| 搅拌条件下电流密度对Cu镀层的结构和表面形貌的影响 |
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| 引用本文： | 辜敏,黄令,杨防祖,姚士冰,周绍民.搅拌条件下电流密度对Cu镀层的结构和表面形貌的影响[J].应用化学,2002,19(3):280-284. |
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| 作者姓名： | 辜敏 黄令 杨防祖 姚士冰 周绍民 |
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| 作者单位： | 汕头大学，厦门大学 |
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| 基金项目： | 国家自然科学基金 (2 0 0 73 0 3 7)，优秀国家重点实验室基金 (2 0 0 2 3 0 0 1)资助项目 |
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| 摘 要： | 电沉积;晶体取向;搅拌条件下电流密度对Cu镀层的结构和表面形貌的影响
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| 关 键 词： | 电沉积 晶体取向 搅拌条件下电流密度对Cu镀层的结构和表面形貌的影响 |
| 文章编号： | 1000-0518(2002)03-0280-05 |
| 收稿时间： | 2009-06-29 |
| 修稿时间： | 2001年8月8日 |
Effects of Current Density and Bath Agitation on the Surface Morphology and Texture of Cu Electrodeposits |
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| GU Min a,b ,HUANG Ling b,YANG Fang Zu b,YAO Shi Bing b,ZHOU Shao Min b.Effects of Current Density and Bath Agitation on the Surface Morphology and Texture of Cu Electrodeposits[J].Chinese Journal of Applied Chemistry,2002,19(3):280-284. |
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| Authors: | GU Min a b HUANG Ling b YANG Fang Zu b YAO Shi Bing b ZHOU Shao Min b |
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| Institution: | GU Min a,b *,HUANG Ling b,YANG Fang Zu b,YAO Shi Bing b,ZHOU Shao Min b |
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| Abstract: | The texture and surface morphology of Cu electrodeposited on stainless steel at different current densities from H 2SO 4+CuSO 4 electrolyte solution under unstirring, mechanical agitation and air agitation condition have been studied by means of XRD and SEM technique. The results showed that the surface morphology and crystal orientation of Cu electrodeposits varied mainly with the current density used in deposition: at c.d. <6 0 A/dm 2 (110) orientation was found to be favorable. When c.d. >15 0 A/dm 2, (111) orientation was preferred, and no obvious crystal orientation was observed at medium current density. Increase in current densities made the Cu electro crystallization varied from lateral to outward growth modes. |
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| Keywords: | electrodeposition Cu deposit crystal orientation surface morphology |
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