Si衬底GaN基蓝光LED钝化增透膜研究

在Si衬底GaN基蓝光LED芯片上生长了一层SiON钝化膜,使器件的光输出功率提高12%且有效降低了器件在老化过程中的光衰。对有、无钝化膜的样品进行性能比较,结果表明SiON钝化膜能有效隔离环氧树脂与高温芯片,缓解环氧树脂的老化变黄;又能部分弛豫环氧树脂对芯片的张应力,降低非辐射复合中心产生的几率;有效减小器件的侧壁漏电通道,降低器件的光衰和漏电流,提高器件的可靠性。     

锂铁氧体纳米晶磁性的研究

研究了颗粒平均直径由9.1—860nm范围的锂铁氧体纳米晶的磁性.它们的比饱和磁化强度σ_s随其颗粒尺寸减小而线性减小.测量了样品A(颗粒直径为D=860nm),样品B(D=11.8nm)和样品C(D=9.1nm)的比饱和磁化强度随温度的变化曲线σ(T)和穆斯堡尔谱.发现样品B和C的居里温度比样品A的低50℃.从样品C的σ(T)曲线看,样品C好像由二种磁相所构成.利用超顺磁和表面磁性讨论了样品C的特异磁性. 关键词：     

两种聚醚改性有机硅表面活性剂的NMR数据分析

运用液体核磁共振(NMR)技术(包括~1H NMR、DEPT135、~(13)C qNMR、~1H-~1H COSY、~1H-~(13)C HSQC、~1H-~(13)C HMBC、~(29)Si qNMR和~1H-~(29)Si HMBC)对两种有机硅表面活性剂进行了化学结构表征,对所得波谱数据进行了较为全面的指认.结果表明一维~1H NMR、~(13)C NMR和~(29)Si NMR,与二维NMR方法结合使用可以准确区分这两种有机硅表面活性剂的结构:样品A和样品B均为聚乙二醇改性的聚二甲基硅氧烷有机硅表面活性剂;A具有线型ABA结构,平均分子量约为1 967;B具有梳型BAB结构,平均分子量约为7 191.     

SiN钝化膜对Si衬底GaN基蓝光LED性能影响

利用等离子辅助化学气相沉积(PECVD)系统在垂直结构Si衬底GaN基蓝光LED芯片上生长了SiN钝化膜,并对长有钝化膜及未作钝化处理的LED在不同条件下进行了老化实验,首次研究了SiN钝化膜对垂直结构Si衬底GaN基蓝光LED可靠性的影响。实验发现:经过30mA、85℃、24h条件老化后,未作钝化处理的Si衬底GaN基蓝光LED的平均光衰为11.41%,而长有SiN钝化膜的LED平均光衰为6.06%,SiN钝化膜有效地改善了LED在各种老化条件下的光衰,另外,SiN钝化膜缓解了Si衬底GaN基蓝光LED老化过程中反向电压(Vr)的下降,但对老化后LED的抗静电击穿能力(ESD)没有明显的影响。     

Si(111)7×7清洁表面的总电流谱

用自制的总电流谱仪对Si(111)7×7清洁表面进行了测量,得到A,B,C,D四个谱峰的能量位置分别在真空能级以上2.6,5.2,8.6和12.9eV。样品饱和吸氢后表面峰A消先。用带间跃迁模型对实验结果作了初步分析。 关键词：     

Si(001)表面硅氧团簇原子与电子结构的第一性原理研究

在周期性边界条件下的k空间中,采用基于密度泛函理论的第一性原理广义梯度近似方法,对建立的规则对称型结构（A）、周期性非对称型结构（B）、周期性非对称型结构（C）、不规则型结构（D）四种可能的Si（001）表面硅氧团簇的结构模型进行了优化计算.结果表明优化后的表面结构呈无定形状,并且优化后的B,C,D三种模型的表面结构具有类似SiO₂的四面体结构的几何特征.此外,通过电子局域函数图以及Mulliken布居分析发现硅氧团簇中的Si—O键既有明显的离子键成分,也有一定的共价键成分. 关键词： Si（001）表面 硅氧团簇 密度泛函理论 第一性原理     

物理奥林匹克竞赛实验专题

第 1期试题解答1 )如图 1所示 ,将第 3根火柴杆 C用橡皮泥固定在 BA的沿长连线上 ,距 A一定距离(比如 1 0 cm左右 .注意 :A和 B都不可接触 ) .眼睛在 AB延长线上应看不到 C.图 1　火柴杆 C的放置2 )如图 2所示 ,在 A,C之间放置小反射镜M,人眼来回晃动 ,观察镜中 A的虚像 A′,同时调整小镜位置 ,使 A′最终与 C重合 (视差法 ) ,这时用橡皮泥将小镜固定 .图 2　小平面镜 M的调整3 )如图 3所示 ,调整第 4根火柴杆 D在镜后的位置 ,并注意观察 B在镜中的虚像 B′,直至第 4根火柴杆 D与 B′重合无视差 ,固定 D.图 3　火柴杆 D的调整4)测…     

铁钝化多孔硅的制备及光致发光机理研究

采用水热腐蚀法在相同环境下制备了不同晶型的铁钝化多孔硅样品。同一样品表面具有相似的孔隙结构,不同样品形貌存在差异。在300 nm光激发下,样品发光峰位于618 nm附近,半高宽约为132 nm。傅立叶红外变换光谱显示样品中有强的Si—Si、Si—O—Si、O y—Si—H x化学键振动吸收。结果表明,水热腐蚀法制备的铁钝化多孔硅表面形貌与腐蚀过程的局域电极分布关系密切。样品的光致发光行为可归因于量子限制-发光中心作用,并受非桥氧空穴发光中心数量影响。     

微量元素和烧结温度对硅基半导体中微观缺陷的影响

测量了不同C或B含量经不同烧结温度制备的Si基半导体、单晶Si、单晶SiO2、石墨和纯多晶B样品的正电子寿命谱和符合正电子湮没辐射Doppler展宽谱。结果表明,石墨的商谱谱峰最高,SiO2的谱峰次之,B的谱峰最低。随着B,C和O原子序数的增加,与正电子湮没的电子动量增加。含20%的C和含100ppm的B的样品的商谱的谱峰最高;含100ppm的B的样品的谱峰次之;含1ppm的B的样品的谱峰最低。随着烧结温度的升高,含100ppm的B的Si基半导体样品的商谱降低,正电子寿命增长,缺陷开空间和浓度升高。     

不同条件制备的ZnO纳米梳结构及其性能研究

采用热蒸发法通过改变衬底放置条件在Si(111)衬底上制备出了ZnO纳米梳结构.利用X射线衍射(XRD)、扫描电子显微镜(SEM)、分光光度计、场发射装置对样品的结构、形貌、光致发光光谱及场发射特性进行了分析.XRD结果表明衬底水平放置(A)和衬底竖直放置(B)制备出的样品均属于多晶六角纤锌矿结构.SEM结果表明两种衬底放置条件下的样品均为纳米梳状结构,改变衬底放置条件ZnO纳米梳的尺寸和形貌有明显改变,其中竖直放置衬底的样品B纳米尺寸较小且比较均匀.室温下的光致发光光谱表明样品B的紫外峰较样品A出现了蓝移,此外样品B的紫外峰强和可见光峰强比值较大,说明此样品的结晶质量较好.场发射特性测试结果表明两个样品的场发射都是通过电子隧道效应进行的,且样品B的场发射性能优于样品A.     

Si(110)和Si(111)衬底上制备InGaN/GaN蓝光发光二极管

分别在Si(110)和Si(111)衬底上制备了In Ga N/Ga N多量子阱结构蓝光发光二极管(LED)器件.利用高分辨X射线衍射、原子力显微镜、室温拉曼光谱和变温光致发光谱对生长的LED结构进行了结构表征.结果表明,相对于Si(111)上生长LED样品,Si(110)上生长的LED结构晶体质量较好,样品中存在较小的张应力,具有较高的内量子效率.对制备的LED芯片进行光电特性分析测试表明,两种衬底上制备的LED芯片等效串联电阻相差不大,在大电流注入下内量子效率下降较小;但是,相比于Si(111)上制备LED芯片,Si(110)上LED芯片具有较小的开启电压和更优异的发光特性.对LED器件电致发光(EL)发光峰随驱动电流的变化研究发现,由于Si(110)衬底上LED结构中阱层和垒层存在较小的应力/应变而在器件中产生较弱的量子限制斯塔克效应,致使Si(110)上LED芯片EL发光峰随驱动电流的蓝移量更小.     

Progress in research of GaN-based LEDs fabricated on SiC substrate

The influence of buffer layer growth conditions on the crystal quality and residual stress of GaN film grown on silicon carbide substrate is investigated.It is found that the Al GaN nucleation layer with high growth temperature can efficiently decrease the dislocation density and stress of the GaN film compared with Al N buffer layer.To increase the light extraction efficiency of GaN-based LEDs on Si C substrate,flip-chip structure and thin film flip-chip structure were designed and optimized.The fabricated blue LED had a maximum wall-plug efficiency of 72% at 80 m A.At 350 m A,the output power,the Vf,the dominant wavelength,and the wall-plug efficiency of the blue LED were 644 m W,2.95 V,460 nm,and 63%,respectively.     

Initial growth process and surface structure of Ag on Si(111) studied by low-energy Ion-Scattering Spectroscopy (ISS) and LEED-AES

The growth process of silver on a Si(111) substrate has been studied in detail by low-energy ion-scattering spectroscopy (ISS) combined with LEED-AES. Neon ions of 500 eV were used as probe ions of ISS. The ISS experiments have revealed that the growth at room temperature and at high temperature are quite different from each other even in the submonolayer coverage range. The following growth models have been proposed for the respective temperatures. At room temperature, the deposited Ag forms a two-dimensional (2D) island at around 2/3 monolayer (ML) coverage, where the Ag atoms are packed commensurately with the Si(111)1 substrate. One third of the substrate Si surface remains uncovered there. Then it starts to develop into Ag crystal, and at a few ML coverage a 3D island of bulk Ag crystal grows directly on the substrate. An intermediate layer, which covers uniformly the whole surface before the growth of Ag crystal, does not exist. At high temperatures (>~200°C), the well-known Si(111)√3-Ag layer is formed as an intermediate layer, which consists of 2/3 ML of Ag atoms and covers the whole surface uniformly. These Ag atoms are embedded in the first double layer of the Si substrate. It is concluded that the formation of the √3 structure needs relatively high activation energy which may originate from the large displacement of Si atoms owing to the embedment of the Ag atoms, and does not proceed below about 200°C. The most stable state of the Ag atoms on the outermost Si layer is in the shape of an island, both for the Si(111) surface and for the Si(111)√3-Ag surface.     

硅衬底GaN蓝色发光材料转移前后应力变化研究

利用外延片压焊和湿法腐蚀技术将硅衬底上生长的InGaN多量子阱发光二极管(LED)薄膜材料转移到了新衬底上. 研究结果表明, 转移后的LED薄膜中GaN层受到的张应力变小,InGaN层受的压应力变大. 去除转移后LED薄膜中过渡层后,GaN层受到的张应力变大,而铟镓氮层受到的压应力基本不变. 将转移后的薄膜做成垂直结构的LED芯片后,其光电性能明显改善. 关键词： GaN 发光二极管 硅衬底 应力     

ZnO nanorods–polymer hybrid white light emitting diode grown on a disposable paper substrate

We demonstrate intrinsic white light emission from hybrid light emitting diodes fabricated using an inorganic–organic hybrid junction grown at 50 °C on a paper substrate. Cyclotene was first spin coated on the entire substrate to act as a surface barrier layer for water and other nutrient solutions. The active area of the fabricated light emitting diode (LED) consists of zinc oxide nanorods (ZnO NRs) and a poly(9,9‐dioctylfluorene) (PFO) conducting polymer layer. The fabricated LED shows clear rectifying behavior and a broad band electroluminescence (EL) peak covering the whole visible spectrum range from 420 nm to 780 nm. The color rendering index (CRI) was calculated to be 94 and the correlated color temperature (CCT) of the LED was 3660 K. The low process temperature and procedure in this work enables the use of paper substrate for the fabrication of low cost ZnO–polymer white LEDs for applications requiring flexible/disposable electronic devices. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

刻蚀AlN缓冲层对硅衬底N极性n-GaN表面粗化的影响

研究了等离子体刻蚀AlN缓冲层对硅衬底N极性n-GaN表面粗化行为的影响. 实验结果表明, 表面AlN缓冲层的状态对N极性n-GaN的粗化行为影响很大, 采用等离子体刻蚀去除一部分表面AlN缓冲层即可以有效提高N极性n-GaN在KOH溶液中的粗化效果, AlN缓冲层未经任何刻蚀处理的样品粗化速度过慢, 被刻蚀完全去除AlN缓冲层的样品容易出现粗化过头的现象. 经X射线光电子能谱分析可知, 等离子体刻蚀能够提高样品表面AlN缓冲层Al 2p的电子结合能, 使得样品表面费米能级向导带底靠近, 原子含量测试表明样品表面产生了大量的N空位, N空位提供电子, 使得材料表面费米能级升高, 这降低了KOH溶液和样品表面之间的肖特基势垒, 从而有利于表面粗化的进行. 通过等离子体刻蚀掉表面部分AlN缓冲层, 改善了N极性n-GaN在KOH溶液中的粗化效果, 明显提升了对应发光二级管器件的出光功率.     

硅衬底GaN基LED N极性n型欧姆接触研究

在Si衬底GaN基垂直结构LED的N极性n型面上,利用电子束蒸发的方法制作了Ti/Al电极,通过了I-V曲线研究了有无AlN缓冲层对这种芯片欧姆接触的影响.结果显示,去除AlN缓冲层后的N极性n型面与Ti/Al电极在500到600 ℃范围内退火才能形成欧姆接触.而保留AlN缓冲层的N极性n型面与Ti/Al电极未退火时就表现为较好的欧姆接触,比接触电阻率为2×10^-5 Ω·cm²,即使退火温度升高至600 ℃,也始终保持着欧姆接触特性.因此,AlN缓冲层的存在是Si衬底GaN基垂直结构LED获得高热稳定性n型欧姆接触的关键. 关键词： 硅衬底 N极性 AlN缓冲层 欧姆接触     

Investigating <Superscript>64</Superscript>Zn<Superscript>+</Superscript> ion-doped silicon under conditions of hot implantation

The results from visualizing the structure and identifying the composition of surface and the nearsurface layers of CZ n-Si (100) implanted by ⁶⁴Zn⁺ ions with dose of 5 × 10¹⁶ cm^–2 and energy of 50 keV under conditions of a substrate heated to 350°C are presented. It is found that there is no Si amorphization after Zn implantation, and only one layer 200 nm thick forms and is damaged because of radiation-induced defects. Zn nanoparticles 10–100 nm in size are found on a sample’s surface and in its near-surface layer. Computer analysis and mapping of the elemental and phase composition of FIB crater walls and the surface show that the main elements (54%) in the sample near-surface layer are Si, O, and Zn. The presence of ZnO phase is recorded to a depth of 20 nm in the sample.     

Role of ion energy flux on the structural and morphological properties of silicon oxy-nitride composite films deposited by plasma focus device

ABSTRACT

Crystalline silicon oxy-nitride (SiON) composite films are deposited on Si substrate for multiple (5, 15, 25 and 50) focus shots (FS) by plasma focus device. The X-rays diffraction patterns reveal the development of various diffraction peaks related to Si, Si₃N₄, and SiO₂ phases which confirms the formation of SiON composite film. The intensity of Si₃N₄ (1 0 2) plane is linearly increased with the increase of FS. The Si₃N₄ (1 0 2) phase does not nucleate for 5 FS. Raman analysis confirms the formation of β–Si–N phase. Raman and Fourier transform infrared spectroscopy analysis reveals that the strength of chemical bonds like Si–N, Si–O formed during the deposition process of SiON composite films is associated with the bonds intensity which in turn depends on the number of FS. The field emission scanning electron microscopic analysis reveals that the surface morphology like size, shape and distribution of micro/nano-dimensional particles, film compactness and the formation of micro-rods, micro-teethes and micro-tubes of SiON composite films is entirely associated with the rise in substrate surface transient temperature which in turn depends on the increasing number of FS. The EDX spectrum confirms the presence of Si (22.5?±?4.7 at. %), N (13.4?±?4.5 at. %) and O (54.7?±?11.3 at. %) in the SiON composite film. The thickness of SiON composite film deposited for 50 FS is found to ～15.47?µm.     

硅衬底氮化镓基LED薄膜转移至柔性黏结层基板后其应力及发光性能变化的研究

本文将硅(Si)衬底上外延生长的氮化镓(GaN)基发光二极管(LED)薄膜转移至含有柔性黏结层的基板上, 获得了不受衬底和支撑基板束缚的LED薄膜. 利用高分辨率X射线衍射仪(HRXRD)研究了薄膜转移前后的应力变化, 同时对其光致发光(PL)光谱的特性进行了研究. 结果表明: 硅衬底GaN基LED薄膜转移至柔性基板后, GaN受到的应力会由转移前巨大的张应力变为转移后微小的压应力, InGaN/GaN量子阱受到的压应力则增大; 尽管LED薄膜室温无损转移至柔性基板其InGaN阱层的In组分不会改变, 然而按照HRXRD倒易空间图谱通用计算方法会得出平均铟组发生了变化; GaN基LED薄膜从外延片转移至柔性基板时其PL谱会发生明显红移.