二元羧酸半酯与环氧化合物反应动力学研究

用于印制电路板 ( PCB)的传统的热固化或光固化阻焊油墨是利用屏印的方法把图案印刷在覆铜板上 ,然后固化 .通过这种方法得到的图案不够精细 ,应用上也受到一定限制 .为此 ,近年来国际上研制出一类新型的阻焊油墨——碱液显影型阻焊油墨 1～ 3] .它是通过曝光、显影及后固化等步骤形成精确的图案 ,可用于制备高密度的电路板 .通常 ,碱水显影型阻焊油墨由碱溶性光敏树脂 (组分 A)、环氧化合物 (组分 B)、光引发剂、热固化剂和稀释剂组成 .组分 A由二元羧酸与含有光聚合性双键的线性酚醛型环氧化合物通过半酯化反应得到 ,羧基的引入使其具…

Kinetics of Reactions Between Dibasic Acid Half-ester With Epoxy Compound

The kinetic behavior of reaction of dibasic acid half ester with epoxy compound, which is one of the key reaction occurring in the technology of liquid alkali developing type solder resists, was investigated in this paper, by using the monomethyl esters of maleic acid, succinic acid, phthalic acid, cis 1,2,3,6 tetrahydrophthalic acid and cis hexahydrophthalic acid as model compounds. It was found that for the reaction catalyzed by tetramethyl ammonium bromide(TMAB), the reaction order for dibasic acid half ester and for PGE is 0 5 and 1 respectively when the dibasic acid monomethyl esters with a smaller size and/or with a stronger acitity were used, while it is 0 and 1 respectively when the dibasic acid monomethyl esters with a larger size and a weeker acitity were used. The reaction mechanism has also been discussed, from which a rate equation has been obtained which is in agreement with the experiment results.