纳米二氧化硅对镍电沉积影响及在复合镀层中的化学键合状态

用线性扫描伏安法和电位阶跃法研究了n-SiO2/Ni复合电刷镀体系的电化学响应，探讨了纳米颗粒的影响；用X射线光电子谱研究了复合镀层中n-SiO2/Ni颗粒表面与基质金属间的相互作用．结果表明纳米颗粒使金属沉积过电位显著降低，电流效率、金属成核率及晶体生长速度增加，纳米颗粒对金属镍电结晶有明显的催化效应；n-SiO2/Ni表面氧的不饱和化学键与表面扩散过程中吸附态金属Ni原子键合形成Ni-O键，纳米颗粒与基质镍以化学键方式结合．

Effect of n-SiO2 on Electrodeposition of Nickel and Chemical Bonding Interaction between Nanoparticles and Matrix Metal in the Composite Coating

The electrochemical response from n-SiO_2/Ni composite brush plating system was researched by means of cyclicvoltammetry and potential step. The interaction between nanoparticles and matrix metal nickel was investigated by X-ray photoelectron spectrometry. The results show that nanoparticles lead to increasing of the current efficiency, ratio of nucleation and crystal growth rate as well as decreasing of overpotential. Nanoparticles can catalyze the nickel electrodeposition and reduce the size of metal crystal. As the nickel atoms reduced on cathode are diffusing on the metal growth surface, the unsaturated bond of oxygen atoms on nanoparticle surface can capture some of the absorbed nickel atoms and form nickel-oxygen chemical bond. It is proved that the chemical bonding interaction exists on the interface between nanoparticle surface and matrix metal nickel.