Curing
of a phenol–formaldehyde–tannin adhesive in the presence of wood |
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| Authors: | G Vázquez J González-Álvarez G Antorrena |
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| Institution: | 1. Department of Chemical
Engineering, University of Santiago de Compostela, School
of Engineering, Santiago de Compostela, Spain, 15782
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| Abstract: | The
curing of a phenol–formaldehyde–tannin (PFT) adhesive in the presence
of pine or eucalyptus wood has been studied using differential scanning calorimetry.
The influence of the adhesive/wood ratio on the activation energy (Ea), the temperature of the
maximum of the exothermic peak (Tp)
and the enthalpy of the curing process (ΔH)
was analysed. Ea, Tp and ΔH
of the curing reaction decreased when wood was added in the curing system.
The adhesive/wood interaction did not depend significantly on wood species. |
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| Keywords: | |
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