Three dimensional micromachining on aluminum surface by electrochemical wet stamping technique |
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| Institution: | 1. School of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330034, China;2. State Key Laboratory for Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China;3. State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;1. Faculty of Mechanical Engineering, Institute of Machine and Industrial Design, Brno University of Technology, Technická 2896/2, 616 69 Brno, Czech Republic;2. Orthopaedic Clinic, University Hospital Olomouc, I. P. Pavlova 6, 775 20 Olomouc, Czech Republic |
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| Abstract: | We proposed an up–down working mode of electrochemical wet stamping technique (EC-WETS) for three dimensional (3D) micromachining on aluminum (Al) surface. 3D microstructures on a Si mold were transferred on to an agarose hydrogel containing 15% NaNO3, 2% MgF2, 1% NaOH and 5% glycerin, which acted as the quasi-solid electrolyte for the electrochemical micromachining. The transferred 3D microstructures on agarose hydrogel were then duplicated onto Al surface through anodic dissolution. The micromachining quality was improved by pulse-potential method dramatically with a machining tolerance lower than 200 nm and an average removal rate of 210 nm min− 1 in the Z direction. This method was proved to be a highly efficient, low cost and green method for 3D micromachining on active metal surface, which would be valuable for the manufacture of microelectromechanical system (MEMS). |
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