Preparation of porous polyimide/in‐situ reduced graphene oxide composite films for electromagnetic interference shielding

Herein we report an easy and efficient approach to prepare lightweight porous polyimide (PI)/reduced graphene oxide (RGO) composite films. First, porous poly (amic acid) (PAA)/graphene oxide (GO) composite films were prepared via non‐solvent induced phase separation (NIPS) process. Afterwards PAA was converted into PI through thermal imidization and simultaneously GO dispersed in PAA matrix was in situ thermally reduced to RGO. The GO undergoing the same thermal treatment process as thermal imidization was characterized with thermogravimetric analysis, Raman spectra, X‐ray photoelectron spectroscopy and X‐ray diffraction to demonstrate that GO was in situ reduced during thermal imidization process. The resultant porous PI/RGO composite film (500‐µm thickness), which was prepared from pristine PAA/GO composite with 8 wt% GO, exhibited effective electrical conductivity of 0.015 S m^?1 and excellent specific shielding efficiency value of 693 dB cm² g^?1. In addition, the thermal stability of the porous PI/RGO composite films was also dramatically enhanced. Compared with that of porous PI film, the 5% weight loss temperature of the composite film mentioned above was improved from 525°C to 538°C. Moreover, tensile test showed that the composite film mentioned above possessed a tensile strength of 6.97 MPa and Young's modulus of 545 MPa, respectively. Copyright © 2016 John Wiley & Sons, Ltd.