首页 | 本学科首页   官方微博 | 高级检索  
     检索      


Effect of acetone on mechanical properties of epoxy used for surface treatment before adhesive bonding
Institution:1. Department of Mechanical Engineering, Indian Institute of Technology (BHU), Varanasi 221005, India;2. Institute for Textile Technology and Engineering, RWTH Aachen University, Otto-Blumenthal Stresse-1, 52074 Aachen, Germany;1. Key Laboratory of Road Construction Technology and Equipment, MOE, Chang''an University, Xi''an 710064, PR China;2. School of Mechanical and Chemical Engineering, University of Western Australia, Perth, WA 6009, Australia
Abstract:A thin layer of un-cured resin over metal substrates applied by using an acetone-diluted resin solution (without hardener) has been found to be beneficial to strong adhesive bonding. The resin pre-coating (RPC) solution can effectively seal sub-surface micro-cavities and increase the substrate wettability. This study examines possible aftermath effects of the acetone dilution on mechanical properties of epoxy through comparison of samples made from as-received resin and resins diluted once and twice by acetone. RPC can be accepted with confidence in substrate pre-treatments for strong adhesive bonding if no detrimental effect on epoxy properties is observed. Fourier transform infrared spectrum (FTIR) was conducted, showing the spectrogram of the resin previously diluted by acetone was the same as that of as-received resin, i.e. no change in epoxy molecular structures after complete evaporation of acetone. Strength and modulus of elasticity measured by flexural and compressive tests were compared using samples made from as-received resin, and resins diluted once and twice by acetone. Variations among results from the three groups were less than 2%, or negligible, affirming the RPC method can be used for substrate pre-treatments and stronger adhesive bonding.
Keywords:Acetone resin solution  Resin pre-coating (RPC)  Epoxy adhesive  Surface treatment  Mechanical properties
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号