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潜伏性热释放型微胶囊固化剂2苯基咪唑-聚甲基丙烯酸缩水甘油酯的结构表征与性能研究
引用本文:史有强,张秋禹,马爱洁,尹常杰.潜伏性热释放型微胶囊固化剂2苯基咪唑-聚甲基丙烯酸缩水甘油酯的结构表征与性能研究[J].化学通报,2012(3):245-250.
作者姓名:史有强  张秋禹  马爱洁  尹常杰
作者单位:西北工业大学理学院
基金项目:国家自然科学基金项目(50773063);国家973计划项目(2010CB635111);西北工业大学基础研究基金项目(G9KY1020)资助
摘    要:以2-苯基咪唑(2PZ)为芯材,聚甲基丙烯酸缩水甘油酯(PGMA)为壁材,采用溶剂挥发技术,成功地制备了一种新型潜伏性热释放型微胶囊固化剂2PZ-PGMA。通过FT-IR、TGA、SEM、粒度分析和DSC对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征。所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径为约17.6μm,壁材厚度为约1.1μm,芯材2PZ含量为20.1(wt)%。由微胶囊固化剂与环氧树脂E-51制备的单组分胶粘剂,具有优良的固化特性、潜伏性能和粘接性能,可在100℃下30min内实现固化,室温储存期达33d以上,拉伸剪切强度达15.36MPa。

关 键 词:微胶囊  潜伏性固化剂  单组分胶粘剂  溶剂挥发法

Preparation and Performance Study of Heat Released Microcapsule-type Latent Curing Agent 2PZ-PGMA
Shi Youqiang,Zhang Qiuyu,Ma Aijie,Yin Changjie.Preparation and Performance Study of Heat Released Microcapsule-type Latent Curing Agent 2PZ-PGMA[J].Chemistry,2012(3):245-250.
Authors:Shi Youqiang  Zhang Qiuyu  Ma Aijie  Yin Changjie
Institution:(Department of Applied Chemistry,School of Science,Northwestern Polytechnical University,Xi’an 710072)
Abstract:A novel heat released microcapsule-type latent curing agent was successfully prepared by solvent evaporation technique with 2-phenylimidazole(2PZ) as core material and polyglycidyl methacrylete(PGMA) as wall material.The chemical structure,core material content,surface morphology,size distribution and curing characteristics of as-prepared microcapsule-type curing agent were characterized by FT-IR,TGA,SEM,granulometer and DSC.The microcapsules had a smooth surface and displayed a narrow size distribution with the mean size of 17.6μm,and their wall thickness was about 1.1μm with core material content about 20.1(wt)%.In addition,the one-component adhesive made from the microcapsules and epoxy resin E-51 showed advanced curing characteristics,latent properties and bonding performance.The E-51/PGMA microcapsule system can be cured at 100℃ in 30min and its shelf life at room temperature is more than 33 days with its tensile shear strength about 15.36MPa.
Keywords:Microcapsule  Latent curing agent  One-component adhesive  Solvent evaporation method
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