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Electro‐Physical Properties of Gate‐Last Silicon MOSFETs with Low‐Temperature SiOxNy/HfOx Stack After Ultra‐Shallow Fluorine Implantation from RF Plasma
Authors:Robert Mroczyński  Jakub Jasiński
Affiliation:Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 00‐662 Warsaw, Poland
Abstract:
Keywords:electrical characterization  fluorine implantation  high‐k dielectrics  MOSFETs  PECVD  reactive magnetron sputtering
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