| 聚异酰亚胺树脂合成条件的优化 |
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| 引用本文： | 杨秀云,崔婷婷,李云辉,孟祥胜,杨慧丽,范卫锋,刘敬峰,王震.聚异酰亚胺树脂合成条件的优化[J].应用化学,2012,29(8):868-872. |
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| 作者姓名： | 杨秀云 崔婷婷 李云辉 孟祥胜 杨慧丽 范卫锋 刘敬峰 王震 |
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| 作者单位： | (1.长春理工大学化学与环境工程学院 长春 130022；;
2.中国科学院长春应用化学研究所高分子复合材料工程实验室 长春 130022) |
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| 基金项目： | 国家自然科学基金资助项目(51173178);国家“九七三”项目(2010CB631100) |
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| 摘 要： | 采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂,探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(PⅠ)的熔体粘度及溶解性的影响。结果表明,不同处理温度对PⅡ的熔体黏度影响不大,但对溶解性有一定的影响,PⅡ在NMP和THF中具有良好的溶解性能。在相同处理温度条件下,PⅡ的熔体黏度低于PⅠ。随处理温度的增加,PⅡ低聚物的T5%随之增加,PⅡ在110℃处理的T5%为208℃,150℃处理的T5%为323℃,180℃处理的T5%为382℃,PⅡ固化后的T5%为550℃,显示出较优异的耐热性能。
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| 关 键 词： | 聚异酰亚胺 聚酰亚胺 溶解性 黏度 |
| 收稿时间： | 2011-08-30 |
Optimizing the Synthetic Conditions of Polyisoimide Resins |
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| YANG Xiuyuna,CUI Tingtinga,LI Yunhuia,MENG Xiangshengb,YANG Huilib, FAN Weifengb,LIU Jingfengb,WANG Zhen.Optimizing the Synthetic Conditions of Polyisoimide Resins[J].Chinese Journal of Applied Chemistry,2012,29(8):868-872. |
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| Authors: | YANG Xiuyuna CUI Tingtinga LI Yunhuia MENG Xiangshengb YANG Huilib FAN Weifengb LIU Jingfengb WANG Zhen |
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| Institution: | (1.School of Chemistry and Environmental Engineering,Changchun University of Science and Technology,Changchun,China;
2.The Engineering Laboratory of Polymer Composite,Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China) |
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| Abstract: | Phenylethynyl end-capped polyisoimide oligomers were synthesized in different solvents.The effects of different treatment temperature on melting viscosity and solubility of polyisoimide(PⅡ) and its corresponding polyimide(PⅠ) resins were discussed.The results showed that the effect of treatment temperature on melting viscosity of PⅡ was marginal but conceivable on solubility.The PⅡ exhibited excellent solubility in N-methylpyrrolidone(NMP) and tetrahydrofuran(THF).The PⅡ had less melt viscosity than PⅠ at same treatment temperature.The T5% of PⅡ oligomer increased with the elevation of treatment temperature.The T5% is 208 ℃,323 ℃ and 382 ℃ when the temperature of PⅡ treatment is 110 ℃,150 ℃ and 180 ℃,respectively.While the T5% of cured PⅡ is 550 ℃ suggesting that had excellent heat resistance. |
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| Keywords: | polyisoimide polyimide solubility viscosity |
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