| 分子结构对硫脲类化合物在铜表面自组装能力的影响 |
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| 引用本文： | 王春涛,陈慎豪.分子结构对硫脲类化合物在铜表面自组装能力的影响[J].化学学报,2007,65(5):390-394. |
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| 作者姓名： | 王春涛 陈慎豪 |
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| 作者单位： | (1太原师范学院化学系 太原 030031)(2山东大学化学与化工学院 济南 250100) |
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| 基金项目： | 山西省教育厅高校科技开发资助项目(No.20061039). |
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| 摘 要： | 利用电化学阻抗谱和极化曲线研究了硫脲、烯丙基硫脲、苯基硫脲在金属铜表面上的自组装膜的质量和缓蚀效率, 并通过量子化学计算进一步研究了各种分子和金属铜的相互作用. 结果表明硫脲类分子在金属铜表面上的成膜能力顺序为: 苯基硫脲＞烯丙基硫脲＞硫脲, 并揭示了分子结构对硫脲类化合物在金属铜表面自组装影响的本质, 为进一步寻找和制备优良的缓蚀功能自组装膜提供理论依据.
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| 关 键 词： | 硫脲 自组装 缓蚀 |
| 收稿时间： | 2006-3-30 |
| 修稿时间： | 2006-03-302006-11-08 |
Influence of Thiourea Molecular Structure on Its Self-assembled Ability onto Copper Surface |
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| WANG Chun-Tao,CHEN Shen-Hao.Influence of Thiourea Molecular Structure on Its Self-assembled Ability onto Copper Surface[J].Acta Chimica Sinica,2007,65(5):390-394. |
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| Authors: | WANG Chun-Tao CHEN Shen-Hao |
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| Institution: | (1 Department of Chemistry, Taiyuan Normal College, Taiyuan 030031)(2 School of Chemistry and Chemical Engineering, Shandong University, Jinan 250100) |
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| Abstract: | The quality and inhibition efficiency of thiourea (TU), allylthiourea (AT) and phenylthiourea (PT) self-assembled films were studied by electrochemical impedance spectroscopy and polarization curves, respectively. Quantum chemical calculations were performed to investigate interactions between copper and thioureas. The self-assembled ability order of thioureas onto copper was obtained, which is PT>A>TU. The structural essential of thioureas self-assembled on copper was revealed, which can provide a theoretical basis for looking for and preparing more inhibitive self-assembled films. |
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| Keywords: | thiourea self-assembly inhibition |
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