| 基于SEM的MLCC端电极焊接失效分析 |
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| 引用本文： | 庄立波,包生祥,汪蓉,张琳.基于SEM的MLCC端电极焊接失效分析[J].分析测试技术与仪器,2009,15(1). |
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| 作者姓名： | 庄立波 包生祥 汪蓉 张琳 |
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| 作者单位： | 1. 电子科技大学,电子薄膜与集成器件国家重点实验室,四川,成都,610054
2. 成都宏明电子科大,新材料有限公司,四川,成都,610058 |
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| 摘 要： | 针对多层陶瓷电容器端电极锡镀层的可焊性失效问题,运用扫描电子显微镜(SEM)分析了锡镀层的微观结构,并用能谱仪对其进行成分分析,找出了失效的主要原因:可焊性变差样品的端电极表面锡镀层出现因氧化产生的异常区域,以至于器件的可焊性变差.并通过后期的可焊性实验验证了分析的结果,找出了端电极焊接失效的原因,并提出了应对端电极氧化问题的改进措施.根据分析提出了改进意见,较好地解决了器件的焊接失效问题.
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| 关 键 词： | 锡镀层 微观结构 氧化 |
Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM |
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| ZHUANG Li-bo,BAO Sheng-xiang,WANG Rong,ZHANG Lin.Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM[J].Analysis and Testing Technology and Instruments,2009,15(1). |
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| Authors: | ZHUANG Li-bo BAO Sheng-xiang WANG Rong ZHANG Lin |
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| Institution: | 1.State Key Laboratory of Electronic Thin Films and Integrated Devices;University of Electronic Science and Technology;Chengdu 610054;2.Chengdu Hongming UESTC New Material Co Ltd;Chengdu 610058;China |
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| Abstract: | Aimed at the problem of welding failure of tin-coating in multilayer ceramic capacitors devices,we studied the microstructure and components of tin-coating with SEM and EDS.The welding failure modes occurred in the outer-electrode are demonstrated and the reason of failure are discussed.The results show that some abnormal regions on the tin-coating of samples with welding problem are produced by oxidation.The strict solderability test has verified the results of the analysis and according to the analysis im... |
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| Keywords: | MLCC |
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