Microfluidic chip fabrication using hot embossing and thermal bonding of COP |
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| Authors: | Boe‐Yu Pemg Chih‐Wei Wu Yung‐Kang Shen Yi Lin |
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| Institution: | 1. Department of Dentistry, Taipei Medical University Hospital, Taipei 110, Taiwan, ROC;2. Department of Mechanical and Mechatronic Engineering, National Taiwan Ocean University, Keelung 234, Taiwan, ROC;3. School of Dental Technology, Taipei Medical University, Taipei 110, Taiwan, ROC;4. Department of Business Administration, Takming University of Science and Technology, Taipei 104, Taiwan, ROC |
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| Abstract: | The application of silicon mold inserts by micro‐hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU‐8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU‐8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro‐hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de‐molding temperature) for the cycle‐olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De‐molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip. Copyright © 2009 John Wiley & Sons, Ltd. |
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| Keywords: | microfluidic chip surface roughness bonding strength replication EDS |
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