插层聚合制备粘土/环氧树脂纳米复合材料过程中粘土剥离行为的研究

用ＸＲＤ、ＤＳＣ 等手段研究了有机蒙脱土在环氧树脂中的插层与剥离行为，证明环氧树脂容易插层到粘土片层间，形成稳定的插层混合物，加入胺固化剂固化后，粘土被剥离而得到剥离型纳米复合材料，剥离程度与所采用的固化温度关系不大，主要取决于固化程度，全部剥离的时间与环氧树脂凝胶的时间接近．

STUDY ON INTERCALATION AND EXFOLIATION BEHAVIOR OF EPOXY RESIN IN ORGANOCLAY

The intercalation and exfoliation behaviour of epoxy resin in an organoclay have been investigated by XRD and DSC methods. It was found that the affinity between the organoclay and epoxy resin was very good and the organoclay was easy to be intercalated by epoxy resin with or without solvent. By direct or solution mixing a stable and homogeneous clay/epoxy intercalated hybrid could be obtained in which the layer spacing of the organoclay was about 3 7nm. At the curing temperature ranging from 80℃ to 160℃ the organoclay was ready to be exfoliated during curing process of the resin and exfoliated nanocomposite could be achieved. It was found that completed exfoliation of the clay could be reached, while the curing degree of the resin was only about 10%. The experiments conducted at 80℃,100℃,120℃ and 150℃ indicated that the time at which complete exfoliation occurred was near to the gelting time of the epoxy resin, meaning that that exfoliation of the clay was dependent on the curing process.