| 转印头在受压下的塌陷(英文) |
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| 引用本文： | 吴坚,黄克智,黄永刚.转印头在受压下的塌陷(英文)[J].宁波大学学报(理工版),2012(1):74-77. |
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| 作者姓名： | 吴坚 黄克智 黄永刚 |
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| 作者单位： | 清华大学工程力学系教育部应用力学重点实验室;西北大学土木环境工程与机械工程系 |
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| 基金项目： | Supported by the National Natural Science Foundation of China(11032001,11172146);Russian Foundation for Basic Research(11-01-91217) |
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| 摘 要： | 可逆粘附是转移印刷中转印头重要的特性,在最近的实验中通过控制接触面实现可逆粘附.通过外加压力控制转印头的塌陷和其与基体的接触面使界面的粘附力达到3个量级的转换.建立的力学模型研究了在外压作用下转印头的塌陷和接触面积,接触面积与外压及长高比的关系对转印头的设计很有帮助.
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| 关 键 词： | 顶部塌陷 粘附 转移印刷 |
Stamp Collapse under Compression |
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| WU Jian,HUANG Ke-zhi,HUANG Yong-gang.Stamp Collapse under Compression[J].Journal of Ningbo University(Natural Science and Engineering Edition),2012(1):74-77. |
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| Authors: | WU Jian HUANG Ke-zhi HUANG Yong-gang |
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| Institution: | 1.AML,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China;2.Department of Civil and Environmental Engineering and Department of Mechanical Engineering,Northwestern University,Evanston 60208,USA) |
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| Abstract: | Reversible adhesion is an important feature of stamp for transferring printing,and it is realized in recent experiments by controlling the contact area.Compression leads to stamp collapse,and controls the contact area to change the adhesion strength by 3 orders of magnitude.Mechanics models are developed to determine the stamp collapse and contact area under compression.The contact area for the external load and aspect ratio are obtained,and the finding is very useful for stamp design. |
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| Keywords: | roof collapse adhesion transfer printing |
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