A complete dissolution procedure for SnPb solders using nitric and hydrochloric acids with simultaneous determination of major and trace elements by ICP/OES

A complete and fast dissolution procedure for tin and lead based solders is described. Trace and major elemental concentrations are determined by inductively coupled argon plasma emission (ICP) spectroscopy. One gram solder samples in the concentration range of 40-63 wt % tin are completely dissolved using nitric and hydrochloric acids. ICP analyses of certified reference materials prepared by this dissolution method are reported and compared to reference values. Based on comparison, the sample preparation method discussed is successful for quantitative analysis of trace and major elements in tin-lead solders.