烯丙基硫脲和十二烷基硫醇对铜的缓蚀作用

用自组装技术在铜电极表面上制备了纯烯丙基硫服自组装膜，并以十二烷基硫 醇进一步修饰得到混合自组装膜。最后，将混合膜覆盖的铜电极浸入NaCl溶液中， 进行交流电处理，电化学交流阻抗谱和极化曲线测定表明，经过交流电处理后，在 0．5mol·dm^-3 NaCl溶液中，电荷传递电阻增大，腐蚀电流密度下降，膜的最大 覆盖度为98．6％，对金属铜腐蚀的续蚀效率为98．5％。而且，不论交流电处理与 否，混合自组装膜在较宽的电极电位范围内均表现出很强的稳定性。

Inhibition Effect of Allylthiourea and 1-Dodecanethiol on Copper Corrosion

Self-assembled monolayer of allylthiourea (AT) was first formed on copper surface. 1-Dodecanethiol (DT) was then self-assembled on the surface for subsequent modification. Finally, AC voltage was loaded on copper covered with the mixed film for further improvement. After these processes, an effective inhibition film was obtained as indicated by the high charge-transfer resistance shown in electrochemical impedance spectroscopy and low corrosion current density in polarization curves. The maximum coverage and inhibition efficiency for copper corrosion was 98.6% and 98.5%, respectively. The mixed film was stable in a wide range of potential before and after AC voltage treatment.