiline(ODA) and 3,3′,4,4′-biphenyltetracarboxylic diahhydride(BPDA)/paraphenylenediamine(PPD) containing dehydrating agents composed of acetic anhydride and a tertiary amine as the catalyst were investigated. The gel point was dependent on imidization degree in despite of temperature and the molar ratio of catalyst to acetic acid. Imdization content was about 35% for PMDA/ODA and about 22% for BPDA/PPD. The effect of catalyst on imidization possessed an order of triethylamine>3-methylpyridine>pyridine>isoquinoline>2-methylpyridine. The stretching of the films greatly reduced the coefficient of linear thermal expansion(CTE) either in the longitudinal direction or transversal direction. Compared to the film from polyamic acid, the partly imidized film had greater stretching ratio, so that the uniaxial stretched polyimide film from partly imidized PAA had higher tensile strength and tensile modulus, but lower elongation in the stretching direction.     

Preparation of porous polyimide/in‐situ reduced graphene oxide composite films for electromagnetic interference shielding

Herein we report an easy and efficient approach to prepare lightweight porous polyimide (PI)/reduced graphene oxide (RGO) composite films. First, porous poly (amic acid) (PAA)/graphene oxide (GO) composite films were prepared via non‐solvent induced phase separation (NIPS) process. Afterwards PAA was converted into PI through thermal imidization and simultaneously GO dispersed in PAA matrix was in situ thermally reduced to RGO. The GO undergoing the same thermal treatment process as thermal imidization was characterized with thermogravimetric analysis, Raman spectra, X‐ray photoelectron spectroscopy and X‐ray diffraction to demonstrate that GO was in situ reduced during thermal imidization process. The resultant porous PI/RGO composite film (500‐µm thickness), which was prepared from pristine PAA/GO composite with 8 wt% GO, exhibited effective electrical conductivity of 0.015 S m^?1 and excellent specific shielding efficiency value of 693 dB cm² g^?1. In addition, the thermal stability of the porous PI/RGO composite films was also dramatically enhanced. Compared with that of porous PI film, the 5% weight loss temperature of the composite film mentioned above was improved from 525°C to 538°C. Moreover, tensile test showed that the composite film mentioned above possessed a tensile strength of 6.97 MPa and Young's modulus of 545 MPa, respectively. Copyright © 2016 John Wiley & Sons, Ltd.     

Structure and infrared emissivity of silicon-containing polyimide/BaTiO3 nanocomposite films

Silicon-containing polyimide/BaTiO₃ nanocomposite films were prepared by the direct mixing of silicon-containing polyamic acid and BaTiO₃ nanoparticles under ultrasonic wave irradiation, followed with thermal imidization. Structure and thermal properties were measured with FTIR, XPS, SEM, DSC and TGA. The results showed that the compatibility of BaTiO₃ and a polyimide might be improved by the introduction of dimethylsilylene groups into the backbone of a polyimide; and BaTiO₃ nanoparticles in the nanocomposites tended to form clusters. The clusters coalesced into a more uniform structure at a higher BaTiO₃ filling than at a lower one.The interfacial interaction between BaTiO₃ and the silicon-containing polyimide resulted in the increase of the glass transition and the thermal decomposition temperature. It was found that the nanocomposites exhibited lower infrared emissivity value than the pure polyimide and the magnitude of infrared emissivity value was related to the content of BaTiO₃ in the nanocomposites.     

Thermal and optical properties of silver-poly(methylmethacrylate) nanocomposites prepared by in-situ radical polymerization

Surface modified silver nanoparticles dispersed in chloroform were encapsulated in poly(methylmethacrylate) (PMMA) by in-situ radical polymerization of methyl methacrylate initiated by 2,2′-azobisisobutyronitrile. The particle size distribution of colloidal silver nanoparticles was determined using transmission electron microscopy. The obtained transparent nanocomposite films were characterized using UV-vis spectroscopy, ¹H NMR spectroscopy and gel permeation chromatography. Effective medium Maxwell-Garnett theory was used in order to explain optical properties of nanocomposite films taking into account inhomogeneous spatial distribution of silver nanoparticles in PMMA matrix. The influence of the silver nanoparticles on the thermal properties of the PMMA matrix was investigated using thermo-gravimetric analysis and differential scanning calorimetry. Thermo-oxidative stability of the PMMA in the presence of low content of inorganic phase is significantly improved. The glass transition temperatures of nanocomposites are slightly lower compared to the pure polymer.     

Synthesis of Polyimide Nanocomposites

A series of polyimide nanocomposite (PINC) films were prepared by using poly(amic acid) and Ba, Sr, Sn, TiO₃ nanoparticles via in-situ polymerization method. Poly(amic acid) was synthesized from benzophenone tetracarboxylic anhydride and diamino diphenyl ether by ring-opening polyaddition reaction. The PINC films were characterized by FTIR spectroscopy. The thermal properties of PINC films were investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TG) methods. The prepared PINC showed major weight loss in the range of 550–600°C in nitrogen atmosphere. These had char yield in the range of 50–60% at 800°C. The morphological studies of PINC films were carried out using SEM method.     

Synthesis and properties of polyimide/silver nanocomposite containing dibenzalacetone moiety in the main chain

A new thermally stable polyimide–silver nanocomposite containing dibenzalacetone moiety in the main chain was synthesized by a convenient ultraviolet irradiation technique. A precursor such as AgNO₃ was used as the source of the silver nanoparticles. Polyimide 6 as a source of polymer was prepared by polycondensation reaction of 2,5-bis(4-aminobenzylidene) cyclopentanone 4 with pyromellitic anhydride 5 in m-cresol solution and in the presence of iso-quinoline as a base. The resulting nanocomposite film was characterized by FTIR spectroscopy, X-ray diffraction (XRD), Scanning electron microscopy (SEM), Thermal gravimetric analyses (TGA), differential gravimetric analyses (DTG) and differential scanning calorimetry (DSC). Scanning electron microscopy (SEM) confirmed the formation and dispersion of silver nanoparticles in polymer matrix having average size of ～20 nm. Incorporation of inorganic metal silver nanoparticles has improved the thermal behavior of the nanocomposite film as compared to pure polyimide film. Also 2,5-bis(4-aminobenzylidene) cyclopentanone 4 was synthesized by using a two-step reaction.