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环形磁控溅射成膜生长速率及厚度均匀性研究
引用本文:孟宪权,任大志,郭怀喜,范湘军.环形磁控溅射成膜生长速率及厚度均匀性研究[J].武汉大学学报(理学版),1995(3).
作者姓名:孟宪权  任大志  郭怀喜  范湘军
作者单位:武汉大学物理学系
摘    要:对目前广泛用于制备高Tc(转变温度)超导薄膜的环形磁控溅射成膜提出了一种新的理论模型,采用泰勒展开计算出了三阶近似的解析结果.通过计算机作出了薄膜生长速率及厚度均匀性随薄膜位置变化关系的三维曲线,得到了生长大面积均匀薄膜、快速生长薄膜的最佳位置,并同使用较广泛的平面磁控溅射的一些计算结果进行了比较.

关 键 词:环形磁控溅射,生长速率,膜厚均匀性

CALCULATION OF GROWTH RATE AND THICKNESS UNIFORMITY OF THE FILM DEPOSITED BY CATHODE HOLLOW MAGNETRON SPUTTERING
Meng Xianquan,Ren Dazhi,Guo Huaixi,Fan Xiangjun.CALCULATION OF GROWTH RATE AND THICKNESS UNIFORMITY OF THE FILM DEPOSITED BY CATHODE HOLLOW MAGNETRON SPUTTERING[J].JOurnal of Wuhan University:Natural Science Edition,1995(3).
Authors:Meng Xianquan  Ren Dazhi  Guo Huaixi  Fan Xiangjun
Abstract:This paper presents a new type calculation theory of the film deposited by cathode hollow magnetron sputtering method which has been used to prepare HSTC films recently.The third degree approximate calculatoin result was obtained by Taylor series method.SURF curves of film growth rate and thickness uniformity vs. its position were drawn by a computer. The optimum positions of prepareing large area uniform films and high speed growthing films are then clear. At last we compared the conclusions to planar magnetron sputtering calculation.
Keywords:cathode hollow magnetron sputtering  growth rate  film thickness uniformity
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