Reliability of flexible electrically conductive adhesives |
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| Authors: | Hui‐wang Cui Dong‐sheng Li Qiong Fan |
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| Institution: | 1. Key State Laboratory for New Displays and System Applications and SMIT Center, College of Automation and Mechanical Engineering, Shanghai University, , Shanghai, 200072 China;2. Department of Material and Optoelectronic Science, National Sun Yat‐Sen University, , 804 Kaohsiung, Taiwan, China |
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| Abstract: | Based on our previous work about electrically conductive adhesives (ECAs), a flexibilizer named 1,3‐propanediol bis (4‐aminobenzoate) was used to fabricate flexible ECAs (FECAs). ECAs, FECAs, and electronic devices connected by them were carried out the hot and humid aging test under constant humidity level of 85% relative humidity at 85 °C for 600 h. After aging, the bulk resistance change of ECAs was about 26%, that of FECAs was a little higher, about 29%. The contact resistance change of devices connected by ECAs and FECAs was very great, about 450% and 410%, respectively. The bonding area at connection interface between colloids and devices had delamination, even cracks. The delamination of ECAs was calculated about 60%, the average shear strength of ECAs was reduced about 45%, and those of FECAs were about 50% and 30%, respectively, so FECAs had a higher bonding stability in hot and humid environment. Copyright © 2012 John Wiley & Sons, Ltd. |
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| Keywords: | electronic materials electrical properties mechanical properties thermal properties |
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