| (110)晶面全择优取向Cu镀层的制备及其条件优化 |
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| 引用本文： | 辜敏,鲜晓红.(110)晶面全择优取向Cu镀层的制备及其条件优化[J].物理化学学报,2006,22(3):378-382. |
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| 作者姓名： | 辜敏 鲜晓红 |
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| 作者单位： | Key Laboratory for the Exploitation of Southwestern Resources and the Environmental Disaster Control Engineering of Education Ministry; College of Chemistry and Chemical Engineering , Chongqing University, Chongqing 400044, P. R. China |
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| 基金项目： | 重庆市科技攻关项目;重庆大学校科研和教改项目 |
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| 摘 要： | 研究了添加剂聚乙二醇(PEG)、氯离子(Cl－)和电流密度对Cu的电沉积过程的影响, 着重探讨了制备(110)晶面全择优取向Cu镀层的电沉积条件及其形成机理. 循环伏安(CV)结果表明, PEG阻化Cu的电沉积, Cl－加快Cu的电沉积速率. XRD实验结果表明, PEG和Cl－在一定浓度范围有利于(110)晶面择优取向; 这两种不同特性的添加剂的协同作用可以制得(110)晶面全择优取向的较薄的Cu镀层; 所制备的全择优Cu镀层较稳定. 全择优取向Cu镀层形成的机理在于PEG和Cl－吸附过程联合起作用, 在不同晶粒的不同晶面进行选择吸附, 改变了晶面的生长速率及晶粒的快生长方向.
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| 关 键 词： | 电沉积 Cu镀层 全择优取向 微观应力 |
| 收稿时间： | 2005-07-14 |
| 修稿时间： | 2005-11-03 |
The Preparation of Copper Electrodeposits with (110) Lattice Plane Fully Preferred Orientation |
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| GU,Min,XIAN,Xiao-Hong.The Preparation of Copper Electrodeposits with (110) Lattice Plane Fully Preferred Orientation[J].Acta Physico-Chimica Sinica,2006,22(3):378-382. |
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| Authors: | GU Min XIAN Xiao-Hong |
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| Institution: | Key Laboratory for the Exploitation of Southwestern Resources and the Environmental Disaster Control Engineering of Education Ministry; College of Chemistry and Chemical Engineering , Chongqing University, Chongqing 400044, P. R. China |
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| Abstract: | The electrodeposition conditions for the preparation of copper deposits with fully preferred orientation were investigated in detail. XRD results of copper electrodeposits showed that texture with (110) could be improved by either polyethylene glycol (PEG) or chloride ions. However, the presence of the both additives resulted in a fully preferred orientation of (110) plane because of the strong synergistic effect between PEG and Cl-. The strong adsorption of PEG and Cl- on different lattice planes of different grains was thought to be responsible for the preferential growth. The microstress of the copper deposits with fully preferred orientation was small which indicated that the deposits were stable. The influence of PEG and Cl- on the copper electrodeposition had also been studied. |
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| Keywords: | Electrodeposition Copper electrodeposits Fully preferred orientation Microstress |
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