The ultratough peeling of elastic tapes from viscoelastic substrates |
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| Institution: | 1. Department of Engineering Mechanics, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou, Zhejiang 310027, China;2. International Center for Applied Mechanics, State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi''an Jiaotong University, Xi''an 710049, China;3. Department of Mechanical Engineering, The University of Hong Kong, Hong Kong, China;4. HKU-Shenzhen Institute of Research and Innovation (HKU-SIRI), Shenzhen, Guangdong, China;5. School of Engineering, Brown University, Providence, Rhode Island 02912, USA;1. Department of Mechanical Engineering, 4-225 Donadeo Innovation Centre for Engineering, 9211-116 Street NW, Edmonton, AB T6G 1H9, Canada;2. Department of Mechanical Engineering, Binghamton University, 4400 Vestal Pkwy E Binghamton, NY 13902, USA;3. Department of Mechanical Engineering, 10-203 Donadeo Innovation Centre for Engineering, 9211-116 Street NW, Edmonton, AB T6G 1H9, Canada |
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| Abstract: | The peeling of an elastic thin tape from a flat smooth viscoelastic substrate is investigated. Based on a Green function approach and on the translational invariance, a closed form analytical solution is proposed, which takes into account the viscoelastic dissipation in the substrate material.We find that peeling is prevented from taking place, only when the external force is smaller than the one predicted by Kendall's formula for elastic tapes on rigid substrates. However, we also find that, regardless of the value of the applied force, steady state detachment may occur when the elastic tape is sufficiently stiff. In this case, the constant peeling velocity can be modulated by properly defining the geometrical parameters and the material properties of tape and viscoelastic foundation. On the other hand, for relatively high peeling angles or compliant tapes a threshold value of the peeling force is found, above which the steady-state equilibrium is no longer possible and unstable detachment occurs.The present study contributes to shed light on the behavior of pressure sensitive adhesives in contact with viscoelastic substrates like the human skin. At the same time, it can be considered a first step towards a better understanding of the effect of viscoelastic dissipation on the fracture behavior of solids. |
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| Keywords: | Peeling fracture adhesion energy release rate viscoelasticity |
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